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CN-122002986-A - LED light-emitting structure and preparation method thereof, multicolor LED light-emitting structure and preparation method thereof

CN122002986ACN 122002986 ACN122002986 ACN 122002986ACN-122002986-A

Abstract

The invention discloses an LED luminous structure and a preparation method thereof, and a multicolor LED luminous structure and a preparation method thereof, wherein the LED luminous structure comprises a substrate, a plurality of through holes penetrating through the substrate are arranged on the substrate, after an LED chip is placed on the substrate, the LED chip is driven to move on the substrate, so that the LED chip is embedded into the through holes, and the positioning of the LED chip on the surface of the substrate is realized.

Inventors

  • QU HONGXIA
  • GUO CHUANG

Assignees

  • 苏州中科光聚技术有限公司

Dates

Publication Date
20260508
Application Date
20260108

Claims (16)

  1. 1. The preparation method of the LED light-emitting structure is characterized by comprising the following steps of: S1, providing a substrate (1), wherein the substrate (1) is provided with a plurality of through holes (10) penetrating through the substrate (1); S2, placing a plurality of LED chips (2) on a substrate (1), driving the LED chips (2) to move on the substrate (1) so that the LED chips (2) are embedded into the through holes (10), wherein the LED chips (2) comprise a first electrode (20) and a second electrode (21) which are respectively positioned at two ends of the LED chips, and two electrodes of the LED chips (2) embedded into the through holes (10) are exposed out of the substrate (1); s3, preparing a first wiring layer (4) electrically connected with the first electrode (20) and a second wiring layer (6) electrically connected with the second electrode (21).
  2. 2. The method of manufacturing a LED lighting structure according to claim 1, wherein the through hole (10) has a large end and a small end at both ends thereof, and in the step S2, the large end of the through hole (10) faces upward when the plurality of LED chips (2) are placed on the substrate (1).
  3. 3. The method of manufacturing a LED lighting structure according to claim 2, wherein the through hole (10) is a tapered hole; the LED chip (2) is matched with the through hole (10); The thickness of the LED chip (2) is larger than or equal to the thickness of the through hole (10); The LED chip (2) has a large end and a small end at both ends thereof, and the large end thereof cannot pass through the small end of the through hole (10) or cannot pass through the small end and the large end of the through hole (10).
  4. 4. The method for manufacturing the LED light emitting structure according to claim 1, wherein the step S1 further comprises the step of providing a supporting surface (13) located below the through hole (10) of the substrate (1), and the step S2 is characterized in that the supporting surface (13) supports and limits the LED chip (2) when the LED chip is embedded into the through hole (10).
  5. 5. The method of manufacturing a LED light emitting structure according to claim 1, wherein the first wiring layer (4) includes a plurality of first driving lines (41) arranged at intervals along a second direction and a first insulating layer (40) covering the first driving lines (41), the first driving lines (41) extend along the first direction, the second wiring layer (6) includes a plurality of second driving lines (61) arranged at intervals along the first direction and a second insulating layer (60) covering the second driving lines (61), the second driving lines (61) extend along the second direction, the substrate (1) is provided with a plurality of target areas (11), the target areas (11) correspond to overlapping areas of projections of the first driving lines (41) and the second driving lines (61) along a thickness direction of the substrate (1), and each of the target areas (11) includes at least one of the through holes (10).
  6. 6. The method of manufacturing a LED lighting structure according to claim 5, wherein each of the target areas (11) comprises a plurality of through holes (10), and the plurality of through holes (10) are distributed in an array or randomly.
  7. 7. The method of manufacturing an LED light emitting structure according to claim 1, wherein in the step S3, the first wiring layer (4) and the second wiring layer (6) are covered on the surface of the substrate (1), or In the step S3, before preparing the first wiring layer (4) electrically connected to the first electrode (20) and the second wiring layer (6) electrically connected to the second electrode, the method further comprises: Preparing an encapsulation layer for fixing the LED chip (2) on the substrate (1); the first wiring layer (4) and/or the second wiring layer (6) are/is covered on the surface of the packaging layer.
  8. 8. The method of manufacturing an LED light emitting structure according to any one of claims 1 to 7, wherein in the step S2, the LED chips (2) are driven to move on the substrate (1) by driving the substrate (1) to vibrate, or the LED chips (2) are driven to move on the substrate (1) by pushing a plurality of the LED chips (2) by an air flow or a pushing member.
  9. 9. The method for manufacturing an LED light emitting structure according to any one of claims 1 to 7, wherein in the step S2, further comprising the steps of: And removing the LED chips (2) which are not embedded in the through holes (10) on the substrate (1) by driving the substrate (1) to vibrate and/or blow and/or flush with fluid and/or push by a pushing member and/or tilt the substrate (1).
