CN-122003161-A - Die bonding equipment

CN122003161ACN 122003161 ACN122003161 ACN 122003161ACN-122003161-A

Abstract

The invention relates to the technical field of die bonders, in particular to die bonder equipment. The die bonding equipment comprises a base, a table top component and a guide rail component, wherein the guide rail component comprises a fixed die set and a movable die set, the fixed die set comprises a first fixed guide rail and a second fixed guide rail which are arranged at two opposite ends of the base in parallel, the movable die set comprises a first movable guide rail and a second movable guide rail which are arranged in parallel, one sides of the first movable guide rail and the second movable guide rail, which are close to each other, are respectively connected with a binding head component, suction nozzles and dispensing components are arranged on the binding head component so as to execute the actions of pasting and dispensing, the first movable guide rail and/or the second movable guide rail move along the length direction of the first fixed guide rail and the length direction of the second fixed guide rail so as to drive the corresponding binding head component to synchronously move, and the binding head component is slidably connected with the corresponding first movable guide rail or the second movable guide rail and can move along the length direction of the first movable guide rail or the second movable guide rail. Solves the problems of poor applicability and low efficiency of the prior die bonding equipment.

Inventors

LIAO XIONGHUI
Tang Haihuai

Assignees

微见智能封装技术(深圳)有限公司

Dates

Publication Date: 20260508
Application Date: 20260115

Claims (10)

1. The die bonding equipment is characterized by comprising a base, a table top component and a guide rail component, wherein the table top component and the guide rail component are arranged on the upper surface of the base, and the guide rail component is positioned above the table top component; the guide rail assembly comprises a fixed module and a movable module, the fixed module and the movable module are vertically arranged, and the movable module and the table top assembly are arranged in parallel; The fixed module comprises a first fixed guide rail and a second fixed guide rail which are arranged at two opposite ends of the base in parallel, the movable module comprises a first movable guide rail and a second movable guide rail which are arranged in parallel, and two ends of the first movable guide rail and the second movable guide rail are connected with the first fixed guide rail and the second fixed guide rail in a sliding manner; one side, close to each other, of the first movable guide rail and the second movable guide rail is respectively connected with a binding head assembly, and a suction nozzle and a dispensing assembly are arranged on the binding head assembly so as to execute the actions of pasting and dispensing; The first moving guide rail and/or the second moving guide rail move along the length direction of the first fixed guide rail and the second fixed guide rail so as to drive the corresponding binding head assembly to synchronously move, and the binding head assembly is in sliding connection with the corresponding first moving guide rail or the second moving guide rail and can move along the length direction of the first moving guide rail or the second moving guide rail.
2. The die bonder of claim 1, wherein the head-binding assembly comprises a ZR module, the ZR module comprises a plurality of ZR driving members, each ZR driving member is connected with a suction nozzle, and the suction nozzle realizes lifting and rotating movements through the ZR driving members; the types of a plurality of suction nozzles on the ZR module are the same or different.
3. The die bonding apparatus of claim 2, wherein the binding head assembly comprises a first mounting plate, a ZR module and a Z-axis module are fixed on the first mounting plate, a second mounting plate is fixed on the Z-axis module, and a visual detection assembly, a height measurement assembly and a dispensing assembly are fixed on the second mounting plate; When the Z-axis module works, the second mounting plate is driven to perform lifting movement; The first movable guide rail and the second movable guide rail are respectively provided with a connecting plate on one side close to each other, and the connecting plates are in sliding connection with the first movable guide rail or the second movable guide rail; the connecting plate is fixedly connected with the first mounting plate so as to connect the binding head assembly to the first moving guide rail and the second moving guide rail.
4. The die bonding apparatus of claim 1, wherein the first fixed rail has an avoidance opening near one end of the base, the table assembly comprises a rail module, one end of the rail module is fixed between the first fixed rail and the second fixed rail, and the other end of the rail module penetrates the avoidance opening and extends out of the base; The track module is perpendicular to the first fixed guide rail, and the track module is located between the first movable guide rail and the second movable guide rail.
5. The die bonder of claim 4, wherein the table assembly defines a loading and unloading area and a processing area sequentially along a length direction thereof; The feeding and discharging area is located on one side, away from the second fixed guide rail, of the first fixed guide rail, the processing area is located between the first fixed guide rail and the second fixed guide rail, and the processing area corresponds to movable areas of the first movable guide rail and the second movable guide rail.
6. The die bonding apparatus of claim 5, wherein the table assembly comprises a material table and a wafer table, the material table and the wafer table being disposed on the track module and being movable between the loading and unloading zone and the processing zone by the track module; the track module comprises a first track, a second track and a third track which are parallel and are arranged at intervals, wherein the first track and the third track are respectively positioned on two opposite sides of the second track, the first track and the third track are respectively connected with a material table in a sliding manner, and the second track is connected with the wafer table in a sliding manner.
7. The die bonding apparatus of claim 6, wherein the table assembly comprises a vacuum device; the vacuum device comprises a vacuum air pipe which is respectively communicated with the material table and the wafer table to adsorb materials placed on the material table; the vacuum gas tube may move with the material table and the wafer table.
8. The die bonder apparatus of claim 6, wherein said table assembly further comprises a suction nozzle holder and an upward looking camera, said suction nozzle holder and said upward looking camera being positioned in said processing area; One side of the first track, which is far away from the second track, is provided with a suction nozzle placing rack and an upward-looking camera, and one side of the third track, which is far away from the second track, is provided with a suction nozzle placing rack and an upward-looking camera; The suction nozzle placing rack is provided with a plurality of suction nozzles of different types; the upward-looking camera is arranged close to the material table and is used for identifying the positions of materials adsorbed by the suction nozzles on the binding head assembly.
9. The die bonding apparatus of claim 3, wherein the visual inspection assembly comprises a first camera and a second camera, and wherein the first camera and the second camera have different recognition accuracies.
10. The die bonding apparatus of claim 6, wherein the binding head assemblies on the first and second moving rails are operable on the wafer table simultaneously without interfering with each other.

