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CN-122002987-A - Cavity-free sensing packaging structure and manufacturing method thereof

CN122002987ACN 122002987 ACN122002987 ACN 122002987ACN-122002987-A

Abstract

The invention discloses a cavity-free sensing packaging structure and a manufacturing method thereof. The cavity-free sensing packaging structure comprises a substrate, a sensing module arranged on the substrate and an opaque packaging body formed on the sensing module. The sensing module comprises a sensing chip arranged on the substrate, a first transparent bonding layer adhered to the sensing chip and first glass adhered to the first transparent bonding layer. The sensing chip is electrically coupled to the substrate, and the first transparent adhesive layer covers the sensing area of the sensing chip. The sensing module is buried in the light-tight packaging body, and at least part of the outer surface of the first glass is exposed out of the light-tight packaging body. Therefore, the sensing chip is adhered to the substrate through the first transparent adhesive layer, so that the package body can replace the existing shell body, the production cost of the cavity-free sensing package structure is reduced, and the overall size is reduced.

Inventors

  • XU ZHIYANG
  • KE YILING
  • WAN KEYU
  • WU JIAMIAN
  • WU GUANXUN

Assignees

  • 同欣电子工业股份有限公司

Dates

Publication Date
20260508
Application Date
20241101

Claims (20)

  1. 1. A cavity-less type sensing package structure, characterized in that the cavity-less type sensing package structure comprises: A substrate having an upper plate surface and a lower plate surface respectively located at opposite sides; a sensing module disposed on the substrate and comprising: The sensing chip is mounted on the upper plate surface of the substrate and is electrically coupled with the substrate, wherein the top surface of the sensing chip is provided with a sensing area; A first transparent adhesive layer adhered to the top surface of the sensing chip and covering the sensing region, and The first glass is adhered to the first transparent adhesive layer, wherein the first glass corresponds to a first spectrum band; the light-emitting module is arranged on the substrate and is spaced from the sensing module, and the light-emitting module comprises: A light emitting chip mounted on the upper surface of the substrate, and the sensing chip is electrically coupled to the substrate; A second transparent adhesive layer adhered to the light emitting chip and covering the light emitting surface of the light emitting chip, and A second glass adhered to the second transparent adhesive layer and having an outer surface coplanar with the outer surface of the first glass, wherein the second glass corresponds to a second spectral band different from the first spectral band, and The light-tight encapsulation body is formed on the upper surface of the substrate, the sensing module and the light-emitting module are buried in the light-tight encapsulation body, and at least part of the outer surface of the first glass and at least part of the outer surface of the second glass are exposed out of the light-tight encapsulation body.
  2. 2. The package structure of claim 1, wherein the substrate comprises at least one first bonding pad and at least one second bonding pad on the upper surface, the sensing chip comprises at least one first bonding pad on the top surface, and the light emitting chip comprises at least one second bonding pad adjacent to the light emitting surface, wherein the sensing module comprises at least one first metal wire connecting the at least one first bonding pad and at least partially embedded in the opaque package, and wherein the light emitting module comprises at least one second metal wire connecting the at least one second bonding pad and at least partially embedded in the opaque package.
  3. 3. The cavity-less sensing package of claim 2, wherein at least one of the first metal lines is completely embedded within the light-tight package.
  4. 4. The cavity-less sensing package of claim 3, wherein the sensing region comprises a main section and two sub-sections extending from the main section, At least one of the first connection pads is located within the area enclosed by the primary section and the two secondary sections; the first glass is projected towards the top surface of the sensing chip to form a projection area which covers the whole main section but not covers the two secondary sections and at least one first connection pad.
  5. 5. The cavity-less sensing package of claim 3, wherein the sensing region comprises a main section and two sub-sections extending from the main section, The first glass is provided with an inner surface positioned at the opposite side of the outer surface and an avoidance groove concaved from the inner surface, and part of at least one first metal wire is positioned in the avoidance groove, wherein a projection area formed by orthographic projection of the first glass towards the top surface of the sensing chip covers the whole main section, the two secondary sections and at least one first connecting pad.
  6. 6. The cavity-less sensing package of claim 1, wherein an outer edge of the first glass is aligned with an outer edge of the first transparent adhesive layer, and an outer edge of the second glass is aligned with an outer edge of the second transparent adhesive layer.
  7. 7. The cavity-less sensing package of claim 1, wherein no cavity is formed inside the cavity-less sensing package.
  8. 8. A method for manufacturing a cavity-less sensing package structure, the method comprising: a step of arranging a crystal, namely, mounting a sensing chip and a luminous chip on an upper plate surface of a substrate at intervals; a bonding step of bonding a first glass to the sensing region of the sensing chip with a first transparent adhesive layer and jointly defining a sensing module, bonding a second glass to the light emitting surface of the light emitting chip with a second transparent adhesive layer and jointly defining a light emitting module, and making the outer surface of the second glass coplanar with the outer surface of the first glass, wherein the first glass corresponds to a first spectrum band and the second glass corresponds to a second spectrum band different from the first spectrum band, and And a packaging step, wherein an opaque package is formed on the upper surface of the substrate, the sensing module and the light emitting module are buried in the opaque package, and at least part of the outer surface of the first glass and at least part of the outer surface of the second glass are exposed out of the opaque package.
