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CN-122003116-A - Wafer transfer apparatus

CN122003116ACN 122003116 ACN122003116 ACN 122003116ACN-122003116-A

Abstract

The application relates to wafer transfer equipment, which relates to the field of wafer processing equipment and comprises a linear motor, a supporting platform, a driving mechanism, a rotating mechanism, a lifting mechanism and a vacuum sucker, wherein the supporting platform is arranged on the movable end of the linear motor, the driving mechanism is arranged on the supporting platform, the rotating mechanism is arranged on the supporting platform and connected with the driving mechanism, the driving mechanism is used for driving the rotating mechanism to move, the lifting mechanism is connected with the supporting platform and connected with the driving mechanism, the lifting mechanism is connected with the rotating mechanism and used for driving the lifting mechanism to rotate, and the vacuum sucker is arranged on the lifting mechanism. The application has the effects of improving the processing quality of the wafer and improving the transfer efficiency of the wafer.

Inventors

  • ZHANG MIN
  • HAO JINGJING

Assignees

  • 深圳摩天智能装备有限公司

Dates

Publication Date
20260508
Application Date
20240315

Claims (8)

  1. 1.A wafer transfer apparatus, comprising: a linear motor (1); the support platform (2) is arranged on the movable end of the linear motor (1); the driving mechanism (3) is arranged on the supporting platform (2); The rotating mechanism (4) is arranged on the supporting platform (2), the rotating mechanism (4) is connected with the driving mechanism (3), and the driving mechanism (3) is used for driving the rotating mechanism (4) to move; The lifting mechanism (5) is arranged on the supporting platform (2), the lifting mechanism (5) is connected with the driving mechanism (3), the lifter is connected with the rotating mechanism (4), and the rotating mechanism (4) is used for driving the lifting mechanism (5) to rotate; and the vacuum sucker (7) is arranged on the lifting mechanism (5).
  2. 2. Wafer transfer apparatus according to claim 1, wherein the rotation mechanism (4) comprises; A supporting frame (41), wherein the supporting frame (41) is fixedly connected to the supporting platform (2), The rotating assembly is arranged on the supporting frame (41), is connected with the driving mechanism (3), is connected with the lifting mechanism (5) and is used for driving the lifting mechanism (5) to move; one end of the fixed end of the first telescopic rod (43) is hinged to the support frame (41); the auxiliary sleeve (44) is rotatably connected to the movable end of the first telescopic rod (43), and the auxiliary sleeve (44) is connected with the lifting mechanism (5).
  3. 3. The wafer transfer apparatus of claim 2, wherein the rotating assembly comprises: the rotary drum (421), the rotary drum (421) both ends wear to establish and rotate to connect on support frame (41), rotary drum (421) with elevating system (5) are connected, two spouts (4211) have been seted up to symmetry on the lateral wall of rotary drum (421), two spout (4211) are crossing, symmetry and run through on rotary drum (421) roof have been seted up in two spacing groove (4212); the two steering rods (422), the two steering rods (422) are both arranged on the driving mechanism (3), and the two steering rods (422) are respectively and slidably connected in the two sliding grooves (4211); Two fixing rods (423), wherein one ends of the two fixing rods (423) are both arranged on the driving mechanism (3); The two arc plates (424), two arc plates (424) are installed on one end of the fixed rod (423) far away from the driving mechanism (3), and the two arc plates (424) are respectively and slidably connected in the two limiting grooves (4212).
  4. 4. A wafer transfer apparatus according to claim 3, wherein the drive mechanism (3) comprises: The fixed column (31), one end of the fixed column (31) is fixedly connected to the supporting platform (2); the fixed end of the motor (32) is fixedly connected to the fixed column (31), and the output end of the motor (32) penetrates through and is rotationally connected to the fixed column (31); The fixed ring (34), the fixed ring (34) is coaxially sleeved and fixedly connected to an output shaft of the motor (32), two steering rods (422) are uniformly arranged and fixedly connected to the peripheral side wall of the fixed ring (34), two fixed rods (423) are uniformly arranged and fixedly connected to the peripheral side wall of the fixed ring (34), and the axis of the steering rods (422) and the axis of the fixed rods (423) are in the same plane; the two cams (33) are symmetrically arranged on the output shaft of the motor (32), the two cams (33) are coaxially sleeved and fixedly connected on the output shaft of the motor (32), and the cams (33) are connected with the lifting mechanism (5).
  5. 5. Wafer transfer apparatus according to claim 4, wherein the lifting mechanism (5) comprises: the fixed end of the second telescopic rod (52) is fixedly connected to the supporting platform (2); a sliding rod (54), wherein the sliding rod (54) is penetrated and connected on the rotary drum (421) in a sliding way, The pushing plate (51), one end of the pushing plate (51) is fixedly connected with the movable end of the second telescopic rod (52), the other end of the pushing plate (51) is rotatably connected with one end of the sliding rod (54), and one end, close to the second telescopic rod (52), of the pushing plate (51) is abutted with the cam (33); The spring (53) is sleeved on the second telescopic rod (52), one end of the spring (53) is fixedly connected with the supporting platform (2), and the other end of the spring (53) is fixedly connected with the pushing plate (51); The fixed end of the first electric telescopic rod (55) is fixedly connected to the side wall of one end, far away from the pushing plate (51), of the sliding rod (54), and the axis of the first electric telescopic rod (55) is perpendicular to the axis of the sliding rod (54); Lay pole (56), one end of laying pole (56) wears to establish and fixed connection is in on the movable end of first electric telescopic handle (55), the other end of laying pole (56) is connected with vacuum chuck (7), lay the axis of pole (56) with the axis of first electric telescopic handle (55) is perpendicular, lay pole (56) and wear to establish and sliding connection is in on auxiliary sleeve (44).
  6. 6. The wafer transfer apparatus of claim 5, wherein a guide rod (57) is fixedly connected to a bottom wall of the pushing plate (51) near one end of the sliding rod (54), the guide rod (57) is slidably connected to the supporting platform (2), and an axis of the guide rod (57) is perpendicular to a plane of a top wall of the supporting platform (2).
  7. 7. Wafer transfer apparatus according to claim 5, wherein a locking mechanism (6) is further mounted on the support platform (2), the locking mechanism (6) comprising: the ratchet wheel (61) is coaxially sleeved and fixedly connected to the output shaft of the motor (32); A pawl (62), wherein the pawl (62) is rotatably connected to the fixed column (31), and the pawl (62) is in meshed connection with the ratchet wheel (61); The second electric telescopic rod (63), the stiff end fixed connection of second electric telescopic rod (63) is in on supporting platform (2), the expansion end of second electric telescopic rod (63) with pawl (62) butt, second electric telescopic rod (63) electricity is connected with the controller, the controller with first electric telescopic rod (55) electricity is connected.
  8. 8. The wafer transfer apparatus as claimed in claim 4, wherein a line connecting an axis of the cam (33) and a furthest point of the cam (33) is parallel to an axis of the steering lever (422).

