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CN-122003122-A - Pre-aligner based on Bernoulli adsorption wafer mode

CN122003122ACN 122003122 ACN122003122 ACN 122003122ACN-122003122-A

Abstract

The invention discloses a pre-aligner based on Bernoulli wafer adsorption mode, which comprises a frame body, wherein a workbench surface is arranged at the upper end part of the frame body, and is fixedly provided with a correction mechanism, a size adjusting motion mechanism and a jacking motion mechanism which are matched to perform wafer sequence conversion. The automatic action is realized by the mechanism comprising the servo motor, the gear rack, the motor screw rod sliding rail and the like controlled by the editable logic module, the information such as the product position is identified by the sensor while the movement is performed, the left and right and front and back movement of the connecting rod mechanism is pushed by the servo motor screw rod controlled by the editable logic module, the up and down movement of the Z axis is controlled by the motor, the functions such as identification, correction and positioning of the wafer product are performed, and meanwhile, the functions of finger picking, sheet placing, hand holding and conveying can be achieved.

Inventors

  • WANG HAO
  • WANG GUANGLU
  • LI TAO

Assignees

  • 憬承光电科技(厦门)有限公司

Dates

Publication Date
20260508
Application Date
20260204

Claims (8)

  1. 1. The pre-aligner based on Bernoulli adsorption wafer mode comprises a rack body (1), wherein a workbench surface (2) is arranged at the upper end part of the rack body (1), and the pre-aligner is characterized in that a correction mechanism (3), a size adjusting motion mechanism (4) and a jacking motion mechanism (5) are fixedly arranged on the workbench surface (2), and the correction mechanism (3) and the jacking motion mechanism (5) are matched to perform wafer sequence conversion; The correction mechanism (3) comprises a Bernoulli adsorption module (6), a first servo motor (7) and a first coupling assembly (8), wherein one end of the first coupling assembly (8) is connected with the first servo motor (7), and the other end of the first coupling assembly is connected with the Bernoulli adsorption module (6) through a first connecting seat (9); The size adjusting movement mechanism (4) comprises a prealignment scanning module (10), a second servo motor (11) and a second coupler assembly (12), one end of the second coupler assembly (12) is connected with the second servo motor (11), the other end of the second coupler assembly is connected with the prealignment scanning module (10) through a second connecting seat (13), the prealignment scanning module (10) is driven by the second servo motor (11) and the second coupler assembly (12) to do reciprocating linear motion, and positioning scanning motion is carried out on a wafer above the Bernoulli adsorption module (6); The jacking movement mechanism (5) comprises a supporting module and a jacking module, wherein the supporting module and the jacking module are used for jacking a wafer, the supporting module comprises a plurality of supporting columns (14), supporting frames (15) and connecting blocks (16), the jacking module comprises a third servo motor (17), a third connecting seat (18), a cam transmission module (20) and a jacking sliding rail (19), and the cam transmission module (20) and the jacking sliding rail (19) are respectively arranged on the adjacent side walls of the third connecting seat (18).
  2. 2. The pre-aligner based on Bernoulli adsorption wafer mode according to claim 1, wherein slotted holes for the movement of a correction mechanism (3), a size adjustment movement mechanism (4) and a jacking movement mechanism (5) are formed in the working table (2).
  3. 3. The pre-aligner based on Bernoulli adsorption wafer mode according to claim 1 is characterized in that a correction mechanism (3), a size adjusting motion mechanism (4) and a jacking motion mechanism (5) are all arranged on the lower end face of a workbench surface (2) through a fixing seat (27).
  4. 4. The pre-aligner based on Bernoulli adsorption wafer mode according to claim 1, wherein the first, second and third connection seats (9, 13, 18) are each provided with a travel switch (22) for limiting travel.
  5. 5. The pre-aligner based on Bernoulli adsorption of wafers according to claim 1, wherein the support columns (14) and the support frames (15) are provided with air flow channels (23) and cooperate with suction heads (24) arranged at the upper ends of the support columns to perform auxiliary adsorption action on the wafers.
  6. 6. The pre-aligner based on Bernoulli adsorption wafer mode according to claim 1, wherein the cam transmission module comprises a main cam (25) arranged on a third connecting seat and a driven wheel (26) arranged at the lower end of the connecting block, and the main cam (25) is fixedly arranged at the front end of a main shaft of a third servo motor (17) through key installation.
  7. 7. The pre-aligner based on Bernoulli adsorption wafer mode according to claim 1 is characterized in that a plurality of support columns (14) are located on the periphery of a Bernoulli adsorption module (6), when the pre-aligner is not lifted, the upper ends of the support columns (14) are lower than the high horizontal plane of the Bernoulli adsorption module (6), and after the pre-aligner is lifted, the upper ends of the support columns (14) are higher than the high horizontal plane of the Bernoulli adsorption module (6).
  8. 8. The pre-aligner of claim 1, wherein the first coupling assembly (8) and the second coupling assembly (12) each comprise a coupling body and a screw.

