Search

CN-122002985-A - Multicolor LED luminous structure and preparation method thereof

CN122002985ACN 122002985 ACN122002985 ACN 122002985ACN-122002985-A

Abstract

Providing a substrate and LED chips with different luminous colors, enabling the LED chips with different luminous colors to be randomly embedded into through holes of different target areas, enabling the LED chips located in the same target area to have the same luminous color in the same color target area, enabling the LED chips located in different target areas to have different luminous colors, and enabling two electrodes of the LED chips embedded into the through holes to be exposed out of the substrate; A first wiring layer electrically connected to the first electrode and a second wiring layer electrically connected to the second electrode are prepared. The preparation method of the multicolor LED luminous structure does not need to carry the LED chips point to point, greatly improves the production efficiency and reduces the production cost.

Inventors

  • QU HONGXIA
  • GUO CHUANG

Assignees

  • 苏州中科光聚技术有限公司

Dates

Publication Date
20260508
Application Date
20260108

Claims (20)

  1. 1. The preparation method of the multicolor LED luminous structure is characterized by comprising the following steps of: S1, providing a substrate (1) and LED chips (2) with different luminous colors, wherein the substrate (1) comprises a color target area (12), the color target area (12) comprises at least two target areas (11) which are arranged at intervals, the target areas (11) are provided with a plurality of through holes (10) penetrating through the substrate (1), and the LED chips (2) comprise a first electrode (20) and a second electrode (21) which are respectively positioned at two ends of the LED chips; S2, enabling the LED chips (2) with different luminous colors to be randomly embedded into through holes (10) of different target areas (11), enabling the luminous colors of the LED chips (2) located in the same target area (11) to be the same in the same color target area (12), enabling the luminous colors of the LED chips (2) located in different target areas (11) to be different, and enabling two electrodes of the LED chips (2) embedded into the through holes (10) to be exposed out of the substrate (1); s3, preparing a first wiring layer (4) electrically connected with the first electrode (20) and a second wiring layer (6) electrically connected with the second electrode (21).
  2. 2. The method for manufacturing the multicolor LED light-emitting structure according to claim 1, wherein in the step S2, the LED chips (2) of different light-emitting colors are randomly embedded into the through holes (10) of different target areas (11), and the method comprises the steps of placing the LED chips (2) on the substrate (1), driving the LED chips (2) to move on the substrate (1), and embedding the LED chips (2) into the through holes (10) of the corresponding target areas (11).
  3. 3. The method of manufacturing a multicolor LED lighting structure according to claim 1, characterized in that the cross-sectional shape of the through holes (10) for carrying LED chips (2) of different lighting colors is different, the LED chips (2) are adapted to the through holes (10), and the LED chips (2) can enter the through holes (10) adapted thereto and cannot enter the through holes (10) not adapted thereto; In the step S2, when the LED chips (2) with different luminous colors are randomly embedded into the through holes (10) of different target areas (11), the LED chips (2) with different luminous colors are placed on the substrate (1) in a separated mode, the LED chips (2) are driven to move on the substrate (1) so that the LED chips (2) are embedded into the matched through holes (10), or the LED chips (2) with different luminous colors are placed on the substrate (1) at the same time, the LED chips (2) are driven to move on the substrate (1) so that the LED chips (2) are embedded into the matched through holes (10).
  4. 4. The method of manufacturing a multicolor LED light emitting structure according to claim 1, wherein the LED chips (2) are divided into a first color LED chip (2 a) and a second color LED chip (2 b) according to the difference of the light emission colors thereof, and the color target region (12) includes a first color target region (11 a) for carrying the first color LED chip (2 a) and a second color target region (11 b) for carrying the second color LED chip (2 b); In the step S2, the step of randomly embedding the LED chips (2) of different emission colors into the through holes (10) of different target areas (11) includes: Placing a plurality of first color LED chips (2 a) on the substrate (1), and driving the LED chips (2) to move on the substrate (1) so that the first color LED chips (2 a) are embedded into the through holes (10) of the first color target area (11 a); and placing a plurality of second-color LED chips (2 b) on the substrate (1), and driving the second-color LED chips (2 b) to move on the substrate (1) so that the second-color LED chips (2 b) are embedded into the through holes (10) of the second-color target area (11 b).
