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CN-122003115-A - Integrated wafer pretreatment equipment before warehouse entry

CN122003115ACN 122003115 ACN122003115 ACN 122003115ACN-122003115-A

Abstract

The application discloses integrated wafer pretreatment equipment before warehouse entry, which comprises a frame, a dust removing mechanism, a defect detecting device and a conveying mechanism, wherein an upper layer, a middle layer and a lower layer are arranged in the frame from top to bottom, the dust removing mechanism, the defect detecting device and the conveying mechanism are respectively arranged on the upper layer, the middle layer and the lower layer to replace the traditional planar or scattered arrangement, the horizontal and vertical occupied space of the equipment is greatly reduced, the integrated level of the equipment is improved, meanwhile, the defect detecting device adopts a reflection imaging system with a reflector matched with a camera, the camera is not required to be arranged right against a wafer, the space utilization rate is further optimized, in addition, the dust and impurities on the surface of the wafer can be synchronously purged in the process of taking and transferring the wafer by the upper layer downward arranged dust removing mechanism, the transportation and cleaning linkage operation are realized, the processing precision of a subsequent process can be ensured by preventing the wafer carrying pollutants from entering the subsequent processing equipment, and the processing yield of the wafer is improved.

Inventors

  • SONG YONGHUI
  • GUO JUNWEI
  • XU LEI
  • WANG SHIKUAN

Assignees

  • 无锡尚积半导体科技股份有限公司

Dates

Publication Date
20260508
Application Date
20260409

Claims (10)

