CN-122003027-A - Electronic device and method of manufacturing the same

Abstract

The present application relates to an electronic device and a method of manufacturing the same. A method of manufacturing an electronic device includes providing a preliminary display device including a display panel and a polarizer stacked on the display panel, wherein the preliminary display device includes an opening processing area defined by an opening processing line. The method further includes forming an opening line by irradiating the opening processing line with a laser beam. Irradiation of the opening processing line with the laser beam starts at an intersection point on the opening processing line. The intersection point is spaced apart from a split point at which a virtual vertical line perpendicular to the stretching axis of the polarizing plate and passing through the center of the opening processing region intersects the opening processing line in the laser moving direction.

Inventors

• LU JINYU

Assignees

• 三星显示有限公司

Dates

Publication Date

20260508

Application Date

20251029

Priority Date

20241101

Claims (10)

1. 1. A method of manufacturing an electronic device, comprising: Providing a preliminary display device including a display panel and a polarizing plate stacked on the display panel, wherein the preliminary display device includes an opening processing area defined by an opening processing line, and Forming an opening line by irradiating the opening processing line with a laser beam, Wherein irradiating the opening processing line with the laser beam starts at an intersection point on the opening processing line, and Wherein the intersection point is spaced apart from a split point at which a virtual vertical line perpendicular to a stretching axis of the polarizing plate and passing through a center of the opening processing region intersects the opening processing line in a laser moving direction.
2. 2. The method of claim 1, wherein forming the opening line comprises: Irradiating a first region between a start point positioned adjacent to the intersection point in the open processing region and the intersection point with the laser beam to form a cutting start line; irradiating the opening processing line with the laser beam from the intersection point along the opening processing line to form an opening forming line, and After the opening forming line reaches the intersection, a second region between the intersection and an ending point of the opening processing region located adjacent to the intersection is irradiated with the laser beam to form a cutting ending line.
3. 3. The method of claim 2, wherein an angle formed by the intersection point, the center of the opening machining region, and the split point exceeds 0 ° and is less than 45 °.
4. 4. The method of claim 2, wherein the split comprises a first split and a second split, the first split and the second split facing each other with the center of the open machining region interposed therebetween, The intersection points include a first intersection point and a second intersection point adjacent to the first split point and the second split point respectively, The start point includes a first start point and a second start point adjacent to the first intersection point and the second intersection point, respectively, and The termination points include a first termination point and a second termination point adjacent the first intersection point and the second intersection point, respectively.
5. 5. The method of claim 4, wherein the first intersection point and the second intersection point are symmetrical with respect to the center of the open machining region.
6. 6. The method of claim 4, wherein the open machining region is divided from the first split point into a first quadrant, a second quadrant, a third quadrant, and a fourth quadrant along the laser movement direction, The first intersection point is located on a portion of the opening machining line in the first quadrant and the second intersection point is located on a portion of the opening machining line in the third quadrant, and Wherein the first start point and the first end point are located in the first quadrant and the second start point and the second end point are located in the third quadrant.
7. 7. The method of claim 4, wherein forming the opening line further comprises performing a first sub-cutting process using the first start point, the first intersection point, and the first end point, and performing a second sub-cutting process using the second start point, the second intersection point, and the second end point, and Wherein the first sub-cutting process and the second sub-cutting process are alternately and repeatedly performed.
8. 8. An electronic device, comprising: A display panel; a polarizing plate disposed on the display panel, and An opening penetrating the polarizing plate and the display panel, and including a tip portion, Wherein the tip portion is spaced apart along an intersection point where an opening line and a virtual vertical line, which passes through a center of the opening and is perpendicular to a stretching axis of the polarizing plate, meet the opening line defining a circumference of the opening.
9. 9. The electronic device of claim 8, wherein the tip portion has a concave curved surface in an outward direction of the opening, and The distance between the center point of the opening line included in the tip portion and the peak point of the curved surface is in a range from 10 μm to 90 μm.
10. 10. The electronic device of claim 8, further comprising: a functional device inserted into or arranged to overlap the opening, wherein the functional device comprises at least one of an optical device, an acoustic element and a sensor device.

Description

Electronic device and method of manufacturing the same Cross Reference to Related Applications The present application claims priority from korean patent application No. 10-2024-0153181 filed on 1 of 11 of 2024 and 10-2025-0060565 filed on 9 of 5 of 2025, the disclosures of which are incorporated herein by reference in their entireties. Technical Field Embodiments of the present disclosure relate to an electronic device and a method of manufacturing the same. More particularly, embodiments of the present disclosure relate to an electronic device including a display panel and a method of manufacturing the electronic device. Background In display devices such as Organic Light Emitting Diode (OLED) display devices and liquid crystal display devices (LCDs), display substrates including, for example, thin Film Transistors (TFTs) and various types of wirings are provided. A display structure including an electrode and an emission layer may be formed on a display substrate. Recently, electronic devices in which a sensor, a camera, and the like are combined with a display device to realize a display function are implemented in the form of, for example, a smart phone, a monitor, a vehicle screen, and the like. Disclosure of Invention According to aspects of the present disclosure, electronic devices having improved optical properties and mechanical reliability are provided. According to aspects of the present disclosure, methods of manufacturing electronic devices with improved optical properties and mechanical reliability are provided. According to an embodiment of the present disclosure, a method of manufacturing an electronic device includes providing a preliminary display device including a display panel and a polarizing plate stacked on the display panel, wherein the preliminary display device includes an opening processing area defined by an opening processing line. The method further includes forming an opening line by irradiating the opening processing line with a laser beam. Irradiation of the opening processing line with the laser beam starts at an intersection point on the opening processing line. The intersection point is spaced apart from a split point at which a virtual vertical line perpendicular to the stretching axis of the polarizing plate and passing through the center of the opening processing region intersects the opening processing line in the laser moving direction. In some embodiments, forming the opening line includes irradiating a first region between a start point positioned adjacent to an intersection point in the opening processing region and the intersection point with a laser beam to form a cut start line. The method further includes irradiating the opening processing line with a laser beam from the intersection point along the opening processing line to form an opening forming line. The method further includes irradiating a second region between the intersection point and a termination point in the open processing region located adjacent to the intersection point with the laser beam after the opening forming line reaches the intersection point to form a cut termination line. In some embodiments, the angle formed by the intersection point, the center of the open machining region, and the split point is greater than about 0 ° and less than about 45 °. In some embodiments, the split point includes a first split point and a second split point, the first split point and the second split point facing each other, and a center of the open machining region is interposed between the first split point and the second split point. The intersection point includes a first intersection point and a second intersection point adjacent to the first split point and the second split point, respectively. The start points include a first start point and a second start point adjacent to the first intersection point and the second intersection point, respectively. The termination points include a first termination point and a second termination point adjacent the first intersection point and the second intersection point, respectively. In some embodiments, the first intersection point and the second intersection point are symmetrical with respect to a center of the open machining region. In some embodiments, the open machining region is divided from the first split point into a first quadrant, a second quadrant, a third quadrant, and a fourth quadrant along the laser movement direction. The first intersection point is located on a portion of the open machining line in the first quadrant and the second intersection point is located on a portion of the open machining line in the third quadrant. In some embodiments, the first start point and the first end point are located in a first quadrant and the second start point and the second end point are located in a third quadrant. In some embodiments, forming the opening line includes performing a first sub-cutting process using a first starting point, a first interse