  9. 9. The method of claim 8, wherein in the bonding step, a first optical adhesive is formed on the sensing region of the sensing chip, a second optical adhesive is formed on the light emitting surface of the light emitting chip, the first glass is adhered to the first optical adhesive, the second glass is adhered to the second optical adhesive, and the first optical adhesive and the second optical adhesive are cured to form the first transparent adhesive layer and the second transparent adhesive layer, respectively.
  10. 10. The method of claim 8, further comprising a pre-step of attaching a first optical film to a first glass layer, and then cutting the first glass layer and the first optical film to form a plurality of first glasses separated from each other and a plurality of first transparent adhesive layers respectively attached to the plurality of first glasses, wherein in the attaching step, one of the first glasses is attached to the sensing region of the sensing chip with the first transparent adhesive layer attached thereto.
  11. 11. The method of claim 10, wherein in the pre-step, a second optical film is attached to a second glass layer, and then the second glass layer and the second optical film are cut to form a plurality of second glass layers separated from each other and a plurality of second transparent adhesive layers respectively attached to the second glass layers, and in the attaching step, one of the second glass layers is attached to the light emitting surface of the light emitting chip with the second transparent adhesive layer attached thereto.
  12. 12. A method for manufacturing a cavity-less sensing package structure, the method comprising: A step of modularization, which is to bond a first glass through a first transparent bonding layer in a plurality of default sensing areas of a first wafer respectively, and cut the first wafer to form a plurality of sensing chips separated from each other, wherein each sensing chip and the first transparent bonding layer and the first glass arranged on the sensing chip are defined as a sensing module together; a step of arranging a chip, in which the sensor chip and a light emitting module of the sensor module are mounted on a top surface of a substrate at intervals, wherein the light emitting module comprises a light emitting chip mounted on the top surface, a second transparent adhesive layer adhered to the light emitting chip, and a second glass adhered to the second transparent adhesive layer, wherein the first glass corresponds to a first spectrum band and the second glass corresponds to a second spectrum band different from the first spectrum band, and And a packaging step, wherein an opaque package is formed on the upper surface of the substrate, the sensing module and the light emitting module are buried in the opaque package, and at least part of the outer surface of the first glass and at least part of the outer surface of the second glass are exposed out of the opaque package.
  13. 13. The method of claim 12, wherein in the step of modularization, a plurality of first optical colloids are formed at intervals in the default sensing areas of the first wafer by dispensing, and then a plurality of first glasses are adhered to the first optical colloids respectively, and then the first optical colloids are cured to form a plurality of first transparent adhesive layers respectively.
  14. 14. The method of claim 12, wherein in the step of modularizing, a first optical colloid covering a plurality of default sensing areas is coated on the first wafer, and then a plurality of first glasses are respectively adhered to the first optical colloid and have positions corresponding to the default sensing areas, and the first optical colloid portions which are not contacted with the plurality of first glasses are removed, so that the first optical colloids form a plurality of first transparent adhesive layers separated from each other.
  15. 15. A void-free space according to claim 14A method for manufacturing a sensing package structure, the first optical colloid is photosensitive colloid.
  16. 16. A cavity-less type sensing package structure, characterized in that the cavity-less type sensing package structure comprises: a substrate having an upper plate surface and a lower plate surface respectively located at opposite sides; a sensing module disposed on the substrate and comprising: The sensing chip is mounted on the upper plate surface of the substrate and is electrically coupled with the substrate, wherein the top surface of the sensing chip is provided with a sensing area; A first transparent adhesive layer adhered to the top surface of the sensing chip and covering the sensing region, and A first glass adhered to the first transparent adhesive layer and corresponding to a first spectral band, and The light-tight packaging body is formed on the upper surface of the substrate, the sensing module is buried in the light-tight packaging body, and at least part of the outer surface of the first glass is exposed out of the light-tight packaging body.
  17. 17. The cavity-less sensing package of claim 16, wherein, The substrate comprises at least one first bonding pad positioned on the upper surface, and the sensing chip is provided with at least one first connecting pad positioned on the top surface, wherein the sensing module comprises at least one first metal wire connected with the at least one first bonding pad and the at least one first connecting pad, and the at least one first metal wire is at least partially embedded in the light-tight packaging body.
  18. 18. The cavity-less sensing package of claim 17, wherein, At least one of the first metal lines is completely embedded within the opaque package.
  19. 19. The cavity-less sensing package of claim 18, wherein, The sensing area comprises a main section and two secondary sections extending from the main section, wherein at least one first connection pad is positioned in an area surrounded by the main section and the two secondary sections, and a projection area formed by orthographic projection of the first glass towards the top surface of the sensing chip covers the whole main section but does not cover the two secondary sections and the at least one first connection pad.
  20. 20. The cavity-less sensing package of claim 18, wherein, The sensing area comprises a main section and two secondary sections extending from the main section, at least one first connecting pad is located in an area surrounded by the main section and the two secondary sections, the first glass is provided with an inner surface located on the opposite side of the outer surface and an avoidance groove concaved from the inner surface, a part of at least one first metal wire is located in the avoidance groove, and a projection area formed by orthographic projection of the first glass towards the top surface of the sensing chip covers the whole main section, the two secondary sections and the at least one first connecting pad.