  5. 5. The method of manufacturing a multicolor LED light emitting structure according to claim 1, wherein the LED chips (2) are divided into a first color LED chip (2 a), a second color LED chip (2 b) and a third color LED chip (2 c) according to the difference of the light emission colors thereof, and the color target region (12) includes a first color target region (11 a) for carrying the first color LED chip (2 a), a second color target region (11 b) for carrying the second color LED chip (2 b) and a third color target region (11 c) for carrying the third color LED chip (2 c); In the step S2, the step of randomly embedding the LED chips (2) of different emission colors into the through holes (10) of different target areas (11) includes: Placing a plurality of first color LED chips (2 a) on the substrate (1), and driving the LED chips (2) to move on the substrate (1) so that the first color LED chips (2 a) are embedded into the through holes (10) of the first color target area (11 a); Placing a plurality of second-color LED chips (2 b) on the substrate (1), and driving the second-color LED chips (2 b) to move on the substrate (1) so that the second-color LED chips (2 b) are embedded into the through holes (10) of the second-color target area (11 b); And placing a plurality of third-color LED chips (2 c) on the substrate (1), and driving the third-color LED chips (2 c) to move on the substrate (1) so that the third-color LED chips (2 c) are embedded into the through holes (10) of the third-color target area (11 c).
  6. 6. The method for manufacturing a multicolor LED light emitting structure according to any of claims 1 to 5, wherein the through hole (10) has a large end and a small end at both ends thereof, and the through holes of different target areas have different cross-sectional sizes, the LED chips of different light emitting colors have different cross-sectional sizes, and the LED chip having a smaller cross-sectional size can pass through the through hole (10) having a larger cross-sectional size; In the step S2, when the LED chips (2) with different light emission colors are randomly embedded into the through holes (10) of different target areas (11), the large ends of the through holes (10) are kept upward, and the LED chips with different colors are embedded into the corresponding through holes in a multiple-step manner according to the sequence from small to large.
  7. 7. The method for manufacturing a multi-color LED light-emitting structure according to claim 6, wherein, The through hole (10) is a conical hole; the LED chip (2) is matched with the corresponding through hole (10); The thickness of the LED chip (2) is larger than or equal to the thickness of the through hole (10); The LED chip (2) has a large end and a small end at both ends thereof, and the large end thereof cannot pass through the small end of the through hole (10) or cannot pass through the small end and the large end of the through hole (10).
  8. 8. The method for manufacturing the multicolor LED light-emitting structure according to any one of claims 1 to 5, wherein the through hole (10) has a large end and a small end, and in the step S2, when the LED chips (2) of different light emission colors are randomly embedded in the through holes (10) of different target areas (11), the large end of the through hole is kept upward, the LED chips of different colors are embedded in the through holes of the corresponding target areas in a divided manner, and when the LED chips of a certain color are embedded, the through holes for embedding the LED chips of other colors are blocked.
  9. 9. The method for manufacturing the multicolor LED light-emitting structure according to any one of claims 1 to 5, wherein the through hole (10) has a large end and a small end, and the cross-sectional dimension of the small end of the LED chip (2) is larger than the cross-sectional dimension of the large end of the next smaller through hole (10), and wherein in the step S2, when the LED chips (2) of different light emission colors are randomly embedded into the through holes (10) of different target areas (11), the large end of the through hole (10) is kept upward, the LED chips (2) of different colors are simultaneously placed on the substrate (1), and the LED chips (2) are driven to move on the substrate (1) so that the LED chips (2) are embedded into the through holes (10) of the corresponding target areas.
  10. 10. The method of manufacturing a multi-color LED light emitting structure according to any one of claims 1 to 5, wherein in the step S2, the LED chip (2) is driven to move on the substrate (1) by driving the substrate (1) to vibrate, or the LED chip (2) is driven to move on the substrate (1) by a gas flow or a liquid flow or a pushing member.
  11. 11. The method for manufacturing the multicolor LED light-emitting structure according to any one of claims 1 to 5, wherein in the step S2, after the step of embedding the LED chip (2) of one light-emitting color into the through hole (10), the following steps are further performed: And removing the LED chips (2) which are not embedded in the through holes (10) on the substrate (1) by driving the substrate (1) to vibrate and/or blow and/or flush with fluid and/or push by a pushing member and/or tilt the substrate (1).
  12. 12. A method of manufacturing a multi-color LED lighting structure according to any one of claims 1 to 5, characterized in that the substrate (1) comprises a plurality of array-distributed color target areas (12).
  13. 13. The method of manufacturing a multi-color LED light emitting structure according to any one of claims 1 to 5, wherein the first wiring layer (4) includes a plurality of first driving lines (41) arranged at intervals along a second direction and a first insulating layer (40) covering an outside of the first driving lines (41), the first driving lines (41) extend along the first direction, the second wiring layer (6) includes a plurality of second driving lines (61) arranged at intervals along the first direction and a second insulating layer (60) covering an outside of the second driving lines (61), the second driving lines (61) extend along the second direction, and the target region (11) corresponds to an overlapping region of projections of the first driving lines (41) and the second driving lines (61) along a thickness direction of the substrate (1).
