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CN-122002980-A - LED light source and preparation method thereof

CN122002980ACN 122002980 ACN122002980 ACN 122002980ACN-122002980-A

Abstract

The LED light source and the preparation method thereof are beneficial to improving the utilization efficiency of the fluorescent film by cutting the whole fluorescent film adhered with the LED chips, the LED chips which are independently adhered with the fluorescent film meeting different luminous demands are directly packaged into a whole by adopting a CSP packaging technology, the LED lighting devices which can meet various luminous demands can be obtained by one-time adhesion through the surface adhesion technology, compared with the traditional step-by-step single adhesion scheme, the gap between the LED chips can be obviously reduced, the occupied area of the whole LED lighting device is beneficial to being reduced, and meanwhile, the uniform light spots can be more effectively formed during light mixing due to the reduction of the gap between the adjacent LED chips.

Inventors

  • XU HAI
  • DING JUNRONG
  • Long Huping

Assignees

  • 江西晶亮光电科技协同创新有限公司

Dates

Publication Date
20260508
Application Date
20241101

Claims (10)

  1. 1. A method of manufacturing an LED light source, comprising: providing a plurality of fluorescent films meeting different lighting requirements; The LED chips with the same luminous requirements are regularly adhered to the surface of the same fluorescent film, wherein the LED chips comprise a luminous upper surface, a chip side surface and an electrode surface opposite to the luminous upper surface, and the LED chips are adhered to the surface of the fluorescent film through the luminous upper surface; cutting each fluorescent film along the gaps between the adjacent LED chips to obtain an LED structure which comprises a preset number of LED chips and is adhered with the same fluorescent film on the surface; According to the luminous requirement of the LED light source, the LED structures stuck with different types of fluorescent films are regularly arranged on the surface of the supporting film in an electrode-up mode by taking the LED light source as a unit; Filling high-reflectivity white glue in gaps between adjacent LED chips, wherein the high-reflectivity white glue at least covers the luminous side surfaces of the LED chips and the side surfaces of the fluorescent membrane; And cutting by taking an LED light source as a unit to obtain the LED light source, and stripping the LED light source from the surface of the support film to finish the preparation of the LED light source.
  2. 2. The method for manufacturing an LED light source according to claim 1, Providing a first fluorescent film sheet and a second fluorescent film sheet with different color temperatures in the plurality of fluorescent film sheets meeting different light-emitting requirements; The LED chips with the same luminous requirements are regularly adhered to the surface of the same fluorescent film, the LED chips meeting the first luminous requirements are regularly adhered to the surface of the first fluorescent film, and the LED chips meeting the second luminous requirements are regularly adhered to the surface of the second fluorescent film; The method comprises the steps that each fluorescent film is cut along gaps between adjacent LED chips to obtain an LED structure which comprises a preset number of LED chips and is provided with the same fluorescent film on the surface, wherein the LED structure comprises a first LED structure with a first fluorescent film attached to the surface and a second LED structure with a second fluorescent film attached to the surface, and each LED structure comprises at least one LED chip meeting corresponding luminous requirements; The LED light source at least comprises a first LED structure and a second LED structure.
  3. 3. The method for manufacturing an LED light source according to claim 1, Among the plurality of fluorescent films which meet different light-emitting requirements, a third fluorescent film, a fourth fluorescent film, a fifth fluorescent film and a sixth fluorescent film with different colors are provided; The LED chips with the same light-emitting requirement are regularly adhered to the surface of the same fluorescent film, the LED chips meeting the third light-emitting requirement are regularly adhered to the surface of the third fluorescent film, the LED chips meeting the fourth light-emitting requirement are regularly adhered to the surface of the fourth fluorescent film, the LED chips meeting the fifth light-emitting requirement are regularly adhered to the surface of the fifth fluorescent film, and the LED chips meeting the sixth light-emitting requirement are regularly adhered to the surface of the sixth fluorescent film; The method comprises the steps that each fluorescent film is cut along gaps between adjacent LED chips to obtain an LED structure which comprises a preset number of LED chips and is provided with the same fluorescent film on the surface, wherein the method comprises the steps of obtaining a third LED structure with a third fluorescent film on the surface, a fourth LED structure with a fourth fluorescent film on the surface, a fifth LED structure with a fifth fluorescent film on the surface, and a sixth LED structure with a sixth fluorescent film on the surface, and each LED structure comprises at least one LED chip meeting corresponding lighting requirements; The LED light source at least comprises a third LED structure, a fourth LED structure, a fifth LED structure and a sixth LED structure.
  4. 4. A method for manufacturing an LED light source according to any one of claim 1 to 3, The LED chip is a flip blue LED chip; The LED chips with the same light-emitting requirement are regularly adhered to the surface of the same fluorescent membrane, and the inverted blue LED chips meeting the same light-emitting requirement are regularly adhered to the surface of the same fluorescent membrane.
  5. 5. A method for producing an LED light source according to claim 2 or 3, wherein, Each LED structure comprises only one LED chip; According to the luminous demands of the LED light sources, the LED structures stuck with different types of fluorescent films are regularly arranged in the surface of the supporting film in an electrode-up mode by taking one LED light source as a unit, and the fluorescent films meeting different luminous demands are stuck on the surfaces of adjacent LED chips.
  6. 6. The method for manufacturing an LED light source according to claim 3, wherein the LED light source comprises four LED chips arranged in a2 x2 manner.
  7. 7. The method of manufacturing an LED light source of claim 1 or 2 or 3 or 5, further comprising, prior to the step of providing a plurality of phosphor films meeting different lighting requirements: Uniformly mixing fluorescent powder with different colors and silica gel according to a certain proportion to obtain a mixture with a plurality of different proportions, wherein the plurality of different proportions correspond to different luminous requirements of a plurality of fluorescent films; respectively forming the mixtures corresponding to different proportions on the surface of the release film in a scraping manner to form corresponding fluorescent films; And (3) primarily curing each fluorescent film to obtain a plurality of fluorescent films corresponding to fluorescent powder with different proportions, wherein the primarily cured state is realized by reducing baking time or baking temperature corresponding to the reduction of the relative complete curing, and the surface of the fluorescent film far away from one side of the release film has adhesiveness capable of adhering an LED chip.
  8. 8. The method of claim 7, further comprising completely curing the entire fluorescent film with the plurality of LED chips adhered on the surface after the step of regularly adhering the LED chips having the same light emission requirement on the surface of the same fluorescent film.
  9. 9. An LED light source prepared by the preparation method of any one of claims 1 to 8, comprising: a plurality of LED chips, each LED chip comprising a light emitting upper face, a chip side face and an electrode face opposite to the light emitting upper face; The plurality of fluorescent films are formed on the surfaces of the LED chips and are prepared by meeting different luminous requirements; and the high-reflectivity white glue is at least arranged on the luminous side surface of the LED chip in a surrounding mode, and the high-reflectivity white glue is filled between different types of fluorescent diaphragms.
  10. 10. The LED light source of claim 9, wherein in the LED light source, each LED chip is surface-mounted with a fluorescent patch that is sufficient for one lighting requirement, and adjacent LED chips are surface-mounted with fluorescent patches that meet different lighting requirements.

