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CN-122003148-A - Two-phase heat dissipation cold plate and system for heat dissipation of high-power chip

CN122003148ACN 122003148 ACN122003148 ACN 122003148ACN-122003148-A

Abstract

The invention relates to a two-phase heat radiation cold plate and a system for heat radiation of a high-power chip, which belong to the technical field of heat radiation of electronic equipment, and comprise a bottom plate, a cover plate, a liquid inlet and a liquid outlet, wherein the bottom plate and the cover plate are in sealed connection and form an internal cavity, a plurality of rows of heat radiation ribs are arranged in the internal cavity, the rows of heat radiation ribs are distributed at intervals in a plurality of rows along the working medium flowing direction from the liquid inlet to the liquid outlet, and a main runner is formed between every two adjacent heat radiation ribs; the height of at least part of the sections of each row of heat dissipation ribs is gradually reduced along the flowing direction of working medium, so that connecting flow passages which are connected with two adjacent rows of main flow passages and have gradually increased cross sectional areas are formed, fluid mixing flow passages are reserved on the heat dissipation ribs at equal intervals, and the fluid mixing flow passages and the connecting flow passages can be used for disturbing the fluid flowing in the adjacent main flow passages. The invention realizes the regularization and flattening of the cold plate structure while ensuring excellent fluid expansion adaptability and strengthening heat exchange capacity, and has the advantage of low manufacturing cost.

Inventors

  • XUE YUQING
  • Pang Qingdong
  • JIANG ZHENGSHUN
  • WANG GANG
  • SUN YUNFEI
  • GUO HAIYI

Assignees

  • 中航光电科技股份有限公司

Dates

Publication Date
20260508
Application Date
20260330

Claims (10)

  1. 1. The utility model provides a two-phase heat dissipation cold plate for high-power chip heat dissipation, includes bottom plate (1), apron (2), inlet (3) and liquid outlet (4), sealing connection and formation inside cavity between bottom plate (1) and the apron (2), inlet (3) and liquid outlet (4) with inside cavity intercommunication, its characterized in that: A plurality of rows of heat dissipation ribs (5) are arranged in the inner cavity, the heat dissipation ribs (5) are distributed at intervals in a plurality of rows along the working medium flowing direction from the liquid inlet (3) to the liquid outlet (4), and main flow channels are formed between the adjacent heat dissipation ribs (5), wherein the height of at least part of the sections of each row of heat dissipation ribs (5) is gradually reduced along the working medium flowing direction, so that a connecting flow channel which is connected with two adjacent rows of main flow channels and has gradually increased cross section area is formed; through openings communicated with the main flow channels at two sides are reserved on the radiating ribs (5) at equal intervals, fluid mixing flow channels (6) are formed at the through openings, the extending direction of the fluid mixing flow channels (6) and the flowing direction of working media form non-zero included angles, and the fluid mixing flow channels (6) and the connecting flow channels can be used for disturbing fluid flowing in adjacent main flow channels.
  2. 2. The two-phase heat radiation cold plate for heat radiation of high-power chip according to claim 1, wherein the heat radiation rib (5) comprises a straight rib unit, the length extension direction of the straight rib unit is parallel to the flow direction of working medium, the bottom of the straight rib unit is fixedly connected with the inner wall surface of the bottom plate (1), and the top highest point or the top surface of the highest section is attached to the inner wall surface of the cover plate (2).
  3. 3. A two-phase heat-dissipating cold plate for heat dissipation of high power chips according to claim 2, wherein the height of at least part of the segments of the heat-dissipating ribs (5) decreases gradually in a stepwise or linear or curvilinear manner along the direction of flow of the working medium.
  4. 4. A two-phase heat-dissipating cold plate for heat dissipation of high power chips according to claim 3, wherein the heat-dissipating ribs (5) are integrally formed with the bottom plate (1).
  5. 5. The two-phase heat dissipation cold plate for heat dissipation of a high power chip according to claim 1, wherein the internal cavity is a cubic open cavity formed at the bottom of the cover plate (2).
  6. 6. The two-phase heat dissipation cold plate for heat dissipation of a high-power chip according to any one of claims 1 to 5, wherein the drift diameter of the liquid inlet (3) is smaller than that of the liquid outlet (4) and is used for adapting to the volume change characteristics of a working medium which is in a single-phase liquid phase at the liquid inlet (3) and in a gas-liquid two-phase at the liquid outlet (4) before and after.
  7. 7. The two-phase heat dissipation cold plate for heat dissipation of a high-power chip according to claim 6, wherein the liquid inlet (3) and the liquid outlet (4) are both arranged on the cover plate (2), the liquid inlet (3) is communicated with a liquid separating cavity (8), the liquid separating cavity (8) is located at the liquid inlet end of the internal cavity, the liquid outlet (4) is communicated with a liquid collecting cavity (9), and the liquid collecting cavity (9) is located at the liquid outlet end of the internal cavity.
  8. 8. The two-phase heat radiation cold plate for heat radiation of high-power chip according to claim 1 or 7, wherein the outer wall surface of the bottom plate (1) is a heat absorption mounting surface for being attached to a heat radiation surface of the high-power chip, and the projected area of the heat radiation rib (5) covers the chip attaching area of the heat absorption mounting surface.
  9. 9. A two-phase heat radiation system, characterized by comprising the two-phase heat radiation cold plate for heat radiation of a high-power chip according to any one of claims 1 to 8, wherein a liquid inlet (3) and a liquid outlet (4) are connected through a pipeline, a pumping device and a condenser are arranged on the pipeline, and the pumping device is used for driving working medium to circularly move along the pipeline.
  10. 10. The two-phase heat dissipation system of claim 9, wherein the working fluid is deionized water or a fluorinated fluid.