  14. 14. The method of manufacturing an LED light emitting structure according to any one of claims 1 to 5, wherein in the step S3, the first wiring layer (4) and the second wiring layer (6) are covered on the surface of the substrate (1), or In the step S3, before preparing the first wiring layer (4) electrically connected to the first electrode (20) and the second wiring layer (6) electrically connected to the second electrode, the method further comprises: Preparing an encapsulation layer for fixing the LED chip (2) on the substrate (1); the first wiring layer (4) and/or the second wiring layer (6) are/is covered on the surface of the packaging layer.
  15. 15. A multicolor LED lighting structure, comprising: The LED chip comprises a substrate (1) and a plurality of LED chips, wherein the substrate comprises a color target area (12), the color target area (12) comprises at least two target areas (11) which are arranged at intervals, the target areas (11) are provided with a plurality of through holes (10) penetrating through the substrate (1), and the LED chips (2) comprise a first electrode (20) and a second electrode (21) which are respectively positioned at two ends of the LED chips; A plurality of LED chips (2), wherein the LED chips (2) are embedded in the through hole (10) and comprise a first electrode (20) positioned at the big end of the through hole and a second electrode (21) positioned at the small end of the through hole, the first electrode (20) and the second electrode (21) are positioned outside the through hole (10), the luminous colors of the LED chips (2) in the same target area are the same, and the luminous colors of the LED chips (2) in different target areas are different; a first wiring layer (4) electrically connected to the first electrode (20); and a second wiring layer (6) electrically connected to the second electrode (21).
  16. 16. The LED lighting structure according to claim 13, wherein the first wiring layer (4) and the second wiring layer (6) cover the surface of the substrate (1), or An encapsulation layer is arranged between the first wiring layer (4) and the substrate (1) and/or between the second wiring layer (6) and the substrate (1).
  17. 17. The multicolor LED lighting structure according to claim 13, characterized in that said through hole (10) is a tapered hole having a large end and a small end at both ends thereof; the LED chip (2) is matched with the corresponding through hole (10); The thickness of the LED chip (2) is larger than or equal to the thickness of the through hole (10); The LED chip (2) has a large end and a small end at both ends thereof, and the large end thereof cannot pass through the small end of the through hole (10) or cannot pass through the small end and the large end of the through hole (10).
  18. 18. The multicolor LED lighting structure according to claim 15, characterized in that the LED chips (2) are divided into a first color LED chip (2 a) and a second color LED chip (2 b) according to the difference of the light emission colors thereof, the color target region (12) comprises a first color target region (11 a) for carrying the first color LED chip (2 a) and a second color target region (11 b) for carrying the second color LED chip (2 b), or The LED chips (2) are divided into a first color LED chip (2 a), a second color LED chip (2 b) and a third color LED chip (2 c) according to the different light emitting colors, and the color target area (12) comprises a first color target area (11 a) for bearing the first color LED chip (2 a), a second color target area (11 b) for bearing the second color LED chip (2 b) and a third color target area (11 c) for bearing the third color LED chip (2 c); the cross-sectional dimensions of the through holes of the target areas carrying the LED chips of different light emission colors are different, or the cross-sectional shapes of the through holes of the target areas carrying the LED chips of different light emission colors are different, and the cross-sectional shapes of the LED chips of different light emission colors are also different.
  19. 19. The multi-color LED lighting structure according to any one of claims 15 to 18, characterized in that the substrate (1) comprises a plurality of array-distributed color target areas (12); The first wiring layer (4) includes a plurality of first driving lines (41) arranged at intervals along a second direction and a first insulating layer (40) covering the outside of the first driving lines (41), the first driving lines (41) extend along the first direction, the second wiring layer (6) includes a plurality of second driving lines (61) arranged at intervals along the first direction and a second insulating layer (60) covering the outside of the second driving lines (61), the second driving lines (61) extend along the second direction, and the target region (11) corresponds to an overlapping region of projections of the first driving lines (41) and the second driving lines (61) along a thickness direction of the substrate (1).
  20. 20. The multicolor LED lighting structure according to any of claims 15 to 18, characterized in that the through holes (10) of the target area (11) are embedded randomly with the LED chips (2); The number of specific through holes (10) of the target area (11) is not less than 10; the LED chip (2) is embedded in one or more through holes (10) of the target area (11).