  1. 1. An integrated pre-processing apparatus for wafer loading, comprising: the machine frame is provided with a three-layer structure, and an upper layer (11), a middle layer (12) and a lower layer (13) are arranged in the machine frame from top to bottom; A dust removing mechanism (20) arranged on the upper layer (11), wherein an air outlet of the dust removing mechanism (20) faces downwards and is used for blowing air flow to the middle layer (12) and the lower layer (13); A defect detection device (30) arranged on the middle layer (12), wherein the defect detection device (30) comprises a reflecting mirror (31) and a camera (32), the reflecting mirror (31) is obliquely arranged and can reflect an image of a wafer at a detection station to be within a shooting range of the camera (32); -a transfer mechanism (40) arranged at the lower layer (13), the middle layer (12) interfacing with a feed device (50), the transfer mechanism (40) being capable of taking a wafer from the feed device (50) and transferring the wafer to the inspection station; In the process of receiving and transferring the wafer by the conveying mechanism (40), the dust removing mechanism (20) works and can blow away dust and impurities attached to the surface of the wafer, so that the accuracy of defect detection is improved.
  2. 2. The integrated wafer pre-warehouse entry pretreatment device according to claim 1, wherein the conveying mechanism (40) delivers wafers along a first horizontal direction, the dust removing mechanism (20) comprises a plurality of blowing nozzles, the blowing nozzles are arranged in one row or a plurality of rows along a second horizontal direction, the first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other, and the distribution length of one row of blowing nozzles in the second horizontal direction is not smaller than the diameter of the wafers so as to realize the complete blowing of the surfaces of the wafers during the movement of the wafers; And/or the dust removing mechanism (20) comprises a first group of nozzles (21 a) and a second group of nozzles (21 b), wherein the blowing direction of the first group of nozzles (21 a) is inclined towards the feeding direction of the wafer delivered by the conveying mechanism (40) so as to form a reverse airflow against the moving direction of the wafer, and the blowing direction of the second group of nozzles (21 b) is inclined towards the direction of the wafer delivered by the conveying mechanism (40) so as to form a forward airflow along the moving direction of the wafer; and/or the air outlet angle of the air blowing nozzle of the dust removing mechanism (20) is adjustable; and/or the blowing nozzle of the dust removing mechanism (20) is a flat wide-angle nozzle or a wide-angle circular nozzle.
  3. 3. The integrated wafer pre-warehouse entry pretreatment device according to claim 1, characterized in that the middle layer (12) is further provided with a dust isolation cover (14), and the defect detection device (30) is arranged in the dust isolation cover (14); the dust screen (14) being open at the top to allow the purge gas flow of the dust removal mechanism (20) into the screen; an extraction opening (15) is arranged at the bottom or the lower part of the side wall of the dust isolation cover (14), and the extraction opening (15) is connected to an external negative pressure system; The side wall of dust cage (14) is equipped with wafer through hole (16), the inner wall of wafer through hole (16) is equipped with gas pocket (17), gas pocket (17) are connected to the air supply, through gas pocket (17) are blown, can the wafer through hole (16) department forms the air curtain, can the targeted wafer of blowing, can prevent the dust intercommunication inside and outside the cover again.
  4. 4. The integrated pre-wafer-warehouse-in pretreatment equipment according to claim 1, characterized in that the transfer mechanism (40) comprises a pick-up (41), the pick-up (41) being adapted to hold a wafer; The surface of the receiving piece (41) is sunken downwards to form a step capable of limiting the wafer, a first auxiliary air hole (42) is formed in the limiting wall of the step, the first auxiliary air hole (42) is connected to a negative pressure system, and the wafer can be pumped nearby, so that the surface of the wafer is ensured to be clean.
  5. 5. The integrated pre-wafer-in-bin pretreatment device of claim 4, wherein the transport mechanism (40) further comprises a circumferential blowing mechanism (43), the circumferential blowing mechanism (43) comprising: The blowing module is rotatably arranged on the receiving piece (41); the rotary driving module is used for driving the blowing module to do circular motion around the receiving piece (41); In the process of picking up and transferring the wafer by the picking-up piece (41), the blowing module blows air towards the wafer, and the rotary driving module drives the blowing module to rotate around the wafer at least one circle so as to comprehensively purge the wafer, thereby ensuring the surface of the wafer to be clean.
  6. 6. Integrated pre-processing device for wafers in advance according to claim 1, characterized in that the transfer mechanism (40) is integrated with an auxiliary pre-processing module comprising centering calibration components and/or weight sensors for physical centering and/or weight detection of the wafers after the transfer mechanism (40) takes them.
  7. 7. The integrated wafer pre-warehouse entry pretreatment device of claim 1, characterized in that the defect detection means (30) further comprises a light source assembly arranged around the detection station or beside the mirror (31) for providing a uniform illumination light path with an optical axis arranged at an angle to an acquisition optical axis of the camera (32) to avoid specular reflection light entering the camera (32) directly; and/or a heating element is arranged on the reflecting mirror (31) and is used for maintaining the temperature of the reflecting mirror (31) above an environmental dew point so as to prevent the surface of the reflecting mirror (31) from fogging; And/or the reflector (31) is coated with an anti-fog coating, which can change the wetting characteristics of the mirror surface and prevent fog from forming; And/or, a micro-positive pressure air curtain nozzle connected with an air source is arranged around the mirror surface of the reflecting mirror (31) and is used for forming an air curtain on the mirror surface so as to prevent dust from adhering and mist from condensing.
  8. 8. The integrated pre-wafer-warehouse-in pretreatment equipment according to claim 1, characterized in that the defect detection device (30) further comprises: The mirror adjusting mechanism comprises a rotation adjusting assembly (71), a telescopic adjusting assembly (72) and a lifting adjusting assembly (73), wherein the rotation adjusting assembly (71) is used for adjusting the inclination angle of the mirror (31), the telescopic adjusting assembly (72) and the lifting adjusting assembly (73) are used for adjusting the relative positions of the mirror (31) and the detection station, and the position state of the mirror (31) is adjusted through the mirror adjusting mechanism, so that the mirror (31) can be ensured to completely reflect a wafer image; And/or a camera adjustment structure (80), by which camera adjustment structure (80) the position state of the camera (32) is adjusted, it can be ensured that the camera (32) completely acquires the reflected image of the mirror (31).
  9. 9. The integrated wafer pre-processing apparatus according to claim 1, wherein the defect detecting device (30) is configured with a pass-sheet passage and a fail-sheet passage in the subsequent stage, the wafer detected as passing is output through the pass-sheet passage, and the wafer detected as failing is output through the fail-sheet passage; The detection station is provided with a lifting thimble (91), and the lifting thimble (91) is used for supporting a wafer; A scrap conveying mechanism (92) is arranged at the disqualified sheet channel; When the defect detection device (30) judges that the wafer is unqualified, the lifting thimble (91) carries the unqualified wafer to descend until the unqualified wafer falls onto the waste wafer conveying mechanism (92), the waste wafer conveying mechanism (92) can transfer the unqualified wafer to the downstream, and the lifting thimble (91) is reset and can support the next wafer to be detected.
  10. 10. The integrated pre-wafer-warehouse entry equipment of any one of claims 1-9, wherein the middle tier (12) is further integrated with an auxiliary process module located downstream of the defect inspection device (30) for performing further auxiliary processing on the inspected wafers, the auxiliary process module comprising at least one of a pre-heat platen, a wafer edge polishing assembly, and a wafer identification read verification assembly; And/or the transfer mechanism (40) comprises a first transfer assembly for transferring wafers from the feed device (50) to the defect detection device (30) and a second transfer assembly for transferring wafers that are inspected to be acceptable from the defect detection device (30) downstream.