Description

Wafer transfer apparatus Technical Field The application relates to the field of wafer processing equipment, in particular to wafer transfer equipment. Background The wafer is an important raw material of semiconductor products, the main component of the wafer is silicon, the outline of the wafer is in a thin sheet structure, which is commonly called as a silicon wafer, various circuit element structures can be processed and formed on the wafer, and finally chips are formed, so that the function control of circuits is realized, and the wafer has indispensable significance in high-end manufacturing industry. At present, each process in the wafer processing process is completed by different equipment, manual transfer is needed in the wafer transfer process, dust is adsorbed on the wafer by the manual transfer, the subsequent processing quality of the wafer is affected, and the transfer efficiency of the wafer is affected by complicated manual transfer steps. In the related art, the efficiency of wafer transfer is low and the processing quality of the wafer is poor. Disclosure of Invention In order to improve the processing quality of a wafer and the transfer efficiency of the wafer, the application provides wafer transfer equipment. The application provides wafer transfer equipment, which adopts the following technical scheme: A wafer transfer apparatus includes a linear motor; The support platform is arranged on the movable end of the linear motor; The driving mechanism is arranged on the supporting platform; The rotating mechanism is arranged on the supporting platform and connected with the driving mechanism, and the driving mechanism is used for driving the rotating mechanism to move; The lifting mechanism is arranged on the supporting platform, the lifting mechanism is connected with the driving mechanism, the lifter is connected with the rotating mechanism, and the rotating mechanism is used for driving the lifting mechanism to rotate; And the vacuum chuck is arranged on the lifting mechanism. Through adopting above-mentioned technical scheme, linear electric motor drives supporting platform motion, and actuating mechanism moves and drives slewing mechanism elevating system motion, and slewing mechanism drives elevating system and rotates, and elevating system motion drives the vacuum chuck motion, and vacuum chuck absorbs and puts down the wafer, has promoted the processingquality of wafer, has improved the transfer efficiency of wafer. Optionally, the rotating mechanism includes; The supporting frame is fixedly connected to the supporting platform, The rotating assembly is arranged on the supporting frame and connected with the driving mechanism, the rotating assembly is connected with the lifting mechanism, and the rotating assembly is used for driving the lifting mechanism to move; one end of the fixed end of the first telescopic rod is hinged to the support frame; the auxiliary sleeve is rotationally connected to the movable end of the first telescopic rod and connected with the lifting mechanism. Through adopting above-mentioned technical scheme, actuating mechanism motion drives the rotation subassembly motion, and the rotation subassembly motion drives elevating system and rotates, and elevating system motion drives supplementary cover motion, and supplementary cover motion drives first telescopic link motion, and supplementary cover and first telescopic link play the effect of auxiliary stay to elevating system, have improved the operational stability of wafer transfer equipment. Optionally, the rotating assembly includes: the two ends of the rotary drum penetrate through and are rotationally connected to the supporting frame, the rotary drum is connected with the lifting mechanism, two sliding grooves are symmetrically formed in the outer side wall of the rotary drum, the two sliding grooves are intersected, and two limiting grooves are symmetrically and penetratingly formed in the top wall of the rotary drum; the two steering rods are respectively arranged on the driving mechanism and are respectively and slidably connected in the two sliding grooves; One end of each fixing rod is arranged on the driving mechanism; The two arc plates are arranged at one end of the fixed rod, which is far away from the driving mechanism, and are respectively and slidably connected in the two limiting grooves. Through adopting above-mentioned technical scheme, actuating mechanism work drives steering rod and dead lever motion, and the dead lever motion drives the arc motion, makes the rotary drum rotate when the steering rod slides in the spout, and the rotary drum rotates and drives elevating system and rotate, and elevating system rotates and drives the motion of vacuum chuck, has reduced the step that the wafer shifted, has improved the efficiency that the wafer shifted, when the arc slides in the spacing groove, has guaranteed the stability of rotary drum to the stability of wafer transfer equipment has bee