Description

Multicolor LED luminous structure and preparation method thereof Technical Field The invention relates to the technical field of manufacturing of light-emitting devices, in particular to a multicolor LED light-emitting structure and a preparation method thereof. Background In the field of display device manufacturing, the key of large-scale commercial production is a mass transfer process, namely, how to precisely, efficiently and stably transfer a mass of LED chips onto a target substrate. The precision, efficiency, reliability and yield of the LED chip transferring process directly determine the production cost and market competitiveness of the product. The prior art generally employs a pick-and-place (pick-and-place) approach to place LED chips into predetermined locations one by one. In the face of millions of transfer numbers, the transfer efficiency of the method is low, the time is long, the requirement on the precision of the chip assembly position is severe, and the process complexity and the manufacturing cost are high. Accordingly, there is a need for an improvement over the prior art to overcome the deficiencies described in the prior art. The foregoing is provided merely to facilitate the understanding of the principles of the application and is not admitted to be prior art by the foregoing disclosure. Disclosure of Invention The invention aims to provide a multicolor LED luminous structure and a preparation method thereof, so as to reduce the process difficulty. In order to achieve the above object, in a first aspect, the present invention provides a method for manufacturing a multicolor LED light emitting structure, which is characterized by comprising the following steps: S1, providing a substrate and LED chips with different luminous colors, wherein the substrate comprises a color target area, the color target area comprises at least two target areas which are arranged at intervals, the target area is provided with a plurality of through holes penetrating through the substrate, and the LED chips comprise a first electrode and a second electrode which are respectively positioned at two ends of the LED chips; S2, enabling the LED chips with different luminous colors to be randomly embedded into through holes of different target areas, wherein in the same color target area, the luminous colors of the LED chips positioned in the same target area are the same, the luminous colors of the LED chips positioned in different target areas are different, and two electrodes of the LED chips embedded into the through holes are exposed out of the substrate; s3, preparing a first wiring layer electrically connected with the first electrode and a second wiring layer electrically connected with the second electrode. Further, in the step S2, the step of enabling the LED chips with different luminous colors to be randomly embedded into the through holes of different target areas comprises the steps of placing the LED chips on a substrate, driving the LED chips to move on the substrate, and enabling the LED chips to be embedded into the through holes of the corresponding target areas. Further, the cross-sectional shapes of the through holes for carrying the LED chips with different luminous colors are different, the LED chips are matched with the through holes, and the LED chips can enter the through holes matched with the through holes and cannot enter the through holes not matched with the through holes; In the step S2, when the LED chips with different light emission colors are randomly embedded into the through holes of different target areas, the LED chips with different light emission colors are placed on the substrate in a separated manner, the LED chips are driven to move on the substrate so as to be embedded into the matched through holes, or the LED chips with different light emission colors are placed on the substrate at the same time, the LED chips are driven to move on the substrate so as to be embedded into the matched through holes. Further, the LED chips are divided into a first color LED chip and a second color LED chip according to the different luminous colors, and the color target area comprises a first color target area for bearing the first color LED chip and a second color target area for bearing the second color LED chip; in the step S2, the step of randomly embedding the LED chips with different light emission colors into the through holes of different target areas includes: Placing a plurality of first-color LED chips on the substrate, and driving the LED chips to move on the substrate so that the first-color LED chips are embedded into the through holes of the first-color target area; and placing a plurality of second-color LED chips on the substrate, and driving the second-color LED chips to move on the substrate so that the second-color LED chips are embedded into the through holes of the second-color target area. Further, the LED chips are divided into a first color LED chip, a sec