CN-122003041-A - Display device and method for manufacturing the same

Abstract

Disclosed are a display device and a method for manufacturing the same, which can prevent or reduce a cathode lifting phenomenon from occurring when a temporary protective film is removed. The display device includes a substrate including a display region and a non-display region, a thin film transistor disposed on the substrate in the display region, a planarization layer disposed in the display region and in the non-display region on the thin film transistor, and having a first contact hole on the thin film transistor, a bank layer disposed in the display region and the non-display region on the planarization layer, and having an opening region in a light emitting region, a light emitting element disposed on the planarization layer to be connected to the thin film transistor through the first contact hole, and an organic insulating layer pattern disposed on the bank layer in the non-display region to cover an end of a cathode of the light emitting element.

Inventors

• Han Kuiheng
• Lin Xianpei
• LI YUNSHUO
• CHE YANHAO
• Quan Enlv
• SHEN XIANGBIN
• HAN DAXI

Assignees

• 乐金显示有限公司

Dates

Publication Date

20260508

Application Date

20250911

Priority Date

20241104

Claims (20)

1. 1. A display device includes: A substrate including a display region configured to display an image and a non-display region disposed around the display region; a thin film transistor disposed on the substrate in the display region; a planarization layer disposed in the non-display region and disposed in the display region on the thin film transistor, the planarization layer having a first contact hole on the thin film transistor; a bank layer disposed in the display region and the non-display region on the planarization layer, the bank layer having an opening region; A light emitting element disposed on the planarization layer to be connected to the thin film transistor through the first contact hole, and An organic insulating layer pattern disposed on the bank layer in the non-display region to cover an end portion of a cathode of the light emitting element.
2. 2. The display device according to claim 1, further comprising: and a metal pattern disposed on the bank layer in the non-display region.
3. 3. The display device according to claim 2, wherein the metal pattern is provided at the end portion of the cathode.
4. 4. The display device according to claim 1, further comprising: A voltage supply line disposed under the planarization layer in the non-display region to supply a voltage, and A connection electrode disposed on the planarization layer in the non-display region, Wherein the connection electrode is electrically connected to the voltage supply line through a second contact hole formed in the planarization layer.
5. 5. The display device according to claim 4, wherein the cathode of the light-emitting element is connected to the connection electrode through a third contact hole formed in the bank layer in the non-display region.
6. 6. The display device of claim 5, wherein the organic insulating layer pattern covers the end portion of the cathode, the third contact hole, and an end portion of the bank layer.
7. 7. The display device according to claim 1, further comprising: and an encapsulation layer disposed on the cathode and the organic insulation layer pattern.
8. 8. The display device of claim 7, wherein the encapsulation layer comprises: A first inorganic encapsulation layer extending from the display region to the non-display region such that the first inorganic encapsulation layer is disposed in both the display region and the non-display region, the first inorganic encapsulation layer extending to a bezel region via the organic insulation layer pattern; an organic encapsulation layer disposed on the first inorganic encapsulation layer, the organic encapsulation layer extending from the display region to the organic insulation layer pattern, and And a second inorganic encapsulation layer disposed on the organic encapsulation layer, the second inorganic encapsulation layer extending from the display region to the bezel region via the organic insulation layer pattern.
9. 9. The display device of claim 1, wherein the organic insulating layer pattern comprises a high viscosity material.
10. 10. The display device according to claim 9, wherein the organic insulating layer pattern comprises a non-photosensitive organic insulating material or a photosensitive organic insulating material.
11. 11. The display device according to claim 10, wherein the non-photosensitive organic insulating material is an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, a polyimide resin, polyethylene, or silicon oxycarbide.
12. 12. The display device according to claim 10, wherein the photosensitive organic insulating material is photoreactive acrylic.
13. 13. A method of manufacturing a display device, the method comprising the steps of: preparing a substrate including a display region configured to display an image and a non-display region disposed around the display region; Forming a thin film transistor on the substrate in the display region; forming a voltage supply line on the substrate in the non-display region; Forming a planarization layer on the thin film transistor and the voltage supply line such that the planarization layer has a first contact hole on the thin film transistor and a second contact hole on the voltage supply line, respectively; forming an anode of a light emitting element on the planarization layer such that the anode is connected to the thin film transistor through the first contact hole; Forming a connection electrode on the planarization layer such that the connection electrode is connected to the voltage supply line through the second contact hole; forming a bank layer on the planarization layer having the anode and the connection electrode such that the bank layer has an opening region on the anode and a third contact hole on the connection electrode; Forming a light emitting layer on the anode in the opening region; forming a cathode on the light emitting layer and the bank layer such that the cathode is electrically connected to the connection electrode through the third contact hole, and An organic insulating layer pattern is formed on the bank layer in the non-display region such that the organic insulating layer covers an end portion of the cathode, the third contact hole, and an end portion of the bank layer.
14. 14. The method of claim 13, further comprising the step of: A metal pattern is formed between the bank layer and the cathode in the non-display region such that the metal pattern overlaps the end portion of the cathode.
15. 15. The method according to claim 14, wherein the end portion of the cathode overlapping the metal pattern is removed by laser irradiation.
16. 16. The method of claim 13, further comprising the step of: an encapsulation layer is formed on the cathode and the organic insulation layer pattern.
17. 17. The method of claim 16, wherein the encapsulation layer comprises: A first inorganic encapsulation layer extending from the display region to the non-display region such that the first inorganic encapsulation layer is disposed in both the display region and the non-display region, the first inorganic encapsulation layer extending to a bezel region via the organic insulation layer pattern; an organic encapsulation layer disposed on the first inorganic encapsulation layer, the organic encapsulation layer extending from the display region to the organic insulation layer pattern, and And a second inorganic encapsulation layer disposed on the organic encapsulation layer, the second inorganic encapsulation layer extending from the display region to the bezel region via the organic insulation layer pattern.
18. 18. The method of claim 16, further comprising the step of: A temporary protective film is bonded to the encapsulation layer.
19. 19. The method of claim 18, further comprising the step of: After the temporary protective film is removed, a polarizing plate, a touch sensor, and a cover glass are sequentially attached.
20. 20. The method of claim 13, wherein the organic insulating layer pattern comprises a non-photosensitive organic insulating material or a photosensitive organic insulating material.