Description

Two-phase heat dissipation cold plate and system for heat dissipation of high-power chip Technical Field The invention relates to the technical field of electronic equipment heat dissipation, in particular to a two-phase heat dissipation cold plate and a system for heat dissipation of a high-power chip. Background With the continuous rising of chip power density, the traditional single-phase liquid cooling technology faces a bottleneck in coping with the heat dissipation requirement with high heat flux density exceeding 500W due to the limited specific heat capacity of the working medium. The pump-driven two-phase heat dissipation technology utilizes the phase change latent heat of the working medium, can transfer a large amount of heat under a lower temperature difference, and becomes a better solution. However, the existing two-phase heat-dissipation cold plate often faces the balance problem between the reinforced heat exchange and the adaptation of the volume expansion of working media in structural design. Chinese patent publication No. CN120878656a discloses a variable thickness two-phase cold plate, which adapts to the volume expansion of the gasified working medium by gradually increasing the height of the whole flow channel along the flow direction (i.e. gradually expanding the cross section of the flow channel), while being beneficial to reducing the flow pressure drop, the internal cavity of the cold plate is in an irregular shape (e.g. a wedge-shaped cavity). The irregular cavity is difficult to process and manufacture (such as CNC processing, mold development or welding assembly), has high cost, is unfavorable for realizing precise molding of a complex internal rib structure, and limits further improvement of performance and large-scale application. Therefore, there is a need for a two-phase heat-dissipating cold plate with a more regular internal cavity structure that is easier to manufacture while maintaining excellent heat-dissipating performance and reducing flow resistance. Disclosure of Invention Aiming at the defects in the background technology, the invention provides a two-phase heat dissipation cold plate and a system for heat dissipation of a high-power chip, which aim to solve the problems of high processing complexity and high manufacturing cost caused by the adoption of an irregular flow channel for adapting to volume expansion of the existing two-phase cold plate, and ensure efficient heat exchange and smooth working medium guiding. The technical scheme is that the two-phase heat dissipation cold plate for heat dissipation of the high-power chip comprises a bottom plate, a cover plate, a liquid inlet and a liquid outlet, wherein the bottom plate is in sealing connection with the cover plate to form an inner cavity, the liquid inlet and the liquid outlet are communicated with the inner cavity, a plurality of rows of heat dissipation ribs are arranged in the inner cavity, the heat dissipation ribs are distributed at intervals in a plurality of rows along the working medium flowing direction from the liquid inlet to the liquid outlet, main flow channels are formed between adjacent heat dissipation ribs, the height of at least part of each row of heat dissipation ribs is gradually reduced along the working medium flowing direction, so that connecting flow channels which are connected with the two adjacent rows of main flow channels and are gradually increased in cross section area are formed, through openings which are communicated with the two sides of the main flow channels are reserved at equal intervals on the heat dissipation ribs, the extending direction of the fluid mixing flow channels forms a non-zero included angle with the working medium flowing direction, and the fluid mixing flow channels and the connecting flow channels can be used for disturbing fluid flowing in the adjacent main flow channels. Preferably, the heat dissipation rib comprises a straight rib unit, the length extension direction of the straight rib unit is parallel to the flow direction of the working medium, the bottom of the straight rib unit is fixedly connected with the inner wall surface of the bottom plate, and the top highest point or the top surface of the highest section is attached to the inner wall surface of the cover plate. Preferably, the height of at least part of the sections of the heat dissipation ribs gradually decreases in a step-shaped, linear or curve-shaped manner along the flow direction of the working medium. The heat dissipation ribs and the bottom plate are integrally formed. The internal cavity is a cube-shaped opening cavity arranged at the bottom of the cover plate. Preferably, the diameter of the liquid inlet is smaller than that of the liquid outlet, and the liquid inlet is used for adapting to the volume change characteristics of the working medium which is in single-phase liquid phase at the liquid inlet and in gas-liquid two phases at the liquid outlet. Preferably, the li