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CN-122003162-A - Variable-step-pitch parallel mounting heat type die bonder and mounting method thereof

CN122003162ACN 122003162 ACN122003162 ACN 122003162ACN-122003162-A

Abstract

The invention discloses a variable-step-distance parallel mounting type die bonder and a mounting method thereof, and relates to the technical field of die bonders, wherein the die bonder comprises a rack, a heating tunnel furnace, a stirring assembly and a control system; the heating tunnel furnace is used for continuously heating the lead frame, the conveying direction of the heating tunnel furnace is sequentially provided with at least two mounting functional units, and each mounting functional unit is provided with an independent chip picking and mounting executing mechanism. Through setting up at least two and possessing independent chip and pick up and paste the dress functional unit of dress actuating mechanism along heating tunnel stove direction of transfer, the cooperation control of the variable material step design and the control system of dialling of cooperation material subassembly, effectively solve among the prior art the paster process rely on single bang toughe to accomplish two chip pastes in proper order, the paster station becomes restriction complete machine beat bottleneck to and only need the problem that many sets of actuating mechanism idle, equipment utilization ratio is showing to decline when single chip of dress.

Inventors

  • Gu tiansheng
  • Wen Jiemin
  • WEN LIJING

Assignees

  • 深圳市华科半导体有限公司

Dates

Publication Date
20260508
Application Date
20260305

Claims (10)

  1. 1. The utility model provides a but thermal die bonder is adorned in parallel subsides of variable stride which characterized in that includes: A frame (1); The device comprises a heating tunnel furnace (2) and at least two mounting functional units, wherein the heating tunnel furnace is used for continuously heating a lead frame (13), the conveying direction of the heating tunnel furnace (2) is sequentially provided with the at least two mounting functional units, and each mounting functional unit is respectively provided with an independent chip pick-up and mounting executing mechanism and is used for executing chip mounting operation in a heating environment; The material stirring assembly (3) is arranged at the side or above the heating tunnel furnace (2) and is used for driving the lead frame (13) to intermittently move along the conveying direction, and the material stirring assembly (3) is provided with a variable material stirring step distance; The control system (4) is in communication connection with the material stirring assembly (3) and each mounting functional unit; The material stirring assembly (3) is at least provided with a first material stirring step distance mode and a second material stirring step distance mode, in the first material stirring step distance mode, the adjacent material stirring step distances of two times enable different mounting functional units to respectively finish mounting of different mounting areas of the lead frame (13) in the same beat period, and in the second material stirring step distance mode, the adjacent material stirring step distances of two times enable different mounting functional units to finish mounting of a plurality of chips in the same mounting area in sequence under the condition that the lead frame (13) is not separated from the heating tunnel furnace (2).
  2. 2. The variable pitch parallel mounting heat type die bonder according to claim 1, wherein a first mounting functional unit (5) and a second mounting functional unit (6) are sequentially provided along a conveying direction of the heating tunnel furnace (2); the first mounting functional unit (5) comprises a first bonding head assembly (51), a first crystal disc movement assembly (52) and a first thimble assembly (53) which are arranged on the frame (1); The second mounting functional unit (6) comprises a second bonding head assembly (61), a second crystal disc movement assembly (62) and a second thimble assembly (63) which are arranged on the frame (1).
  3. 3. The variable pitch parallel mounting thermal die bonder of claim 2, wherein a first mounting vision camera assembly (54) is provided on one side of the first ejector pin assembly (53), and a second mounting vision camera assembly (64) is provided on one side of the second ejector pin assembly (63).
  4. 4. The variable pitch parallel mounting heat die bonder according to claim 2, wherein a first tin drawing component (7), a second tin drawing component (8), a first die component (9) and a second die component (10) are sequentially arranged along the conveying direction of the heating tunnel furnace (2) before the mounting functional units, the first tin drawing component (7) and the first die component (9) correspond to the action station of the first mounting functional units (5), and the second tin drawing component (8) and the second die component (10) correspond to the action station of the second mounting functional units (6).
  5. 5. The variable pitch parallel mounting heat die bonder of claim 1, wherein in the first pitch pattern, the pitch of two adjacent pitches is twice the width of the mounting area, and in the second pitch pattern, the pitch of two adjacent pitches is twice the width of the mounting area.
  6. 6. The variable pitch parallel mounting thermal die bonder of claim 5, wherein a maximum material pulling stroke of the material pulling assembly (3) is greater than twice a width of a mounting area to support switching between the first material pulling step and the second material pulling step.
  7. 7. The variable-pitch parallel mounting thermal die bonder according to claim 1, wherein the material stirring assembly (3) comprises a moving shaft (31) and a plurality of stirring pieces (32), the stirring pieces (32) are sequentially and detachably connected to the moving shaft (31) along the conveying direction of the heating tunnel furnace (2), the moving shaft (31) is connected with a vertical driving piece (33) and a horizontal driving piece (34), and the vertical driving piece (33) and the horizontal driving piece (34) are both connected to the frame (1).
  8. 8. The variable pitch parallel mounting heat die bonder according to claim 7, wherein the toggle member (32) comprises a connecting plate (321), one end of the connecting plate (321) is detachably connected with the moving shaft (31), the other end of the connecting plate (321) is detachably connected with the first adjusting plate (322), one end of the first adjusting plate (322) is connected with the second adjusting plate (323), and a toggle rod (324) is connected to the bottom of the second adjusting plate (323).
  9. 9. The variable-pitch parallel mounting heat die bonder according to claim 1, wherein a feeding assembly (11) is arranged at a feeding end of the frame (1), and a discharging assembly (12) is arranged at a discharging end of the frame (1).
  10. 10. A mounting method of a variable pitch parallel mounting heat die bonder, which is applied to the variable pitch parallel mounting heat die bonder as claimed in any one of claims 1 to 9, comprising the steps of: s1, feeding the lead frame (13) into a heating tunnel furnace (2) from a feeding end, and continuously heating the lead frame (13) in the heating tunnel furnace (2); s2, a control system (4) acquires a current encapsulation working condition instruction, and controls a material stirring component (3) to switch to a corresponding material stirring step mode according to the encapsulation working condition instruction; S3, the material stirring assembly (3) drives the lead frame (13) to intermittently move along the conveying direction of the heating tunnel furnace (2), so that the lead frame (13) sequentially passes through each mounting functional unit; S4, when the material stirring assembly (3) operates in a first material stirring step mode, the adjacent material stirring steps of two times enable different mounting functional units to respectively execute chip mounting operation on different mounting areas of the lead frame (13) in the same beat period, and when the material stirring assembly (3) operates in a second material stirring step mode, the adjacent material stirring steps of two times enable different mounting functional units to sequentially execute mounting operation of a plurality of chips on the same mounting area under the condition that the lead frame (13) is not separated from the heating tunnel furnace (2); S5, outputting the lead frame (13) after finishing the mounting by a discharging end.