Description

Die bonding equipment Technical Field The invention relates to the technical field of die bonders, in particular to die bonder equipment. Background The die bonder is used for realizing high-speed and high-precision full-automatic mounting of components and parts, and is the most critical and complex equipment in the whole chip packaging production. At present, most of die bonding equipment in the market has single function, poor applicability and low efficiency, the number of binding nozzles is small, the force control range of the mounting heads is smaller, and the control precision is poor, so that the die bonding equipment is difficult to adapt to advanced die bonding technology which has high precision requirements and needs to bond multiple types of chips simultaneously. Disclosure of Invention The invention provides a die bonding device for solving the technical problems of poor applicability and low efficiency of the conventional die bonding device. The technical problem is solved by providing the die bonding equipment, which comprises a base, a table top component and a guide rail component, wherein the table top component and the guide rail component are arranged on the upper surface of the base, the guide rail component is positioned above the table top component, the guide rail component comprises a fixed module and a movable module, the fixed module and the movable module are vertically arranged, the movable module is arranged in parallel with the table top component, the fixed module comprises a first fixed guide rail and a second fixed guide rail which are arranged in parallel at two opposite ends of the base, the movable module comprises a first movable guide rail and a second movable guide rail which are arranged in parallel, two ends of the first movable guide rail and the second movable guide rail are connected with the first fixed guide rail and the second fixed guide rail in a sliding manner, one side, close to each other, of the first movable guide rail and the second movable guide rail is respectively connected with a binding head component, the binding head component is provided with a suction nozzle and a glue dispensing component so as to execute a patch and glue dispensing action, the first movable guide rail and/or the second movable guide rail is/are arranged along the first fixed guide rail and the second movable guide rail is correspondingly to the movable head component or the movable head component along the moving direction of the first movable guide rail or the second movable guide rail. Preferably, the binding head assembly comprises a ZR module, the ZR module comprises a plurality of ZR driving parts, each ZR driving part is connected with a suction nozzle, the suction nozzles realize lifting and rotating motions through the ZR driving parts, and the types of the suction nozzles on the ZR module are the same or different. Preferably, the binding head assembly comprises a first mounting plate, wherein a ZR module and a Z-axis module are fixed on the first mounting plate, a second mounting plate is fixed on the Z-axis module, and a visual detection assembly, a height measurement assembly and a dispensing assembly are fixed on the second mounting plate; When the Z-axis module works, the second mounting plate is driven to perform lifting movement; The first movable guide rail and the second movable guide rail are respectively provided with a connecting plate on one side close to each other, and the connecting plates are in sliding connection with the first movable guide rail or the second movable guide rail; the connecting plate is fixedly connected with the first mounting plate so as to connect the binding head assembly to the first moving guide rail and the second moving guide rail. Preferably, the first fixed guide rail is provided with an avoidance port near one end of the base, the table top assembly comprises a track module, one end of the track module is fixed between the first fixed guide rail and the second fixed guide rail, the other end of the track module penetrates through the avoidance port and extends outwards of the base, the track module is perpendicular to the first fixed guide rail, and the track module is located between the first movable guide rail and the second movable guide rail. The table top assembly is characterized in that the table top assembly is provided with a first fixed guide rail, a second fixed guide rail and a table top assembly, the table top assembly is provided with a feeding and discharging area and a processing area along the length direction of the table top assembly, the feeding and discharging area is located on one side of the first fixed guide rail away from the second fixed guide rail, the processing area is located between the first fixed guide rail and the second fixed guide rail, and the processing area corresponds to movable areas of the first movable guide rail and the second movable guide rail. Preferably, the table top a