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CN-122003145-A - Integrated heat dissipation device for polymerization encapsulation of graphene phase-change material and preparation method thereof

CN122003145ACN 122003145 ACN122003145 ACN 122003145ACN-122003145-A

Abstract

The disclosure provides an integrated heat dissipation device for polymerization encapsulation of a graphene phase-change material and a preparation method thereof. And depositing a polyamic acid precursor on the surface of the graphene phase-change matrix to obtain a polyamic acid precursor film, performing thermal imidization treatment to obtain a continuous polyimide polymer packaging film, and injecting cooling liquid into the micro-channel of the heat dissipation device for packaging to obtain the integrated heat dissipation device. The graphene phase-change matrix improves the heat conductivity coefficient, realizes light weight so as to meet the requirements on high efficiency and low weight heat dissipation, integrates the functions of energy storage, heat conduction and heat dissipation, improves the heat dissipation power, forms an ultrathin polyimide packaging film through polymerization packaging, and realizes zero-wrapping insulation packaging of a complex structure.

Inventors

  • WANG JIANXING
  • LIU YIPENG
  • FANG BO
  • ZHENG LIANG
  • WANG HUI

Assignees

  • 广东一纳科技有限公司

Dates

Publication Date
20260508
Application Date
20251224

Claims (10)

  1. 1. The preparation method of the integrated heat dissipation device with the polymerized and packaged graphene phase-change material is characterized by comprising the following steps of: Mixing a graphene material with a phase change material to prepare a graphene phase change matrix; Processing the graphene phase-change matrix to form a micro-channel structure; Depositing a polyamic acid precursor on the surface of the graphene phase-change matrix to obtain a polyamic acid precursor film, and performing thermal imidization treatment on the polyamic acid precursor film to obtain a continuous polyimide polymer packaging film so as to obtain a heat dissipation device; and injecting cooling liquid into the micro-flow channel of the heat dissipation device and packaging to obtain the integrated heat dissipation device.
  2. 2. The method for preparing the integrated heat dissipating device with the polymerized and packaged graphene phase-change material according to claim 1, wherein the method for preparing the graphene phase-change matrix by mixing the graphene material with the phase-change material comprises the following steps: Mixing graphene powder with phase change material particles, and stirring and preserving heat for 30-60 min at 60-90 ℃ to obtain graphene phase change powder; And placing the graphene phase-change powder into a die for low-temperature hot-pressing forming, wherein the pressure of the low-temperature hot-pressing is 5-20 MPa, and the temperature of the low-temperature hot-pressing is 25-40 ℃ so as to obtain the graphene phase-change matrix.
  3. 3. The method for preparing the integrated heat dissipation device with the polymerized and encapsulated graphene phase-change material according to claim 2, wherein the mass ratio of the graphene powder to the phase-change material particles is 5-15:85-95.
  4. 4. The method for preparing the integrated heat dissipation device with the polymerized and packaged graphene phase-change material according to claim 2, wherein the density of the graphene phase-change matrix is 1.2g/cm 3 -1.8g/cm 3 .
  5. 5. The method for preparing the integrated heat dissipation device with the polymerized and packaged graphene phase-change material according to claim 2, wherein the phase-change material is at least one of paraffin, fatty acid or composite phase-change material, and/or the phase-change temperature of the phase-change material is 40-80 ℃.
  6. 6. The method for preparing an integrated heat dissipating device of polymeric encapsulation of graphene phase-change materials according to claim 1, wherein the method comprises depositing a polyamic acid precursor on the surface of the graphene phase-change substrate to obtain a polyamic acid precursor film, and performing thermal imidization treatment on the polyamic acid precursor film to obtain a continuous polyimide polymer encapsulation film, so as to obtain the heat dissipating device, and comprises the following steps: Placing the graphene phase-change matrix in a deposition area and heating, wherein the heating temperature of the graphene phase-change matrix is 35-45 ℃; heating and evaporating dianhydride monomers and diamine monomers, wherein the heating temperature of the dianhydride monomers is 140-180 ℃, and the evaporating temperature of the diamine monomers is 80-150 ℃; Under the drive of nitrogen carrier gas, the dianhydride monomer steam and the diamine monomer steam are led into a deposition area where the graphene phase-change matrix is placed, so that the dianhydride monomer steam and the diamine monomer steam are subjected to gas phase adsorption and polymerization on the surface of the graphene phase-change matrix for deposition, and a polyamic acid precursor film is formed; And heating the polyamic acid precursor film to perform thermal imidization treatment, so that the polyamic acid precursor film is subjected to thermal imidization reaction, and the polyamic acid precursor film is converted into a polyimide polymer packaging film, so that the integrated heat dissipation device is obtained.
  7. 7. The method for preparing the integrated heat dissipating device with the polymerized encapsulation of the graphene phase-change material according to claim 6, wherein the film thickness of the polyamic acid precursor film is 0.05 μm-100 μm.
  8. 8. The method for preparing the integrated heat dissipating device with the polymerized and packaged graphene phase-change material according to claim 6, wherein the method for heating the polyamic acid precursor film for thermal imidization comprises the following steps: Heating the deposition area from 30-35 ℃ to 100 ℃ in the first stage, and keeping the temperature for 20-40 min; The temperature of the deposition area is increased from 100 ℃ to 150-180 ℃ in the second stage, and the heat preservation time is 1-2 h; The temperature of the deposition area in the third stage is 150-300 ℃ and the heat preservation time is 2-3 h.
  9. 9. The method for manufacturing the integrated heat dissipating device with the polymerized and packaged graphene phase-change material according to claim 1, wherein the micro-channel structure is formed in the graphene phase-change substrate by processing through laser etching, mechanical milling, plasma etching or compression molding.
  10. 10. An integrated heat sink, characterized in that it is obtained by the method for manufacturing an integrated heat sink of polymeric encapsulation of graphene phase-change material according to any one of claims 1 to 9.

