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CN-122002951-A - Transfer printing carrier plate assembly and transfer method thereof

CN122002951ACN 122002951 ACN122002951 ACN 122002951ACN-122002951-A

Abstract

The application relates to a transfer printing carrier plate assembly and a transfer method thereof. The transfer printing carrier plate assembly comprises a plurality of carrier plate bodies. In the actual transfer printing grid line and welding strip process, the transfer printing support plate assembly firstly cleans the first strip-shaped groove and the second strip-shaped groove through laser and HF, then vacuum sputtering a bottom seed layer on the inner walls of the first strip-shaped groove and the second strip-shaped groove, then electroplating a welding strip in the first strip-shaped groove, electroplating a metal grid line in the second strip-shaped groove, attaching a battery piece to the transfer printing support plate and covering the formed grid line and welding strip, integrally transferring the grid line and the welding strip to the surface of the battery piece, heating, separating the grid line and the welding strip from the support plate body, and welding the grid line and the welding strip to the surface of the battery piece, thereby completing transfer operation of the plurality of battery piece grid lines and the welding strip and improving the production efficiency of the battery piece.

Inventors

  • SHAN LINGBAO

Assignees

  • 苏州捷得宝机电设备有限公司

Dates

Publication Date
20260508
Application Date
20260211

Claims (10)

  1. 1. The transfer printing carrier plate assembly is characterized by comprising a plurality of carrier plate bodies, wherein the carrier plate bodies are arranged at intervals along a first direction; at least one side surface of the carrier plate body is provided with a groove array; The groove array comprises a first groove group and a second groove group, wherein the first groove group comprises a plurality of first strip-shaped grooves extending along a first direction, and the first strip-shaped grooves are arranged at intervals along the second direction; The second groove group comprises a plurality of second strip-shaped grooves extending along a second direction, and the second strip-shaped grooves are arranged at intervals along the first direction; the first strip-shaped groove and the second strip-shaped groove are arranged in a crossing manner; the first direction is perpendicular to the second direction.
  2. 2. The transfer printing carrier plate assembly of claim 1, wherein a first slot is provided at one end of the carrier plate body along a first direction, the first slot extends along the second direction, the first slot communicates with one of the second strip-shaped slots of the second slot group along the first direction, and one end of the first slot facing away from the second slot group is flush with an edge of the carrier plate body.
  3. 3. The transfer printing carrier assembly of claim 2, wherein a second slot is provided in an end of the bottom wall of the first slot facing away from the second slot set in the first direction, the second slot extending in the second direction, and an end of the second slot facing away from the second slot set is flush with an edge of the carrier body.
  4. 4. A transfer printing carrier plate assembly according to claim 3, wherein the processing manner of the first and second bar grooves includes, but is not limited to, performing dry etching with an ultraviolet femtosecond laser with an energy of 100mj/cm 2 ~2000mj/cm 2 for 30 s-600 s, and then etching the glass substrate with HF at 20 ℃ to 50 ℃ for 30 s-600 s, wherein the surface roughness Ra of the inner walls of the first and second grooves ranges from 50nm to 300nm.
  5. 5. A transfer method of a transfer printing carrier plate assembly, using the transfer printing carrier plate assembly of any one of claims 1-4 to transfer metal grid lines and solder strips to a battery piece, characterized in that the transfer method of the transfer printing carrier plate assembly comprises the following steps: depositing a bottom seed layer in the first and second trenches; Electroplating a metal grid line or a metal welding strip on the bottom seed layer; Attaching a plurality of battery pieces to a plurality of carrier plate bodies in a one-to-one correspondence manner, and covering the metal grid lines and the metal welding strips; Turning over the battery piece and the carrier plate body; carrying out infrared irradiation and pressurization on the carrier plate body so as to transfer and attach the metal grid lines and the metal welding strips to the battery piece; and taking down the carrier plate body from the battery piece.
  6. 6. The transfer method of a transfer printing carrier assembly of claim 5, wherein after the step of depositing a bottom seed layer in the first and second grooves, one end of a series metal sheet is attached to one end of one of the carrier bodies in a first direction, and the other end of the series metal sheet is attached to one end of an adjacent other carrier body in the first direction; And a bus bar is deposited at one end, close to the series metal sheet, along the first direction, one end of the bus bar is deposited at one side, away from the carrier plate body, of the series metal sheet, and the other end of the bus bar is deposited at the carrier plate body and connected with the metal grid line, close to the series metal sheet.
  7. 7. The transfer method of a transfer printing carrier plate assembly according to claim 5, wherein in the step of depositing a bottom seed layer in the first and second bar grooves, the carrier plate body is sent to PVD or RPD equipment for deposition, the bottom seed layer is made of one or more of gold, chrome copper, tungsten, titanium and nickel, and the deposition thickness of the bottom seed layer is 2 nm-50 nm.
  8. 8. The transfer method of claim 5, wherein in the step of electroplating metal gate lines or metal solder strips on the bottom seed layer, the carrier body after the bottom seed layer is deposited is placed into electroplating equipment to deposit nickel, copper and tin respectively, wherein the nickel deposition thickness is 0.1 um-3 um, the copper deposition thickness is 2 um-50 um, and the tin deposition thickness is 1 um-5 um.
  9. 9. The transfer method of a transfer printing carrier plate assembly of claim 5, wherein the carrier plate body is cleaned by laser and HF and the first and second bar-shaped grooves are etched prior to the bottom seed layer deposition step in the first and second bar-shaped grooves.
  10. 10. The transfer method of a transfer printing carrier assembly of claim 5, wherein the pressure of pressurizing the carrier body is 0.2Kg/cm 2 ~2Kg/cm 2 , and the duration of the infrared irradiation and pressurizing is 15 s-150 s.

