CN-122003088-A - Semiconductor refrigerator processing technology

CN122003088ACN 122003088 ACN122003088 ACN 122003088ACN-122003088-A

Abstract

The invention discloses a processing technology of a semiconductor refrigerator, and aims to solve the defects that the processing efficiency of the semiconductor refrigerator is low and the mixing phenomenon is easy to occur. The method comprises the following steps of S1, loading a positioning jig into a vibration frame, wherein the positioning jig comprises a bottom plate and a grating plate, semiconductor particles fall into positioning holes on the grating plate through vibration, S2, loading substrates on two printing jigs and finishing solder paste printing, S3, ejecting the semiconductor particles from the positioning holes by ejector pins through movement of the printing jigs and adhering the semiconductor particles between the upper substrate and the lower substrate through solder paste to form a welding body, and S4, and forming the semiconductor device after the welding body is welded. The technical scheme of this patent application can once only assemble a plurality of products to improve production efficiency, reduce manufacturing cost, the difficult compounding phenomenon that appears in the course of working moreover.

Inventors

JIN XINFENG
JIA XIANGJUN

Assignees

浙江先导热电科技股份有限公司

Dates

Publication Date: 20260508
Application Date: 20251222

Claims (10)

1. A processing technology of a semiconductor refrigerator is characterized by comprising the following steps of S1, loading a positioning jig into a vibration frame, wherein the positioning jig comprises a bottom plate and a grating plate, semiconductor particles fall into positioning holes in the grating plate through vibration, S2, loading substrates on two printing jigs and completing solder paste printing, S3, enabling the semiconductor particles to be ejected out of the positioning holes by ejector pins through movement of the printing jigs and adhered between the upper substrate and the lower substrate through solder paste to form a welding body, and S4, and forming the semiconductor device after the welding body is welded.
2. The process of claim 1, wherein two vibration frames are provided in S1, N-type semiconductor particles and P-type semiconductor particles are respectively mounted in the two vibration frames, the positioning jig is sequentially mounted in the two vibration frames, the positioning holes corresponding to the P-type semiconductor particles are covered by the anti-mixing sheet during the mounting of the N-type semiconductor particles, and the positioning holes corresponding to the N-type semiconductor particles are covered by the anti-mixing sheet during the mounting of the P-type semiconductor particles.
3. The process of claim 1, wherein the top mold tool is pressed against the grid plate and turned over before S3, the bottom plate is removed, the ejector pins are disposed on the top mold tool, the printing tool is first pushed against the grid plate when S3, the substrate pushes the grid plate downward, the ejector pins support the semiconductor particles to adhere the semiconductor particles to the substrate by solder paste, and then the printing tool is moved upward, transferred to the upper side of another printing tool and moved downward to adhere the lower ends of the semiconductor particles to another substrate.
4. The process of claim 3, wherein the grid plate is provided with a buffer column, the top mold jig is provided with a buffer hole, the top mold jig is provided with an elastic pin, the end part of the elastic pin extends to the buffer hole, the end part of the elastic pin is provided with an inclined pushing surface, the buffer column is sleeved with a positioning spring, the buffer column is provided with a positioning clamping groove, after the top mold jig is pressed to the grid plate, the buffer hole is inserted with the buffer column, the end part of the elastic pin is clamped in the positioning clamping groove, and the end part of the thimble is inserted into the positioning hole.
5. A process for preparing the semiconductor refrigerator as claimed in claim 1, wherein the grating plate is installed on the bottom plate in a lifting manner, a pre-tightening spring is installed between the bottom plate and the grating plate, the thimble is correspondingly arranged on the bottom plate and the locating hole, and the end of the thimble is arranged in the locating hole, and S3, the printing jig is firstly leaned against the grating plate, the grating plate is pushed by the substrate to move downwards, the thimble supports the semiconductor particles, so that the semiconductor particles are adhered to the substrate through solder paste, and then the printing jig moves upwards, is transferred to the position above another printing jig and moves downwards, so that the lower end of the semiconductor particles are adhered to the other substrate.
6. The process of claim 1, wherein during S3, the printing jig is absorbed by a vacuum chuck, the vacuum chuck is connected with a mechanical arm, and the printing jig is driven to move by the mechanical arm.
7. The process of claim 6, wherein the vacuum chuck is provided with a vacuum adsorption groove, the printing jig is provided with a plurality of positioning grooves, the substrate is adapted to be installed in the positioning grooves, the bottom of the positioning grooves is provided with through holes communicated with the vacuum adsorption groove, and the printing jig is attached to the surface of the vacuum chuck.
8. The process of claim 1, wherein in S3, a positioning column is disposed on the lower printing jig, a positioning guide hole is disposed on the upper printing jig, the positioning guide hole is inserted into the positioning column, and a locking nut is connected to the positioning column to fasten the two printing jigs.
9. The process of claim 1, wherein in S3, a positioning column is disposed on the lower printing jig, a positioning guide hole is disposed on the upper printing jig, a locking spring pin is mounted on the positioning column, the positioning guide hole is inserted into the positioning column, and the locking spring pin is clamped on the upper surface of the upper printing jig to fasten the two printing jigs.
10. The process of any one of claims 1 to 9, wherein a positioning groove is formed in the vibration frame, the positioning jig is adapted to be mounted in the positioning groove, and a recess is formed in a side wall of the positioning groove.

