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CN-122003126-A - Compatible vacuum adsorption hot plate

CN122003126ACN 122003126 ACN122003126 ACN 122003126ACN-122003126-A

Abstract

The invention discloses a compatible vacuum adsorption heat disc, which comprises a disc body and a vacuum adsorption system, wherein the vacuum adsorption system comprises a plurality of vacuum adsorption air passages arranged on the disc body and a vacuumizing device communicated with the plurality of vacuum adsorption air passages, and a vacuum adsorption air passage opening and closing adjusting piece for realizing opening and closing of the vacuum adsorption air passages is arranged on the vacuum adsorption air passages. The compatible vacuum adsorption hot plate realizes the adjustable and controllable operation of the vacuum adsorption area, can flexibly adapt to wafers with different specifications, ensures excellent adsorption effect, can optimize the utilization of vacuum resources, saves the vacuum resources, reduces the production cost and realizes the design requirement of the hot plate universality.

Inventors

  • MA JIAQI
  • WANG QIAOGANG
  • JIN ZHONGXUAN

Assignees

  • 浙江先导热电科技股份有限公司

Dates

Publication Date
20260508
Application Date
20251118

Claims (10)

  1. 1. A compatible vacuum adsorption hot plate is characterized by comprising a plate body (1) and a vacuum adsorption system (4), wherein the vacuum adsorption system (4) comprises a plurality of vacuum adsorption air passages (7) arranged on the plate body (1) and a vacuumizing device communicated with the vacuum adsorption air passages (7), and a vacuum adsorption air passage opening and closing adjusting piece (9) for realizing opening and closing of the vacuum adsorption air passages is arranged on the vacuum adsorption air passages (7).
  2. 2. The compatible vacuum adsorption heat plate according to claim 1, wherein the vacuum adsorption air passages (7) comprise a plurality of annular vacuum adsorption main air passages (71) and at least one vacuum adsorption connecting air passage (72).
  3. 3. The compatible vacuum adsorption heat plate of claim 2, wherein an axial air passage (73) is arranged between the annular vacuum adsorption main air passage (71) and the vacuum adsorption connecting air passage (72), and the vacuum adsorption air passage opening and closing adjusting piece (9) is arranged in the axial air passage (73) in an adjusting mode.
  4. 4. A compatible vacuum adsorption heat disc according to claim 2 wherein a plurality of annular vacuum adsorption main air passages (71) are concentrically and sectionally arranged on the surface of the disc body from the center of the disc body outwards by taking the center of the disc body as a circle center, and the vacuum adsorption connecting air passages (72) are radially arranged in the disc body and are connected with a vacuumizing device through a main air extraction passage (74).
  5. 5. A compatible vacuum adsorption heat disc according to any one of claims 1 to 4 wherein the vacuum adsorption air passage opening and closing adjusting member (9) is provided with an axial air inlet hole (92) and a radial air inlet hole (93) in the axial direction and the radial direction respectively.
  6. 6. The vacuum adsorption heat plate according to claim 5, wherein the vacuum adsorption air passage opening and closing adjusting member (9) comprises an integrally arranged adjusting member main body (91), the axial air inlet holes (92) penetrate through the two axial ends of the adjusting member main body (91), the radial air inlet holes (93) penetrate through the two radial side surfaces of the adjusting member main body (91), and the axial air inlet holes (92) and the radial air inlet holes (93) are mutually communicated.
  7. 7. A compatible vacuum adsorption heat disc according to claim 6 wherein a guide sealing surface (94) and an adjusting structure (95) are respectively arranged at two axial end parts of the adjusting member main body (91), and an external thread (96) is arranged on the outer circumference of the adjusting member main body (91).
  8. 8. A compatible vacuum adsorption heat disc according to any one of claims 1 to 4 wherein the vacuum pumping device comprises an air pumping joint (8) and an external vacuum pump which are arranged on the disc body (1), wherein the air pumping joint (8) is connected with the vacuum pump through a vacuum pipeline.
  9. 9. A compatible vacuum adsorption heat disc according to any one of claims 1 to 4 is characterized in that the disc body (1) comprises a heat conducting disc (5) and a liquid cooling disc (6) fixedly connected with the heat conducting disc up and down, and a temperature sensor (3) is connected to the disc body (1).
  10. 10. The compatible vacuum adsorption hot plate of claim 9, wherein the heating element (2) is arranged in the heat conduction plate (5), the liquid cooling channel (61) is arranged in the liquid cooling plate (6), and the liquid cooling plate (6) is provided with a cooling liquid inlet joint (62) and a cooling liquid outlet joint (63) which are communicated with the liquid cooling channel (61).