Description

Pre-aligner based on Bernoulli adsorption wafer mode Technical Field The invention relates to the technical field of semiconductor manufacturing, in particular to a pre-aligner based on a Bernoulli adsorption wafer mode. Background In the manufacture of semiconductor integrated circuits, the wafer pre-alignment device is used as a core component of a transmission system, and has the main functions of centering and notch orientation on a wafer so as to correct the wafer center offset and notch deflection. Along with the continuous shrinking of semiconductor process, the requirement on the wafer pre-alignment precision is increasing. The prealignment device relates to a plurality of parts such as a motion platform, a rotary shaft system and a sensor, is limited by the machining precision of the parts and the manual assembly level, and axis deviation and distance error often exist between the detection center of the sensor and the physical center of the rotary platform. Although the errors can be reduced by high-precision mechanical tuning, this is not only costly, time-consuming and laborious, but also makes it difficult to ensure consistency of each device. The prior art CN121310950a discloses a wafer pre-alignment device and a pre-alignment method, which refer to correction, but according to the center coordinates of the wafer and the precise notch orientation angle, the rotation of the rotating platform is controlled to realize orientation, and the translation of the XY moving platform is controlled to compensate eccentricity, so as to complete the wafer pre-alignment, and the correction is still realized by calculating and moving rotation, but in the wafer adsorption process, the prior wafer has the requirements of different shapes and thicknesses, and the deformation risk is increased in the correction process. Disclosure of Invention In view of the above problems, the present invention provides a pre-aligner based on bernoulli wafer adsorption, which solves the automatic actions of wafer notch angle error correction. The invention aims to solve the technical problems, and adopts the technical scheme that the pre-aligner based on the Bernoulli adsorption wafer mode comprises a frame body, wherein the upper end part of the frame body is provided with a workbench surface, the workbench surface is fixedly provided with a correction mechanism, a size adjusting motion mechanism and a jacking motion mechanism, the workbench surface is provided with slotted holes for the movement of the correction mechanism, the size adjusting motion mechanism and the jacking motion mechanism, and the correction mechanism, the size adjusting motion mechanism and the jacking motion mechanism are all arranged on the lower end surface of the workbench surface through fixing seats; The correction mechanism comprises a Bernoulli adsorption module, a first servo motor and a first coupling assembly, one end of the first coupling assembly is connected with the first servo motor, and the other end of the first coupling assembly is connected with the Bernoulli adsorption module through a first connecting seat; The size-adjusting movement mechanism comprises a prealignment scanning module, a second servo motor and a second coupler assembly, one end of the second coupler assembly is connected with the second servo motor, the other end of the second coupler assembly is connected with the prealignment scanning module through a second connecting seat, the prealignment scanning module is driven by the second servo motor and the second coupler assembly to do reciprocating linear motion, and positioning scanning motion is conducted on the wafer above the Bernoulli adsorption module; The jacking movement mechanism comprises a supporting module and a jacking module, wherein the supporting module is used for jacking a wafer and comprises a plurality of supporting columns, a supporting frame and a connecting block, the jacking module comprises a third servo motor, a third connecting seat, a cam transmission module and a jacking sliding rail, the cam transmission module and the jacking sliding rail are respectively arranged on the side wall of the third connecting seat, the cam transmission module comprises a main cam arranged on the third connecting seat and a driven wheel arranged at the lower end of the connecting block, the main cam is fixedly arranged at the front end of a main shaft of the third servo motor through a key, the supporting columns are positioned at the periphery of the Bernoulli adsorption module, the upper ends of the supporting columns are lower than the level of the Bernoulli adsorption module when the jacking movement is not performed, and the upper ends of the supporting columns are higher than the level of the Bernoulli adsorption module after jacking. Further, the first connecting seat, the second connecting seat and the third connecting seat are all provided with travel switches for limiting travel. Further, the support co