Description

Variable-step-pitch parallel mounting heat type die bonder and mounting method thereof Technical Field The invention relates to the technical field of thermal die bonders, in particular to a variable-step-size parallel mounting thermal die bonder and a mounting method thereof. Background The thermal die bonder is a key process device in the power device packaging production, and is used for continuously heating the lead frame under the controlled high temperature and protective gas environment to wet, spread and solidify solder, so that reliable metallurgical bonding between the chip and the lead frame is realized. Typical thermal die attach processes include leadframe heating, tin drawing, die stamping, and die attach, each of which is typically performed at a corresponding functional station arranged in sequence along the leadframe transport direction. The prior thermal die bonding equipment is mainly divided into a single-drawing tin structure, a single-pressing die structure, a Shan Bang-head structure, a multi-station structure expanded on the basis of the single-drawing tin structure, the single-pressing die structure and the multi-station structure according to the structural configuration. The thermal die bonder with the structure of single-drawing tin, single-pressing die and Shan Bang heads has a clear structure and relatively simple control logic, and has been widely used as a mainstream scheme in the field of power device packaging for a long time. Along with the development of the power device packaging technology to the high integration degree, the application scenes of the same lead frame, which need to be provided with a plurality of chips in a pasting way, are increasingly increased. In order to meet the packaging requirement of double chips, the prior art mainly adopts the following realization modes that firstly, double-chip mounting is completed through twice independent die bonding, namely, a lead frame enters a thermal die bonding device twice in sequence to respectively complete the mounting procedures of two chips, although the scheme does not need to reform the device, products need to undergo two complete heating and cooling processes, the consistency of the appearance of welding lines and the packaging reliability are adversely affected, secondly, two single-head thermal die bonding machines are connected end to end, so that the lead frame sequentially enters the two devices to complete the mounting of the two chips in a one-time transmission process, the scheme improves the production continuity, but the equipment occupation area is large, the energy consumption is high, and the beat is limited by the single die bonding capability, thirdly, the double-head thermal die bonding machine is adopted, namely, two die bonding heads are arranged on a single head, and two sets of tin drawing assemblies and two die pressing assemblies are configured in a previous procedure, so that the same lead frame completes the welding lines required by the two chips in the one-time heating process. Meanwhile, the scheme mainly surrounds the double-chip packaging working condition design, and when only a single chip is required to be mounted, the configured multiple sets of executing mechanisms are idle, so that the equipment utilization rate is obviously reduced. Therefore, how to simultaneously realize high mounting beat, high equipment utilization rate and flexible compatibility of single-chip and double-chip packaging working conditions under the single continuous thermal cycle condition becomes a technical problem to be solved in the field. Disclosure of Invention The invention provides a variable-step-pitch parallel mounting heat type die bonder and a mounting method thereof, which can solve the problems that in the prior art, mounting of two chips is finished sequentially by a single bonding head in a mounting process, a mounting station becomes a bottleneck for restricting the beat of a whole machine, and when only a single chip is required to be mounted, a plurality of sets of configured execution mechanisms are idle, and the utilization rate of equipment is obviously reduced. The die bonder comprises a frame, a heating tunnel furnace, a stirring component and a control system, wherein the heating tunnel furnace is used for continuously heating a lead frame, at least two mounting functional units are sequentially arranged in the conveying direction of the heating tunnel furnace, each mounting functional unit is respectively provided with an independent chip pick-up and mounting executing mechanism for executing chip mounting operation in a heating environment, the stirring component is arranged on the side or the upper side of the heating tunnel furnace and is used for driving the lead frame to intermittently move along the conveying direction, the stirring component is provided with a variable stirring step distance, the control system is in communication connection with the stirring componen