CN-122003127-A - Vacuum chuck and wafer processing equipment

CN122003127ACN 122003127 ACN122003127 ACN 122003127ACN-122003127-A

Abstract

The application discloses a vacuum chuck and wafer processing equipment. The vacuum chuck is arranged on the wafer processing device, the wafer processing device comprises a connecting platform, a first negative pressure port is arranged on the connecting platform, the vacuum chuck comprises a chuck main body and a supporting structure, the chuck main body comprises a first end face, a second end face, an adsorption groove and an adsorption hole, the first end face and the second end face are arranged in a reverse mode along a first direction, the adsorption groove is formed by recessing the second end face, the adsorption groove comprises a first sub groove and a second sub groove which are communicated, the first sub groove is used for being connected with the first negative pressure port, the second sub groove is used for adsorbing the connecting platform, the adsorption hole penetrates through the first end face and is communicated with the second sub groove, and the adsorption hole is used for adsorbing a wafer. The supporting structure is arranged on the first end face at least, and the projection of the supporting structure and the projection of the adsorption groove are arranged at intervals along the first direction and in the same plane. Is beneficial to simplifying the adsorption structure of the vacuum chuck.

Inventors

Jia Huaiming
DUAN HENGSHAN
YANG PENG
KANG SHUAISHUAI
GUO HONGFEI
HUO CHEN

Assignees

北京华卓精科科技股份有限公司

Dates

Publication Date: 20260508
Application Date: 20251217

Claims (10)

1. The utility model provides a vacuum chuck sets up on wafer processingequipment, wafer processingequipment includes connection platform and first negative pressure port, first negative pressure port set up in connection platform, its characterized in that, vacuum chuck includes: The sucking disc main body comprises a first end face, a second end face, an adsorption groove and an adsorption hole, wherein the first end face and the second end face are arranged in a reverse direction along a first direction, the first direction is parallel to the thickness direction of the sucking disc main body, the adsorption groove is formed by recessing the second end face, the adsorption groove comprises a first sub groove and a second sub groove which are communicated, the first sub groove is used for being connected with a first negative pressure port, the second sub groove is used for adsorbing the connecting platform, the adsorption hole penetrates through the first end face and the second sub groove, and the adsorption hole is used for adsorbing a wafer; The support structure is at least arranged on the first end face, is arranged along the first direction and is in the same plane, and the projection of the support structure and the projection of the adsorption groove are arranged at intervals.
2. The vacuum chuck of claim 1, wherein the second subslot comprises at least one of a straight section and an arcuate section.
3. The vacuum chuck of claim 2, wherein the second subslot comprises a straight section and an arcuate section, the arcuate section centered about the geometric center of the second end surface, the straight section extending from an end of the arcuate section in a direction away from the geometric center, the first subslot being connected to an end of the straight section away from the arcuate section.
4. The vacuum chuck of claim 2, wherein the number of suction holes is plural, the second subslot comprises an arcuate segment, and the plurality of suction holes are spaced apart from the arcuate segment.
5. The vacuum chuck as claimed in any one of claims 1 to 4, wherein the number of the suction grooves includes a plurality, and the plurality of suction grooves are symmetrically arranged with respect to a center line of the second end surface.
6. The vacuum chuck of any one of claims 1 to 4, wherein the support structure comprises a first support unit disposed at the second end surface, the first support unit protruding from the second end surface, the first support unit being spaced apart from the suction slot.
7. The vacuum chuck of any one of claims 1 to 4, wherein the support structure comprises a plurality of second support units disposed at the first end face, the second support units protruding from the first end face, the second support units being disposed at intervals from the suction holes, the plurality of second support units being disposed at intervals in a direction intersecting the first direction.
8. The vacuum chuck of any one of claims 1 to 4, wherein the chuck body further comprises an evasion aperture disposed through the first end face and the second end face, the evasion aperture configured to evade a thimble assembly of the wafer processing apparatus, any two of the evasion aperture, the adsorption groove, and the support structure being disposed at intervals; The vacuum chuck further comprises a first sealing structure, wherein the first sealing structure is at least arranged on the second end face and surrounds the edge of the avoidance hole.
9. The vacuum chuck of any one of claims 1 to 4, further comprising: and the second sealing structure is at least arranged on the second end face and extends along the edge of the second end face.
10. A wafer processing apparatus, comprising: a vacuum chuck according to any one of claims 1 to 9; And the wafer processing device is characterized in that the first negative pressure port is arranged on the connecting platform, and the vacuum chuck is arranged on the connecting platform.