Description

Display device and method for manufacturing the same Technical Field The present disclosure relates to a display device, and more particularly, to a display device capable of preventing or reducing a cathode lifting phenomenon from occurring when a temporary protective film is removed, and a method of manufacturing the same. Background Image display devices that present various information on a screen are core technologies in the information communication age, and are evolving toward thinner, lighter, more portable, and higher performance. Accordingly, emphasis is being placed on display devices that can be manufactured to have a light and thin structure. As specific examples of such display devices, there are Liquid Crystal Display (LCD) devices, quantum Dot (QD) display devices, field Emission Display (FED) devices, organic Light Emitting Diode (OLED) display devices, and the like. An OLED display device includes a light emitting diode including a cathode and an anode facing each other between organic light emitting layers. When holes and electrons injected into the organic light emitting layer from the cathode and anode, respectively, are recombined with each other in the organic light emitting layer, light is emitted and thus an image is displayed. Accordingly, the OLED display device is a self-luminous display device, and thus, is advantageous not only in terms of power consumption according to low-voltage driving, but also has excellent color rendering, fast response time, wide viewing angle, and high Contrast Ratio (CR). In this regard, OLED display devices are emphasized as next-generation display devices, and research is being conducted thereon. Meanwhile, in recent years, demand for flexible display devices using a flexible substrate such as a plastic substrate has increased. Such a flexible display device has advantages of large screen display and portability because the flexible display device is portable in a folded state and displays an image in an unfolded state. Since such a plastic substrate has a flexible characteristic, it is difficult to use the plastic substrate itself in a manufacturing process of a display device. Thus, the process is performed under the condition that the plastic substrate is attached to one surface of the carrier substrate such as a glass substrate. That is, a plastic substrate is formed on a carrier substrate, and then a thin film transistor array layer, a light emitting element array layer, and a package layer are sequentially formed on the plastic substrate. Subsequently, a temporary protective film is attached to the encapsulation layer. Thereafter, the carrier substrate is removed from the plastic substrate, and the temporary protective film is removed from the encapsulation layer. Finally, the polarizer and cover glass are bonded to the encapsulation layer. The description provided in the discussion of the background section should not be considered prior art merely because of the mention in or association with this section. The discussion of the background section may include information describing one or more aspects of the subject technology, and the description in this section is not intended to limit the present disclosure. Disclosure of Invention The inventors of the present disclosure have recognized that in the manufacturing process as described above, a phenomenon in which the end portion of the cathode is lifted up may occur due to a force applied when the temporary protective film is removed, and thus a malfunction may occur. Accordingly, the present disclosure is directed to a display device and a method of manufacturing the same that substantially obviate one or more problems due to limitations and disadvantages of the related art. An object of the present disclosure is to provide a display device and a method of manufacturing the same, which can prevent or reduce a cathode lifting phenomenon from occurring when a temporary protective film is removed, thereby preventing or reducing occurrence of a malfunction and achieving an improvement in yield. The objects of the present disclosure are not limited to the above objects, and other objects of the present disclosure, which are not described, will be more clearly understood by those skilled in the art from the following detailed description. According to one aspect of the present disclosure, a display device may include a substrate including a display region configured to display an image and a non-display region disposed around the display region, a thin film transistor disposed on the substrate in the display region, a planarization layer disposed in the display region and in the non-display region on the thin film transistor, the planarization layer having a first contact hole on the thin film transistor, a bank layer disposed in the display region and the non-display region on the planarization layer, and the bank layer having an opening region in a light emitting region, a light emitting elemen