  10. 10. The preparation method of the multicolor LED luminous structure is characterized by comprising the following steps of: Preparing a first layer LED lighting structure (80), a second layer LED lighting structure (81) and a third layer LED lighting structure (82) by the method for preparing an LED lighting structure according to any one of claims 1 to 8, wherein the light emission colors of the LED chips (2) located on the same layer are the same, and the light emission colors of the LED chips (2) located on different layers are different; The first layer LED light emitting structure (80), the second layer LED light emitting structure (81) and the third layer LED light emitting structure (82) are stacked and connected.
  11. 11. The method of manufacturing a multi-color LED lighting structure according to claim 10, wherein the first layer LED lighting structure (80), the second layer LED lighting structure (81) and the third layer LED lighting structure (82) are each provided with a target area (11), each target area (11) having one or more than two through holes (10); The projections of the target areas (11) of the first layer LED light-emitting structure (80), the second layer LED light-emitting structure (81) and the third layer LED light-emitting structure (82) in the stacking direction are not overlapped, the target areas (11) of the first layer LED light-emitting structure (80), the second layer LED light-emitting structure (81) and the third layer LED light-emitting structure (82) are sequentially arranged in the overlooking direction, and the adjacent target areas (11) of the first layer LED light-emitting structure (80), the second layer LED light-emitting structure (81) and the third layer LED light-emitting structure (82) form a colorful target area (12), or The projections of the target areas (11) of the first layer LED light-emitting structure (80), the second layer LED light-emitting structure (81) and the third layer LED light-emitting structure (82) in the stacking direction are overlapped, and the overlapped target areas (11) of the first layer LED light-emitting structure (80), the second layer LED light-emitting structure (81) and the third layer LED light-emitting structure (82) form a color target area (12); The multicolor LED light emitting structure comprises only one of the color target areas (12), or comprises a plurality of color target areas (12) distributed in an array.
  12. 12. An LED lighting structure, comprising: A substrate (1) provided with a plurality of through holes (10) penetrating the substrate (1); The LED chips (2) are embedded in the through holes (10) and comprise a first electrode (20) and a second electrode (21) which are positioned at two ends of the through holes, and the first electrode (20) and the second electrode (21) are exposed out of the substrate (1); a first wiring layer (4) electrically connected to the first electrode (20); and a second wiring layer (6) electrically connected to the second electrode (21).
  13. 13. The LED lighting structure according to claim 12, characterized in that the through hole (10) is a tapered hole having a large end and a small end at both ends thereof; the LED chip (2) is matched with the through hole (10); The thickness of the LED chip (2) is larger than or equal to the thickness of the through hole (10); The LED chip (2) has a large end and a small end at both ends thereof, and the large end thereof cannot pass through the small end of the through hole (10) or cannot pass through the small end and the large end of the through hole (10).
  14. 14. The LED lighting structure according to claim 13, wherein the first wiring layer (4) includes a plurality of first driving lines (41) arranged at intervals along a second direction and a first insulating layer (40) covering the first driving lines (41), the first driving lines (41) extend along the first direction, the second wiring layer (6) includes a plurality of second driving lines (61) arranged at intervals along the first direction and a second insulating layer (60) covering the second driving lines (61), the second driving lines (61) extend along the second direction, the substrate (1) is provided with a plurality of target areas (11), the target areas (11) correspond to overlapping areas of projections of the first driving lines (41) and the second driving lines (61) along a thickness direction of the substrate (1), and each of the target areas (11) includes at least one of the through holes (10).
  15. 15. The LED lighting structure according to claim 12, wherein the first wiring layer (4) and the second wiring layer (6) cover the surface of the substrate (1), or An encapsulation layer is arranged between the first wiring layer (4) and the substrate (1) and/or between the second wiring layer (6) and the substrate (1).
  16. 16. A multicolor LED light emitting structure characterized in that it comprises a first layer LED light emitting structure (80), a second layer LED light emitting structure (81) and a third layer LED light emitting structure (82) stacked in this order from bottom to top, said first layer LED light emitting structure (80), second layer LED light emitting structure (81) and third layer LED light emitting structure (82) being prepared by the method of preparing an LED light emitting structure according to any one of claims 1 to 9 or being an LED light emitting structure according to any one of claims 12 to 15; The light emitting colors of the LED chips (2) positioned on the same layer are the same, the light emitting colors of the LED chips (2) positioned on different layers are different, and the projections of the first layer LED light emitting structure (80), the second layer LED light emitting structure (81) and the target area (11) of the third layer LED light emitting structure (82) in the stacking direction are overlapped or not overlapped.