Description

Semiconductor refrigerator processing technology Technical Field The invention relates to the technical field of semiconductor refrigerators, in particular to a processing technology of a semiconductor refrigerator. Background Along with the continuous development of technology, semiconductor refrigerators gradually transition from industrial markets to consumer markets, are increasingly popular in life, such as mobile phone heat dissipation back clamps, semiconductor refrigeration small fans and the like, and have increasingly large market demands, and the conventional production mode is difficult to meet the current increasing consumption demands in terms of productivity and cost. The thermoelectric semiconductor commonly used at present is generally composed of an upper substrate, a lower substrate and a P/N type semiconductor. The manufacturing modes are mainly modes of mounting a chip mounter or shaking in a single product, and the problems of low efficiency, high cost, easiness in mixing and the like exist. Chinese patent application number 202211187215X discloses a semiconductor refrigerator and a preparation method thereof, wherein an upper ceramic substrate, P-N semiconductor particles and a lower ceramic substrate are sequentially placed from top to bottom to be adhered and fixed, wiring terminals are led out, and welding is carried out to form a semi-finished product, so that the working efficiency is low, the cost is high, and the mixing phenomenon is easy to occur. Disclosure of Invention In order to overcome the defects, the invention provides a processing technology of a semiconductor refrigerator, which can assemble a plurality of products at one time, greatly improves the production efficiency, reduces the production cost and is not easy to generate the mixing phenomenon. The technical scheme includes that the semiconductor refrigerator processing technology comprises the following steps of S1, loading a positioning jig into a vibration frame, enabling semiconductor particles to fall into positioning holes in a grid plate through vibration, S2, loading substrates on two printing jigs and completing solder paste printing, S3, enabling the semiconductor particles to be ejected out of the positioning holes through ejector pins through movement of the printing jigs and to be adhered between the upper substrate and the lower substrate through solder paste to form a welding body, and S4, enabling the welding body to complete welding to form a semiconductor device. The semiconductor refrigerator comprises two substrates and a plurality of thermoelectric semiconductor particles connected between the two substrates, and the thermoelectric semiconductor particles and the two substrates are welded during processing. Firstly, a plurality of semiconductor particles are installed and positioned, in the application, a positioning jig with positioning holes is adopted for vibration screening, the positioning jig is installed in a vibration frame, and the semiconductor particles installed in the vibration frame fall into the positioning holes on a grid plate in the process of vibrating the vibration frame back and forth and left and right. And then loading the substrate on the two printing jigs and completing solder paste printing, driving the grating plate to move through the movement of the printing jigs, ejecting the semiconductor particles out of the positioning holes by the ejector pins and adhering the semiconductor particles onto the substrate through the solder paste, and then transferring the printing jigs to the upper part of the other printing jig and moving downwards, so that the semiconductor particles are adhered with the substrate on the other printing jig through the solder paste. The semiconductor particles are adhered to form a welded body between the two substrates, and then the welded body is put into a welding furnace for welding, and the semiconductor device is formed after the welding is completed. In the scheme of the application, a plurality of thermoelectric semiconductor particles fall into the positioning holes on the grating plate in a vibration screening mode, so that the working efficiency is high, and the positioning is accurate and reliable. Through the movement of the printing jig, the semiconductor particles are adhered between the two substrates to form a welding body, and the welding body is filled into a welding furnace to finish welding once, so that the working efficiency is high. In addition, a plurality of products can be assembled at one time, which is beneficial to improving the production efficiency and reducing the production cost. Preferably, two vibration frames are arranged in the S1, N-type semiconductor particles and P-type semiconductor particles are respectively arranged in the two vibration frames, the positioning jig is sequentially arranged in the two vibration frames, the positioning holes corresponding to the P-type semiconductor particles are covere