CN-122002983-A - Interposer and method for manufacturing display device using the same

Abstract

The application discloses an interposer and a method for manufacturing a display device using the same. According to one aspect of the disclosure, an interposer includes a base and a plurality of bumps spaced apart from one another on the base, and each bump of the plurality of bumps includes a sidewall extending upward from the base to define a receiving unit. Therefore, misalignment caused by temperature deviation can be reduced.

Inventors

• LI DONGXI

Assignees

• 乐金显示有限公司

Dates

Publication Date

20260508

Application Date

20250915

Priority Date

20241104

Claims (20)

1. 1. An interposer, comprising: A base, and A plurality of bumps spaced apart from one another on the base, Wherein each of the plurality of tabs includes a sidewall extending upwardly from the base to define a receiving unit.
2. 2. The interposer of claim 1, further comprising: A plurality of insulating members respectively provided in the plurality of receiving units in the plurality of bumps, Wherein the coefficient of thermal expansion of the base and the coefficient of thermal expansion of the plurality of bumps are less than the coefficient of thermal expansion of the plurality of insulating members.
3. 3. The interposer of claim 2, wherein the plurality of insulating members comprise scattering particles, light converting material, or fluorescent material.
4. 4. The interposer of claim 2, further comprising: a coating covering the sidewalls in each of the plurality of bumps and comprising one or more of Indium Tin Oxide (ITO), polytetrafluoroethylene, and a fluorine material, Wherein the base and the plurality of bumps are formed of glass or quartz, and the plurality of insulating members are formed of liquid silicon or an acryl material.
5. 5. The interposer of claim 1, further comprising: A bridge on the base to connect lower portions of the plurality of bumps.
6. 6. The interposer of claim 1, wherein each bump of the plurality of bumps further comprises a bottom surface facing the base and surrounded by the sidewalls, and Wherein the bottom surface comprises a planar surface.
7. 7. The interposer of claim 6, wherein an inner surface of the sidewall connected to the bottom surface forms an obtuse angle with the bottom surface.
8. 8. The interposer of claim 6, wherein an inner surface of the sidewall connected to the bottom surface forms an acute angle with the bottom surface.
9. 9. The interposer of claim 1, wherein each bump of the plurality of bumps further comprises a bottom surface facing the base and surrounded by the sidewalls, and Wherein the bottom surface includes a plurality of patterns.
10. 10. The interposer of claim 1, wherein an inner surface of the sidewall is formed as a curved surface.
11. 11. The interposer of claim 1, wherein the base comprises a plurality of recessed patterns in areas overlapping the plurality of receiving units, and each recessed pattern of the plurality of recessed patterns is connected to an inner surface of the sidewall.
12. 12. A method of manufacturing a display device, the method comprising: Placing a temporary substrate over an interposer, the temporary substrate having a plurality of light emitting diodes disposed thereon including first and second electrodes, the interposer including a plurality of insulating members; Transferring the plurality of light emitting diodes on the temporary substrate to the plurality of insulating members, respectively, and Transferring the plurality of light emitting diodes to a target substrate by attaching the interposer to the target substrate, Wherein transferring to the plurality of insulating members includes surrounding a portion of a side surface of each of the light emitting diodes and one surface of the first electrode with the plurality of insulating members, and Transferring to the target substrate includes transferring the plurality of insulating members to the target substrate along with the plurality of light emitting diodes.
13. 13. The method of manufacturing a display device according to claim 12, further comprising: after transfer to the target substrate in question, Exposing one surface of the first electrode by removing a portion of the plurality of insulating members, and And forming connection electrodes on the plurality of light emitting diodes to electrically connect the target substrate with the first electrodes.
14. 14. The method of manufacturing a display device according to claim 13, wherein one surface of the second electrode is exposed by the plurality of insulating members when transferred to the plurality of insulating members, and Transferring to the target substrate includes electrically connecting the one surface of the second electrode to the target substrate.
15. 15. The method of manufacturing a display device according to claim 12, further comprising: after transfer to the target substrate in question, A plurality of reflective layers covering side surfaces of the plurality of insulating members are formed on the target substrate.
16. 16. The method of manufacturing a display device according to claim 15, wherein forming the plurality of reflective layers comprises: Forming a metal layer covering the top surfaces and side surfaces of the plurality of insulating members, and The top surfaces and the upper side surfaces of the plurality of insulating members are exposed by removing portions of the metal layer covering the upper side surfaces and the top surfaces of the plurality of insulating members.
17. 17. The method of manufacturing a display device according to claim 16, further comprising: after exposing the top surfaces and the upper side surfaces of the plurality of insulating members, Exposing one surface of the first electrode by removing a portion of the plurality of insulating members, and And forming connection electrodes on the plurality of light emitting diodes to electrically connect the target substrate with the first electrodes.
18. 18. The method of manufacturing a display device according to claim 12, wherein transferring to each of the plurality of insulating members is performed in a non-contact state of the interposer and the temporary substrate.
19. 19. The method of manufacturing a display device according to claim 12, further comprising: after transfer to the target substrate in question, Thermal curing or UV curing is transferred to the plurality of insulating members of the target substrate.
20. 20. The method of manufacturing a display device according to claim 12, further comprising: prior to placing the temporary substrate on which the plurality of light emitting diodes are disposed, Each of the plurality of receiving units of the interposer is filled with the plurality of insulating members.

