CN-122003033-A - Display panel, electronic device, and method of manufacturing display panel

Abstract

The present disclosure relates to a display panel, an electronic device, and a method of manufacturing the display panel. The display panel includes a pixel circuit disposed on a substrate and including a thin film transistor, a capacitor, and a dual contact hole, and a light emitting element electrically connected to the pixel circuit, wherein the dual contact hole includes a lower contact hole defined in a first insulating layer on the substrate, a lower conductive layer disposed on a top surface of the first insulating layer and inside the lower contact hole, an inorganic material filled in a recess provided in the lower conductive layer due to the lower contact hole, an intermediate conductive layer disposed on the lower conductive layer and the inorganic material, an upper contact hole defined in a second insulating layer on the first insulating layer, and an upper conductive layer disposed on a top surface of the second insulating layer and inside the upper contact hole and connected to the intermediate conductive layer.

Inventors

• Ruan Chengjin
• Jin Douna
• Jin Taihui
• Yu Xingxu
• Li Dugui
• Che Minggen
• CUI XIANGQIAN

Assignees

• 三星显示有限公司

Dates

Publication Date

20260508

Application Date

20251105

Priority Date

20241105

Claims (20)

1. 1. A display panel, comprising: a substrate; A pixel circuit on the substrate and including: at least one thin film transistor; At least one capacitor, and At least one double contact hole, and A light emitting element electrically connected to the pixel circuit, Wherein the dual contact hole includes: a lower contact hole defined in the first insulating layer on the substrate; A lower conductive layer on a top surface of the first insulating layer and inside the lower contact hole; an inorganic material filled in a recess provided in the lower conductive layer due to the lower contact hole; An intermediate conductive layer on the lower conductive layer and the inorganic material; an upper contact hole defined in the second insulating layer on the first insulating layer, and And an upper conductive layer on a top surface of the second insulating layer and inside the upper contact hole, and connected to the intermediate conductive layer.
2. 2. The display panel of claim 1, wherein the inorganic material comprises metal oxides and/or agglomerated nanoparticles of metals.
3. 3. The display panel of claim 1, wherein the inorganic material comprises at least one material selected from BaTiO 3 、BaSO 3 、BaSO 4 、Ba(NO 3 ) 2 、TiO 2 、SiO 2 and ZnO.
4. 4. The display panel of claim 1, wherein the inorganic material comprises at least one material selected from silver, gold, platinum, and palladium.
5. 5. The display panel of claim 1, wherein the upper contact hole overlaps the lower contact hole.
6. 6. The display panel according to claim 1, wherein the dual contact hole further comprises a protective film disposed along a shape of the lower conductive layer inside the recess, and a buffer film on the protective film.
7. 7. The display panel of claim 6, wherein the buffer film comprises a different material than the inorganic material.
8. 8. The display panel of claim 1, wherein The at least one thin film transistor includes a first thin film transistor and a second thin film transistor, and The at least one dual contact hole includes a first dual contact hole and a second dual contact hole, and Wherein the first double contact hole connects the semiconductor layer of the first thin film transistor to the pixel electrode of the light emitting element.
9. 9. The display panel of claim 8, wherein the at least one capacitor comprises a first capacitor and a second capacitor, and Wherein the second dual contact hole connects the semiconductor layer of the second thin film transistor to the second capacitor.
10. 10. The display panel of claim 9, wherein the first capacitor overlaps the first thin film transistor.
11. 11. A method of manufacturing a display panel, comprising: Forming a conductive layer on a substrate; Forming a first insulating layer covering the conductive layer, and forming a lower contact hole in the first insulating layer, a portion of the conductive layer being exposed through the lower contact hole; forming a lower conductive layer connected to the conductive layer along an inner surface of the lower contact hole from a top surface of the first insulating layer; coating a dispersion solution in which inorganic nanoparticles are dispersed on the first insulating layer to cover the lower conductive layer, and An annealing process is performed such that the inorganic nanoparticles are agglomerated and filled in the recesses provided in the lower conductive layer due to the lower contact holes.
12. 12. The method of claim 11, further comprising cleaning the inorganic nanoparticles disposed outside the recess after the annealing.
13. 13. The method of claim 11, further comprising: forming an intermediate conductive layer over the recess filled with the inorganic nanoparticles; Forming a second insulating layer on the first insulating layer to cover the intermediate conductive layer, and forming an upper contact hole in the second insulating layer, a portion of the intermediate conductive layer being exposed through the upper contact hole, and An upper conductive layer connected to the intermediate conductive layer is formed along an inner surface of the upper contact hole from a top surface of the second insulating layer.
14. 14. The method of claim 11, wherein the inorganic nanoparticles comprise at least one material selected from BaTiO 3 、BaSO 3 、BaSO 4 、Ba(NO 3 ) 2 、TiO 2 、SiO 2 and ZnO.
15. 15. The method of claim 11, wherein the inorganic nanoparticles comprise at least one material selected from silver, gold, platinum, and palladium.
16. 16. The method of claim 11, further comprising forming a protective film on the lower conductive layer prior to the applying the dispersion solution.
17. 17. The method of claim 16, further comprising: Partially filling an inner region of the lower contact hole by depositing a buffer film thicker than the protective film on the protective film by a chemical vapor deposition method, and The buffer film formed on the first insulating layer is removed using a chemical mechanical polishing process.
18. 18. The method of claim 17, wherein the buffer film is formed of a different material than the inorganic nanoparticles.
19. 19. An electronic device, comprising: a display panel including dual contact holes, and A cover unit supporting and accommodating the display panel, Wherein the dual contact hole includes: a lower contact hole defined in the first insulating layer; A lower conductive layer on a top surface of the first insulating layer and inside the lower contact hole; an inorganic material filled in a recess provided in the lower conductive layer due to the lower contact hole; An intermediate conductive layer on the lower conductive layer and the inorganic material; an upper contact hole defined in the second insulating layer on the first insulating layer, and And an upper conductive layer on a top surface of the second insulating layer and inside the upper contact hole, and connected to the intermediate conductive layer.
20. 20. The electronic device of claim 19, wherein the electronic device is a smart phone or a glasses type display device.