Description

Integrated wafer pretreatment equipment before warehouse entry Technical Field The application relates to the technical field of wafer pretreatment, in particular to integrated pretreatment equipment for wafers before entering a bin. Background Before the processing procedures of etching, coating and the like, the wafer needs to be subjected to dust removal and defect detection, if the untreated wafer is directly sent to processing equipment, dust and impurities attached to the surface of the untreated wafer can influence the processing precision of the subsequent process, the pollution of a chamber of the equipment is easy to cause, and meanwhile, the dust shielding can cause misjudgment of defect detection, so that the yield of wafer processing is reduced. In the prior art, special integrated pretreatment equipment is often lacking before a wafer enters a process bin, dust removal and defect detection are mostly in decentralized operation, synchronous linkage pretreatment links are not available, cleaning is difficult to complete in the wafer transferring process, the pretreatment efficiency is low, even if a simple pretreatment structure is arranged, the pretreatment structure is mostly in planar arrangement, dust removal, detection and conveying mechanisms are intensively stacked on the same plane, a large amount of horizontal and vertical spaces are occupied, the equipment integration level is low, and the compact layout requirement of a wafer processing production line cannot be met. In addition, traditional wafer defect detection adopts the shooting mode that the camera is just to the wafer more, needs to reserve a large amount of vertical installation space, has further aggravated the problem that equipment space utilization is low, and does not have real-time dust removal cooperation before detecting, and the dust on wafer surface easily causes the detection image to blur, finally influences the detection accuracy. Disclosure of Invention The application aims to overcome the defects in the prior art and provides integrated pretreatment equipment for wafers before entering a bin. The application provides integrated wafer pretreatment equipment before entering a bin, which comprises a frame, a dust removing mechanism, a defect detecting device, a conveying mechanism and a middle layer butt joint feeding device, wherein the frame is of a three-layer structure, an upper layer, a middle layer and a lower layer are arranged in the frame from top to bottom, the dust removing mechanism is arranged on the upper layer, an air outlet of the dust removing mechanism faces downwards and is used for blowing air flow to the middle layer and the lower layer, the defect detecting device is arranged on the middle layer and comprises a reflecting mirror and a camera, the reflecting mirror is obliquely arranged and can reflect an image of a wafer at a detection station to a shooting range of the camera, the conveying mechanism is arranged on the lower layer and is in butt joint with the feeding device, the conveying mechanism can receive the wafer from the feeding device and transfer the wafer to the detection station, and the dust removing mechanism works in the process of receiving and transferring the wafer, so that the dust and impurities attached to the surface of the wafer can be blown, and the accuracy of defect detection is improved. Further, the conveying mechanism conveys the wafer along a first horizontal direction, the dust removing mechanism comprises a plurality of air blowing nozzles which are arranged in one row or a plurality of rows along a second horizontal direction, the first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other, the distribution length of one row of air blowing nozzles in the second horizontal direction is not smaller than the diameter of the wafer so as to realize the full blowing of the surface of the wafer in the moving process of the wafer, and/or the dust removing mechanism comprises a first group of nozzles and a second group of nozzles, the air blowing direction of the first group of nozzles is inclined towards the incoming material conveying direction of the wafer, so as to form reverse air flow against the moving direction of the wafer, the air blowing direction of the second group of nozzles is inclined towards the conveying mechanism, so as to form forward air flow along the moving direction of the wafer, and/or the air outlet angle of the air blowing nozzles of the dust removing mechanism is adjustable, and/or the air blowing nozzles of the dust removing mechanism are flat nozzles or round nozzles. The dust isolation cover is provided with a dust isolation cover, the defect detection device is arranged in the dust isolation cover, the top of the dust isolation cover is opened to allow purge air flow of the dust removing mechanism to enter the dust isolation cover, the bottom or the lower part of the side wall o