Description

Integrated heat dissipation device for polymerization encapsulation of graphene phase-change material and preparation method thereof Technical Field The disclosure relates to the technical field of heat dissipation management, in particular to a preparation method of an integrated heat dissipation device with a graphene phase-change material polymerized package. Background With the development of 3C electronic devices to high integration and high operation speed, the heating power of core components such as chips is rapidly increased, and local excessive temperature has become a key problem for restricting the performance, service life and user experience of the devices. The main current heat dissipation scheme mainly comprises copper heat pipes and vapor chamber, and the working principle is to realize heat transfer by utilizing the heat conduction characteristic of copper and the phase change of an internal working medium. However, copper has a specific heat capacity of only 0.39J/(g and n ℃), has poor energy storage capacity per unit volume, cannot quickly absorb heat when facing instantaneous high-power heating, easily causes local temperature rapid rise, so that the energy storage capacity of a copper heat pipe and a vapor chamber is weak, the weight is heavier, and the requirements of electronic equipment on high-efficiency and low-weight heat dissipation cannot be met. The VC radiator with the built-in copper/diamond sintered liquid suction core and the preparation method thereof are disclosed in a comparison document CN202110928563.7, the VC radiator comprises an upper shell plate and a lower shell plate, a cavity is arranged between the upper shell plate and the lower shell plate, a capillary liquid suction core B is arranged in the upper shell plate, a capillary liquid suction core a is arranged in the lower shell plate, and the capillary liquid suction core a is a copper/diamond sintered body with a three-dimensional porous structure. When the scheme faces instantaneous high-power heating, heat cannot be quickly absorbed, the weight is heavy, and the requirements of the electronic equipment on high-efficiency and low-weight heat dissipation cannot be met. Disclosure of Invention The purpose of the present disclosure is to overcome the shortcomings in the prior art, and provide an integrated heat dissipation device for realizing zero-wrapping insulation packaging graphene phase-change material polymerization packaging by integrating the light weight, energy storage, heat conduction and heat dissipation of a heat dissipation structure and a preparation method thereof. The aim of the disclosure is achieved by the following technical scheme: A preparation method of an integrated heat dissipation device with polymerized and packaged graphene phase-change materials comprises the following steps: Mixing a graphene material with a phase change material to prepare a graphene phase change matrix; Processing the graphene phase-change matrix to form a micro-channel structure; Depositing a polyamic acid precursor on the surface of the graphene phase-change matrix to obtain a polyamic acid precursor film, and performing thermal imidization treatment on the polyamic acid precursor film to obtain a continuous polyimide polymer packaging film so as to obtain a heat dissipation device; and injecting cooling liquid into the micro-flow channel of the heat dissipation device and packaging to obtain the integrated heat dissipation device. In one embodiment, a graphene phase change matrix is prepared by mixing a graphene material with a phase change material, comprising the steps of: Mixing graphene powder with phase change material particles, and stirring and preserving heat for 30-60 min at 60-90 ℃ to obtain graphene phase change powder; And placing the graphene phase-change powder into a die for low-temperature hot-pressing forming, wherein the pressure of the low-temperature hot-pressing is 5-20 MPa, and the temperature of the low-temperature hot-pressing is 25-40 ℃ so as to obtain the graphene phase-change matrix. In one embodiment, the mass ratio of the graphene powder to the phase change material particles is 5-15:85-95. In one embodiment, the graphene phase-change matrix has a density of 1.2g/cm 3-1.8g/cm3. In one embodiment, the phase change material is at least one of paraffin, fatty acid or composite phase change material, and/or the phase change material has a phase change temperature of 40-80 ℃. In one embodiment, a polyamic acid precursor is deposited on the surface of the graphene phase-change substrate to obtain a polyamic acid precursor film, and then the polyamic acid precursor film is subjected to thermal imidization treatment to obtain a continuous polyimide polymer packaging film, so as to obtain a heat dissipating device, which comprises the following steps: Placing the graphene phase-change matrix in a deposition area and heating, wherein the heating temperature of the graphene phase-change matri