Description

LED light-emitting structure and preparation method thereof, multicolor LED light-emitting structure and preparation method thereof Technical Field The invention relates to the technical field of manufacturing of light-emitting devices, in particular to an LED light-emitting structure and a preparation method thereof, and a multicolor LED light-emitting structure and a preparation method thereof. Background In the field of display device manufacturing, the key of large-scale commercial production is a mass transfer process, namely, how to precisely, efficiently and stably transfer a mass of LED chips onto a target substrate. The precision, efficiency, reliability and yield of the LED chip transferring process directly determine the production cost and market competitiveness of the product. The prior art generally employs a pick-and-place (pick-and-place) approach to place LED chips into predetermined locations one by one. In the face of millions of transfer numbers, the transfer efficiency of the method is low, the time is long, the requirement on the precision of the chip assembly position is severe, and the process complexity and the manufacturing cost are high. Accordingly, there is a need for an improvement over the prior art to overcome the deficiencies described in the prior art. The foregoing is provided merely to facilitate the understanding of the principles of the application and is not admitted to be prior art by the foregoing disclosure. Disclosure of Invention The invention aims to provide an LED light-emitting structure and a preparation method thereof, and a multicolor LED light-emitting structure and a preparation method thereof, so as to reduce process difficulty. In order to achieve the above object, according to a first aspect, the present invention provides a method for manufacturing an LED light emitting structure, which is characterized by comprising the following steps: S1, providing a substrate, wherein the substrate is provided with a plurality of through holes penetrating through the substrate; s2, placing a plurality of LED chips on a substrate, driving the LED chips to move on the substrate, enabling the LED chips to be embedded into the through holes, wherein the LED chips comprise a first electrode and a second electrode which are respectively positioned at two ends of the LED chips, and the two electrodes of the LED chips embedded into the through holes are exposed out of the substrate; s3, preparing a first wiring layer electrically connected with the first electrode and a second wiring layer electrically connected with the second electrode. Further, the through hole has a large end and a small end at both ends thereof, and the large end of the through hole faces upward when the plurality of LED chips are placed on the substrate in the step S2. Further, the through hole is a conical hole; the LED chip is matched with the through hole; the thickness of the LED chip is larger than or equal to that of the through hole; the LED chip has a large end and a small end at both ends thereof, and the large end thereof cannot pass through the small end of the through hole or cannot pass through the small end and the large end of the through hole. Further, the step S1 further comprises the step of providing a supporting surface positioned below the through hole of the substrate, and in the step S2, when the LED chip is embedded into the through hole, the LED chip is supported and limited by the supporting surface. Further, the first wiring layer includes a plurality of first driving lines arranged at intervals along a second direction and a first insulating layer covering the first driving lines, the first driving lines extend along the first direction, the second wiring layer includes a plurality of second driving lines arranged at intervals along the first direction and a second insulating layer covering the second driving lines, the second driving lines extend along the second direction, the substrate is provided with a plurality of target areas corresponding to overlapping areas of projections of the first driving lines and the second driving lines along a thickness direction of the substrate, and each of the target areas includes at least one of the through holes. Further, each target area includes a plurality of through holes, and the plurality of through holes are distributed in an array or randomly distributed. Further, in the step S3, the first wiring layer and the second wiring layer are covered on the surface of the substrate, or In the step S3, before preparing the first wiring layer electrically connected to the first electrode and the second wiring layer electrically connected to the second electrode, the method further includes: preparing an encapsulation layer for fixing the LED chip on the substrate; The first wiring layer and/or the second wiring layer covers the surface of the packaging layer. Further, in the step S2, the LED chips are driven to move on the substrate by