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CN-122002996-A - Display panel and display device

CN122002996ACN 122002996 ACN122002996 ACN 122002996ACN-122002996-A

Abstract

The embodiment of the application provides a display panel and a display device, wherein the display panel comprises a substrate, a light emitting chip and a driving chip which are arranged on the substrate in an array manner, and a circuit layer for conducting the light emitting chip and the driving chip, the substrate comprises a first substrate and a second substrate, the circuit layer is arranged between the first substrate and the second substrate, the driving chip is arranged on the first surface of the first substrate, and the light emitting chip is arranged on the second surface of the second substrate, which is away from the first substrate. According to the display panel and the display device provided by the embodiment of the application, the light emitting chip and the driving chip are respectively arranged on the opposite surfaces of different substrates, so that the situation that the driving chip blocks the light of the light emitting chip is thoroughly avoided, the visual angle of the display module is effectively improved, and the brightness attenuation and the color drift are avoided when the display module is observed at a large visual angle.

Inventors

  • HE HAILONG
  • YE LIDAN

Assignees

  • 惠科股份有限公司

Dates

Publication Date
20260508
Application Date
20260409

Claims (10)

  1. 1. The display panel is characterized by comprising a substrate, a light emitting chip and a driving chip which are arranged on the substrate in an array manner, and a circuit layer for conducting the light emitting chip and the driving chip; The substrate comprises a first substrate and a second substrate, the circuit layer is arranged between the first substrate and the second substrate, the driving chip is arranged on the first surface of the first substrate, and the light-emitting chip is arranged on the second surface of the second substrate, which is away from the first substrate.
  2. 2. The display panel of claim 1, wherein the light emitting chip array is disposed on the second surface of the second substrate, and a first mounting space is formed on the first surface of the first substrate in an array manner, and the first mounting space is used for fixedly mounting the driving chip.
  3. 3. The display panel of claim 2, wherein the first mounting space is a first mounting hole, a first bonding pad for fixing the driving chip is disposed in the first mounting hole, a second bonding pad for fixing the light emitting chip is disposed on the second surface of the second substrate, and both the first bonding pad and the second bonding pad are in conduction with the circuit layer.
  4. 4. The display panel of claim 2, wherein the first mounting space is a first accommodating groove, a first bonding pad for fixing the driving chip is disposed at a bottom of the first accommodating groove, a second bonding pad for fixing the light emitting chip is disposed on a second surface of the second substrate, and both the first bonding pad and the second bonding pad are in conduction with the circuit layer.
  5. 5. The display panel of claim 1, wherein, A first mounting space is formed in the first substrate, the first mounting space is used for fixedly mounting the driving chip, and the driving chip does not protrude out of the first surface of the first substrate; the second substrate is provided with a second installation space, the second installation space is used for fixedly installing the light-emitting chip, and the light-emitting chip does not protrude out of the second surface of the second substrate.
  6. 6. The display panel of claim 5, wherein the first mounting space is a first mounting hole, a first bonding pad for fixing the driving chip is disposed in the first mounting hole, the second mounting space is a second mounting hole, a second bonding pad for fixing the light emitting chip is disposed in the second mounting hole, and the first bonding pad and the second bonding pad are both in conduction with the circuit layer.
  7. 7. The display panel of claim 5, wherein a positioning member is disposed on a side of the first substrate adjacent to the second substrate, and the first substrate is aligned and attached to the second substrate by the positioning member.
  8. 8. The display panel of claim 5, wherein one first substrate is provided, a plurality of second substrates are provided, and a plurality of second substrates are spliced and arranged on the first substrate.
  9. 9. The display panel according to any one of claims 1 to 8, wherein projections of the light emitting chip and the driving chip in a thickness direction of the substrate are completely overlapped or completely misaligned.
  10. 10. A display device comprising the display panel according to any one of claims 1 to 9.

Description

Display panel and display device Technical Field The application belongs to the technical field of display, and particularly relates to a display panel and a display device. Background As a representative of a new generation of display technology, a Mini LED (LIGHT EMITTING Diode) technology integrates tens of thousands of micro LED chips on a substrate surface, and combines with a partition driving technology, thereby realizing a display effect with high contrast, high brightness and high dynamic range. The technology remarkably improves the picture expressive force through refined backlight control, and becomes one of core solutions of the current high-end display equipment. However, in the existing mainstream Mini LED lamp panel design, the driving chip and the Mini LED light emitting chip generally adopt the same-layer planar arrangement structure. The structure can meet basic functional requirements when the number of the partitions is small, but with the continuous improvement of the display image quality requirements, the density of backlight partitions is obviously increased, and the size and the number of the driving chips are synchronously increased. The height and the size of the driving chip can block light rays with large visual angles, so that the light rays cannot be effectively diffused, the overall visual angle of the display module is narrowed, and brightness attenuation and color drift are easy to occur when the large visual angle is observed. Disclosure of Invention In view of the above, the embodiment of the application provides a display panel and a display device, which are used for solving the technical problem that the light of the light emitting chip is blocked when the driving chip and the light emitting chip of the existing display panel are arranged on the same side. In a first aspect, an embodiment of the present application provides a display panel, including a substrate, a light emitting chip and a driving chip disposed on the substrate in an array, and a circuit layer for conducting the light emitting chip and the driving chip; The substrate comprises a first substrate and a second substrate, the circuit layer is arranged between the first substrate and the second substrate, the driving chip is arranged on the first surface of the first substrate, and the light-emitting chip is arranged on the second surface of the second substrate, which is away from the first substrate. In some embodiments, the light emitting chip array is disposed on the second surface on which the second substrate is mounted, and a first mounting space is formed on the first surface of the first substrate of the substrate in an array manner, and the first mounting space is used for fixedly mounting the driving chip. In some embodiments, the first mounting space is a first mounting hole, a first bonding pad for fixing the driving chip is disposed in the first mounting hole, a second bonding pad for fixing the light emitting chip is disposed on the second surface of the second substrate, and the first bonding pad and the second bonding pad are both in conduction with the circuit layer. In some embodiments, the first mounting space is a first accommodating groove, a first bonding pad for fixing the driving chip is disposed at a bottom of the first accommodating groove, a second bonding pad for fixing the light emitting chip is disposed on a second surface of the second substrate, and the first bonding pad and the second bonding pad are both in conduction with the circuit layer. In some embodiments, a first mounting space is formed on the first substrate, where the first mounting space is used for fixedly mounting the driving chip, and the driving chip does not protrude from the first surface of the first substrate; the second substrate is provided with a second installation space, the second installation space is used for fixedly installing the light-emitting chip, and the light-emitting chip does not protrude out of the second surface of the second substrate. In some embodiments, the first mounting space is a first mounting hole, a first bonding pad for fixing the driving chip is disposed in the first mounting hole, the second mounting space is a second mounting hole, a second bonding pad for fixing the light emitting chip is disposed in the second mounting hole, and the first bonding pad and the second bonding pad are both in conduction with the circuit layer. In some embodiments, a positioning member is disposed on a side of the first substrate adjacent to the second substrate, and the first substrate is aligned and attached to the second substrate by the positioning member. In some embodiments, one first substrate is provided, a plurality of second substrates are provided, and a plurality of second substrates are spliced and arranged on the first substrate. In some embodiments, the projections of the light emitting chip and the driving chip in the thickness direction of the substrate are completely coin