Description

LED light source and preparation method thereof Technical Field The invention relates to the technical field of semiconductors, in particular to an LED light source and a preparation method thereof. Background With the increasing diversity of consumer demands, the market demand for lighting products is also increasing. The LED light source can realize wider color temperature and color adjustment range by meeting the LED combination of different luminous demands, thereby providing richer and real illumination effect to meet the individual demands under different occasions, such as a double-color temperature LED light source for a mobile phone flashlight, an LED light source with an RGBW structure for stage lighting and the like. At present, the LED light source is prepared by adopting a mode of sticking one by one, namely a plurality of LED chips which send out different luminous demands are sequentially and respectively welded to the surface of a specific area on the conductive substrate, and the mode needs to pre-package each LED chip to be stuck, so that the whole size of a packaged module is large, each LED chip is required to be accurately stuck to a designated position on the conductive substrate, the sticking precision is high, in addition, the centers of adjacent light sources are difficult to be consistent, and after a lens is added to the module, interference fringes with alternate brightness and darkness are easy to appear at a gap between the adjacent light sources. Disclosure of Invention In order to overcome the defects, the invention provides an LED light source and a preparation method thereof, which can effectively solve the technical problems of high difficulty in pasting and uneven light emission in the prior art. The technical scheme provided by the invention is as follows: In one aspect, the invention provides a method for preparing an LED light source, comprising: providing a plurality of fluorescent films meeting different lighting requirements; The LED chips with the same luminous requirements are regularly adhered to the surface of the same fluorescent film, wherein the LED chips comprise a luminous upper surface, a chip side surface and an electrode surface opposite to the luminous upper surface, and the LED chips are adhered to the surface of the fluorescent film through the luminous upper surface; cutting each fluorescent film along the gaps between the adjacent LED chips to obtain an LED structure which comprises a preset number of LED chips and is adhered with the same fluorescent film on the surface; According to the luminous requirement of the LED light source, the LED structures stuck with different types of fluorescent films are regularly arranged on the surface of the supporting film in an electrode-up mode by taking the LED light source as a unit; Filling high-reflectivity white glue in gaps between adjacent LED chips, wherein the high-reflectivity white glue at least covers the luminous side surfaces of the LED chips and the side surfaces of the fluorescent membrane; and cutting by taking an LED light source as a unit to obtain the LED light source, and finishing the preparation of the LED light source. On the other hand, the invention provides an LED light source which is prepared by the preparation method, and the LED light source comprises a plurality of LED chips, a plurality of fluorescent films formed on the surfaces of the LED chips, and high-reflectivity white glue at least surrounding the light-emitting side surfaces of the LED chips, wherein each LED chip comprises a light-emitting upper surface, a chip side surface and an electrode surface opposite to the light-emitting upper surface, the plurality of fluorescent films are prepared by meeting different light-emitting requirements, and the high-reflectivity white glue is filled between the fluorescent films of different types. According to the LED light source and the preparation method thereof, the fluorescent film is pasted by cutting the whole fluorescent film after the LED chips are adhered, so that the utilization efficiency of the fluorescent film is improved, the pasting precision of the fluorescent film can be improved, the problems that the luminous centers of the fluorescent film pasted on the surfaces of the LED chips are misplaced after the fluorescent film is cut are avoided, meanwhile, the LED chips which are independently pasted with the fluorescent films meeting different luminous demands are directly packaged into a whole by adopting a CSP packaging technology, white glue is arranged between adjacent LED chips in the LED light source, and the LED lighting device capable of meeting various luminous demands can be obtained by pasting the fluorescent film once through the surface pasting technology. Compared with the traditional scheme of mounting different LED structures one by one, the LED light source can obviously reduce the gap between the LED chips, is beneficial to reducing the occupied area