Description

Interposer and method for manufacturing display device using the same Cross Reference to Related Applications The present application claims priority from korean patent application No. 10-2024-0154271, filed on the korean intellectual property office at 11/4/2024, the disclosure of which is incorporated herein by reference. Technical Field The present disclosure relates to an interposer (interposer) and a method of manufacturing a display device using the same, and more particularly, to an interposer that improves transfer accuracy (transfer precision) of a light emitting diode and a method of manufacturing a display device using the same. Background As display devices for monitors of computers, televisions, or cellular phones, there are organic light emitting display devices (OLEDs) as self-luminous devices and liquid crystal display devices (LCDs) requiring a separate light source. The application range of display devices is diversified to personal digital assistants and monitors and televisions of computers, and display devices having a large display area and reduced volume and weight are being studied. Further, recently, a display device including a Light Emitting Diode (LED) has been attracting attention as a next-generation display device. Since the LED is formed of an inorganic material instead of an organic material, reliability is excellent such that its lifetime is longer than that of a liquid crystal display device or an organic light emitting display device. Further, the LED has a fast light emitting speed, excellent light emitting efficiency, and strong impact resistance, so that stability is excellent, and an image having high brightness can be displayed. Display devices including LEDs may be fabricated by transferring the LEDs using an interposer. Disclosure of Invention It is an object of the present disclosure to provide an interposer that minimizes misalignment of light emitting diodes and a method of manufacturing a display device using the interposer. Another object to be achieved by the present disclosure is to provide an interposer that reduces recognition of uneven defects (mura defects) generated when a plurality of light emitting diodes are transferred to a display device according to alignment in a case where the plurality of light emitting diodes are grown on a growth substrate, and a method of manufacturing the display device using the same. It is still another object of the present disclosure to provide an interposer that reduces the number of transfer processes by using a non-contact transfer method, and a method of manufacturing a display device using the interposer. It is still another object of the present disclosure to provide an interposer that mitigates the impact applied to a light emitting diode in a contact-less transfer method and a method of manufacturing a display device using the interposer. It is still another object of the present disclosure to provide an interposer in which a plurality of bumps (bumps) to which a plurality of light emitting diodes are attached are formed to be spaced apart from each other to increase pressure applied to the plurality of bumps and reduce non-transfer problems of the light emitting diodes, and a method of manufacturing a display device using the same. The objects of the present disclosure are not limited to the above-mentioned objects, and other objects not mentioned above will be clearly understood by those skilled in the art from the following description. According to one aspect of the disclosure, an interposer includes a base and a plurality of bumps spaced apart from one another on the base, and each bump of the plurality of bumps includes a sidewall extending upward from the base to define a receiving unit. According to another aspect of the present disclosure, a method of manufacturing a display device includes placing a temporary substrate on which a plurality of light emitting diodes including a first electrode and a second electrode are disposed over an interposer, the interposer including a plurality of insulating members, transferring the plurality of light emitting diodes on the temporary substrate to the plurality of insulating members, respectively, and transferring the plurality of light emitting diodes to a target substrate by attaching the interposer to the target substrate. Transferring to the plurality of insulating members includes surrounding a portion of a side surface of each light emitting diode and one surface of the first electrode with the plurality of insulating members, and transferring to the target substrate includes transferring the plurality of insulating members to the target substrate together with the plurality of light emitting diodes. Other details of the exemplary embodiments are included in the detailed description and the accompanying drawings. According to the present disclosure, as an interposer, a material having a low coefficient of thermal expansion is applied to reduce misalignment c