Description

Compatible vacuum adsorption hot plate Technical Field The invention relates to the technical field of semiconductor manufacturing process equipment, in particular to a wafer heating disk (Heater Chuck or ESC-electrostatic Chuck) for process equipment such as semiconductor film deposition, etching, annealing and the like, in particular to a compatible vacuum adsorption heating disk. Background In semiconductor manufacturing, wafers need to be precisely, smoothly, and slip-free secured to the trays of a process chamber. The vacuum adsorption heat disc is a key component for realizing the function, and generates negative pressure through an internal vacuum channel to firmly adsorb the wafer on the surface of the disc body, and meanwhile, the vacuum adsorption heat disc has the heating and cooling functions so as to accurately control the process temperature of the wafer. For example, chinese patent document CN115142050B discloses a vacuum adsorption heating disc and a device, wherein an inner ring channel and an outer ring channel corresponding to the center of the same disc surface are provided on the disc surface of the vacuum adsorption heating disc, a plurality of communication channels are uniformly distributed between the inner ring channel and the outer ring channel or in the inner ring channel, so as to realize air flow coupling between the inner ring channel and the outer ring channel, axisymmetrically distributed air suction holes are further provided on the disc surface, and the air suction holes are provided on the communication channels. The heating plate has a vacuum adsorption function, and can uniformly heat the whole wafer, so that the equipment can obtain better film forming quality. With the development of semiconductor technology, a production line is required to process wafers of various specifications (e.g., 4 inches, 6 inches, 8 inches, 12 inches, etc.). Conventional hotplates typically have vacuum adsorption airways (including main airways and branch pores) designed for a single specification wafer. When wafers of different sizes need to be processed, the following technical problems exist: Firstly, the compatibility is poor, the hot plates with different specifications are required to be replaced or different fixture clamps are required to be used, so that the equipment has long downtime, the production efficiency is reduced, and the equipment investment and the operation cost are increased. Secondly, the adsorption effect is poor, namely, the problem of poor adsorption effect and the like can be caused by adopting a hot plate with the same specification to adsorb wafers with different specifications, for example, the hot plate designed for a 12-inch wafer is used for adsorbing 8-inch wafers, adsorption holes can be distributed on the periphery or the outside of the wafer, the effective adsorption area is insufficient, the adsorption force is uneven, wafer displacement, warping or uneven temperature can occur in the process, and the process yield is seriously affected. And thirdly, the vacuum resource is wasted, namely when a hot plate manufactured according to a large-size wafer is used for adsorbing a small-size wafer, the peripheral air passage can be directly exposed in the vacuum chamber, so that the load of the vacuum system is increased, the pressure stability of the chamber is influenced, and the energy consumption is increased. Fourth, the structure is complex, the existing hot plate is also designed with a plurality of pipelines, and the structural design of each air passage is controlled by an electromagnetic valve respectively, but the design leads to the complex structure of the hot plate and high cost. Therefore, there is an urgent need to design a vacuum adsorption hot plate that can flexibly adapt to wafers of different specifications, ensure excellent adsorption effect, and optimize the utilization of vacuum resources. Disclosure of Invention The invention aims to solve the problems of poor compatibility, poor adsorption effect, vacuum resource waste, complex structure and the like of a vacuum adsorption hot disc in the prior art, and provides a compatible vacuum adsorption hot disc which can meet the adsorption use requirements of wafers with various specifications, can safely, stably and efficiently fix wafers with various sizes by one set of hot disc, improves the utilization rate of equipment, reduces the production cost and ensures the adsorption uniformity and the temperature uniformity in the process. The invention discloses a compatible vacuum adsorption hot plate for achieving the purpose of the invention, which comprises a plate body and a vacuum adsorption system, wherein the vacuum adsorption system comprises a plurality of vacuum adsorption air passages arranged on the plate body and a vacuumizing device communicated with the plurality of vacuum adsorption air passages, and a vacuum adsorption air passage opening and closing adjusting piece for realizing