Description

Vacuum chuck and wafer processing equipment Technical Field The application relates to the technical field of wafer processing, in particular to a vacuum chuck and wafer processing equipment. Background This section provides merely background information related to the invention, which is not necessarily prior art. Currently, in the wafer processing technology, a wafer to be processed needs to be fixed, supported and moved through a sucker in the related processing technology, so that high-precision positioning is ensured, and smooth processing of the wafer is ensured. Generally, the adsorption to the wafer mainly adopts two adsorption modes of electrostatic adsorption and vacuum adsorption. Compared with electrostatic adsorption, vacuum adsorption provides a stable, flat and thermally controllable reference surface for the wafer through rigid contact of the wafer and the sucker, and nano-scale processing can be performed, so that vacuum adsorption becomes a preferred adsorption mode for wafer adsorption in a semiconductor processing link. In the development of wafer processing technology, how to optimize the adsorption structure of the sucker is a technical problem to be solved in the wafer processing technology. Disclosure of Invention The object of the present application is to solve at least the problem of how to optimize the suction structure of a suction cup. This object is achieved by: The first aspect of the present application provides a vacuum chuck for connecting to a wafer processing apparatus, the wafer processing apparatus including a connection platform and a first negative pressure port, the first negative pressure port being disposed on the connection platform, the vacuum chuck including a chuck body and a support structure. The sucking disc main part includes first terminal surface, the second terminal surface, adsorption tank and absorption hole, first terminal surface and second terminal surface set up along first direction dorsad, and first direction is on a parallel with the thickness direction of sucking disc main part, and the adsorption tank is sunken to form by the second terminal surface, and the adsorption tank is including first subslot and the second subslot that are linked together, and first subslot is used for being connected with first negative pressure port, and the second subslot is used for adsorbing the connection platform, and the absorption hole runs through first terminal surface and second subslot, and the absorption hole is used for adsorbing the wafer. The supporting structure is arranged on the first end face at least, and the projection of the supporting structure and the projection of the adsorption groove are arranged at intervals along the first direction and in the same plane. In the vacuum chuck, the adsorption groove and the adsorption hole are communicated, so that the vacuum chuck can adsorb a wafer through only a single adsorption channel, and meanwhile, the connection reliability with a connection platform is improved, the structure of the adsorption channel is greatly simplified, and the complexity of multi-channel design is reduced. In addition, the first sub-groove and the second sub-groove in the adsorption groove are arranged in a segmented mode, on one hand, the problem that negative pressure is concentrated in the adsorption hole due to the fact that the distance between the first negative pressure port and the adsorption hole is too short is avoided, and therefore adsorption force between the vacuum chuck and the connecting platform is prevented from weakening, adsorption effect is further guaranteed, and on the other hand, the adsorption contact area of the vacuum chuck and the connecting platform can be enlarged, and adsorption stability is improved. In some embodiments, the second subslot includes at least one of a straight section and an arcuate section. In some embodiments, the second subslot includes a straight section and an arcuate section, the arcuate section having a geometric center of the second end face as an arc center, the straight section extending from an end of the arcuate section in a direction away from the geometric center, the first subslot being connected to the end of the straight section away from the arcuate section. In some embodiments, the number of adsorption holes is set to be plural, the second subslot includes an arc-shaped section, and the plurality of adsorption holes are arranged at intervals in the arc-shaped section. In some embodiments, the number of adsorption grooves includes a plurality of adsorption grooves symmetrically disposed about a centerline of the second end surface. In some embodiments, the support structure includes a first support unit disposed on the second end surface, the first support unit protruding from the second end surface, the first support unit being disposed at a distance from the suction groove. In some embodiments, the support structure includes a plurality of second support uni