Description

Cavity-free sensing packaging structure and manufacturing method thereof Technical Field The present disclosure relates to sensing packaging, and particularly to a cavity-free sensing packaging and a method for manufacturing the same. Background The existing photoelectric packaging structure is that glass is arranged on a shell, and then a photoelectric component is sealed in the shell. However, the existing photoelectric packaging structure needs to manufacture corresponding molds for different housings, and the size of the existing photoelectric packaging structure is difficult to be effectively reduced. Accordingly, the present inventors considered that the above-mentioned drawbacks could be improved, and have intensively studied and combined with the application of scientific principles, and finally have proposed an invention which is reasonable in design and effectively improves the above-mentioned drawbacks. Disclosure of Invention The embodiment of the invention provides a cavity-free sensing packaging structure and a manufacturing method thereof, which can effectively improve the defects possibly generated by the existing photoelectric packaging structure. The embodiment of the invention discloses a cavity-free sensing packaging structure, which comprises a substrate, a sensing module, a first transparent bonding layer, a first glass and a second transparent bonding layer, wherein the substrate is provided with an upper plate surface and a lower plate surface which are respectively positioned at two opposite sides, the sensing module is arranged on the substrate and comprises a sensing chip which is arranged on the upper plate surface of the substrate and electrically coupled with the substrate, the top surface of the sensing chip is provided with a sensing area, the first transparent bonding layer is adhered to the top surface of the sensing chip and covers the sensing area, the first glass is adhered to the first transparent bonding layer, the first glass corresponds to a first spectrum band, the light emitting module is arranged on the substrate and is spaced on the sensing module, the light emitting module comprises a light emitting chip which is arranged on the upper plate surface of the substrate and electrically coupled with the substrate, the second transparent bonding layer is adhered to the light emitting chip and covers the light emitting surface of the light emitting chip, the second glass is adhered to the second transparent bonding layer, the outer surface of the second glass is coplanar to the outer surface of the first glass, the second glass corresponds to the first glass, the first glass is different from the first spectrum band, the light transmitting module is buried on the outer surface of the first glass, and the light transmitting module is different from the outer surface of the first spectrum module, and the light transmitting module is not covered by the light transmitting part of the first spectrum module, and is different from the light transmitting part of the first spectrum module. Optionally, the substrate comprises at least one first bonding pad and at least one second bonding pad on the upper surface, the sensing chip comprises at least one first connecting pad on the top surface, the light emitting chip comprises at least one second connecting pad adjacent to the light emitting surface, the sensing module comprises at least one first metal wire connecting the at least one first bonding pad and the at least one first connecting pad and at least partially embedded in the light-tight package, and the light emitting module comprises at least one second metal wire connecting the at least one second bonding pad and the at least one second connecting pad and at least partially embedded in the light-tight package. Optionally, the at least one first metal line is completely embedded within the opaque package. Optionally, the sensing region comprises a main section and two sub-sections extending from the main section, at least one first connection pad is located in a region surrounded by the main section and the two sub-sections, wherein a projection region formed by orthographic projection of the first glass towards the top surface of the sensing chip covers the whole main section but does not cover the two sub-sections and the at least one first connection pad. The sensing area comprises a main section and two secondary sections extending from the main section, at least one first connecting pad is located in an area surrounded by the main section and the two secondary sections, the first glass is provided with an inner surface located on the opposite side of the outer surface and a avoidance groove concaved from the inner surface, a part of at least one first metal wire is located in the avoidance groove, and a projection area formed by orthographic projection of the first glass towards the top surface of the sensing chip covers the whole main section, the two secondary sec