Description

Display panel, electronic device, and method of manufacturing display panel Cross Reference to Related Applications The present application claims priority and rights of korean patent application No. 10-2024-0155682 filed at the korean intellectual property office on day 11 and 5 of 2024, the entire disclosure of which is incorporated herein by reference. Technical Field One or more embodiments of the present disclosure relate to a display panel, an electronic device including the display panel, and a method of manufacturing the display panel. Background Recently, display devices have been used for various purposes. As the thickness and weight of display devices have been reduced, the range of applications of display devices has been greatly expanded. A display device generally includes a display panel, and the display panel includes a display element employing one or more pixels and one or more pixel circuits for controlling an electric signal applied to the display element. The pixel circuit includes one or more Thin Film Transistors (TFTs), one or more capacitors, and a plurality of wirings. Significant research and development efforts have recently focused on the arrangement of thin film transistors, capacitors, wirings, and contact holes to achieve high resolution and high integration of display devices. Disclosure of Invention One or more aspects of embodiments of the present disclosure are directed to a display device including a display panel having high resolution and high integration, an electronic apparatus including the display panel, and a method of manufacturing the display panel. However, aspects of the present disclosure are not limited thereto. Additional aspects will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the embodiments. According to one or more embodiments, a display panel includes a substrate, a pixel circuit on (e.g., disposed on) the substrate and including at least one thin film transistor, at least one capacitor, and at least one dual contact hole, and a light emitting element electrically connected to the pixel circuit, wherein the dual contact hole includes a lower contact hole defined in a first insulating layer on the substrate, a lower conductive layer on (e.g., disposed on) a top surface of the first insulating layer and inside the lower contact hole, an inorganic material filled in a recess provided in the lower conductive layer due to the lower contact hole, an intermediate conductive layer on (e.g., disposed on) the lower conductive layer and the inorganic material, an upper contact hole defined in a second insulating layer on the first insulating layer, and an upper conductive layer on (e.g., disposed on) a top surface of the second insulating layer and inside the upper contact hole, and connected to the intermediate conductive layer. In one or more embodiments, the inorganic material may be provided by agglomeration of nanoparticles formed from (e.g., including) metal oxides and/or metals. For example, the inorganic material may include metal oxides and/or agglomerated nanoparticles of metals. In one or more embodiments, the inorganic material may include at least one material selected from BaTiO 3、BaSO3、BaSO4、Ba(NO3)2、TiO2、SiO2 and ZnO. In one or more embodiments, the inorganic material may include at least one material selected from silver (Ag), gold (Au), platinum (Pt), and palladium (Pd). In one or more embodiments, the upper contact hole may overlap with the lower contact hole. In one or more embodiments, the dual contact hole may further include a protective film disposed along a shape of the lower conductive layer inside the recess, and a buffer film disposed on (e.g., on) the protective film. In one or more embodiments, the buffer film may be formed of a material different from the inorganic material. In one or more embodiments, the at least one thin film transistor may include a first thin film transistor and a second thin film transistor, and the at least one dual contact hole may include a first dual contact hole and a second dual contact hole, wherein the first dual contact hole connects a semiconductor layer of the first thin film transistor to a pixel electrode of the light emitting element. In one or more embodiments, the at least one capacitor may include a first capacitor and a second capacitor, wherein the second dual contact hole connects the semiconductor layer of the second thin film transistor to the second capacitor. In one or more embodiments, the first capacitor may overlap the first thin film transistor. According to one or more embodiments, a method of manufacturing a display panel includes forming a conductive layer on a substrate, forming a first insulating layer covering the conductive layer, and forming a lower contact hole in the first insulating layer, a portion of the conductive layer being exposed through the lower contact hole, forming a l