Description

Transfer printing carrier plate assembly and transfer method thereof Technical Field The application relates to the technical field of photovoltaic cells, in particular to a transfer printing carrier plate assembly and a transfer method thereof. Background Surface metallization is one of the key steps of photovoltaic cell preparation, is a great difficulty in influencing the efficiency, cost and performance of the photovoltaic cell, and plays a vital role in reducing the cost and improving the efficiency of the photovoltaic cell. The metallization process is divided into contact and non-contact, the contact being different types of screen printing, the non-contact including laser printing, electroplating techniques, etc. being explored. In combination, laser printing is advantageous in terms of saving silver paste, improving efficiency, and the like. The laser printing technology uses high-energy laser to scan slurry grooves one by one or entirely, the slurry is rapidly heated and expanded to generate instant thrust, the slurry is separated from the carrier plate grooves and falls onto the battery pieces below to form uniform superfine grid lines. At present, the transfer carrier plate only relates to the pile body of a plurality of parallel grid lines, namely only sets up a plurality of parallel bar grooves on the transfer carrier plate for prefabricating the grid lines, however, most of current photovoltaic cell pieces are crossed and vertically arranged with the grid lines, or are connected with the grid lines through welding strips perpendicular to the grid lines, and the transfer carrier plate can not meet the transfer operation of carrying out the grid lines and welding strips of the whole cell piece at one time, and has lower efficiency. Disclosure of Invention Based on this, it is necessary to provide a transfer printing carrier plate assembly and a transfer method thereof, which are necessary to solve the problems that the existing photovoltaic cell is mostly crossed and vertically arranged by grid lines or the grid lines are connected by welding strips perpendicular to the grid lines, and the transfer operation of the grid lines and the welding strips of the whole photovoltaic cell cannot be performed at one time, so that the efficiency is low. The transfer printing carrier plate assembly comprises a plurality of carrier plate bodies, wherein the carrier plate bodies are arranged at intervals along a first direction, and at least one side surface of the carrier plate body is provided with a groove array; The groove array comprises a first groove group and a second groove group, wherein the first groove group comprises a plurality of first strip-shaped grooves extending along a first direction, and the first strip-shaped grooves are arranged at intervals along the second direction; The second groove group comprises a plurality of second strip-shaped grooves extending along a second direction, and the second strip-shaped grooves are arranged at intervals along the first direction; the first strip-shaped groove and the second strip-shaped groove are arranged in a crossing manner; the first direction is perpendicular to the second direction. In the actual transfer printing of the metal grid lines and the welding strips, the transfer printing support plate assembly is characterized in that the first strip-shaped groove and the second strip-shaped groove are firstly cleaned through laser and HF, then the inner walls of the first strip-shaped groove and the second strip-shaped groove are subjected to vacuum sputtering to form a bottom seed layer, then the welding strips are electroplated in the first strip-shaped groove, the metal grid lines are electroplated in the second strip-shaped groove, the battery piece is attached to the transfer printing support plate and covered with the formed metal grid lines and the welding strips, the metal grid lines and the welding strips are integrally transferred to the surface of the battery piece and heated, the metal grid lines and the welding strips are separated from the support plate body and welded to the surface of the battery piece, so that transfer operation of the metal grid lines and the welding strips of the battery piece is completed, and the production efficiency of the battery piece is improved. In one embodiment, a first groove is formed in one end of the carrier plate body along a first direction, the first groove extends along a second direction, the first groove is communicated with one second strip-shaped groove, which is close to the first groove along the first direction, of the second groove group, and one end, which is away from the second groove group, of the first groove is flush with the edge of the carrier plate body. In one embodiment, a second groove is formed in one end, away from the second groove group, of the bottom wall of the first groove along the first direction, the second groove extends along the second direction, and one end, a