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CN-122003163-A - PIN needle applied to power module and manufacturing method

CN122003163ACN 122003163 ACN122003163 ACN 122003163ACN-122003163-A

Abstract

The application discloses a PIN needle applied to a power module and a manufacturing method thereof, and relates to a power semiconductor packaging technology, comprising a needle body, a power semiconductor packaging device and a power semiconductor packaging device, wherein the lower end of the needle body is provided with an inclined side surface, and the lower end of the needle body is in a frustum shape; the lining plate comprises a first layer plate, wherein a positioning groove is formed in the first layer plate, the shape of the positioning groove is matched with that of the lower end of the needle body and is larger than that of the lower end of the needle body, a welding material layer is arranged between the needle body and the positioning groove, and the needle body is fixed in the positioning groove through the welding material layer. In the application, the lower end of the needle body is arranged in a right circular truncated cone shape, so that the preplating tin solder reacts with the first laminate made of copper and the needle body at high temperature to form intermetallic compounds, and the intermetallic compounds flow into the positioning groove along the side surface, thereby enhancing the welding area between the needle body and the positioning groove and further improving the mechanical strength.

Inventors

  • DU LONGCHUN
  • LIU HONGWEI
  • Wang Xianchi
  • LIU XIAOPENG
  • CAI ZHAO
  • HE JINGYUAN

Assignees

  • 湖南国芯半导体科技有限公司

Dates

Publication Date
20260508
Application Date
20260313

Claims (7)

  1. 1. A PIN needle for a power module, comprising: The needle comprises a needle body (10), wherein the lower end of the needle body (10) is provided with an inclined side surface, and the lower end of the needle body (10) is in a frustum shape; The lining plate (20) comprises a first layer plate (21), wherein a positioning groove (24) is formed in the first layer plate (21), and the shape of the positioning groove (24) is matched with the shape of the lower end of the needle body (10) and is larger than the lower end of the needle body (10); a solder layer (30) is arranged between the needle body (10) and the positioning groove (24) and at the lower end of the needle body (10), and the needle body (10) is fixed in the positioning groove (24) through the solder layer (30).
  2. 2. The PIN needle for power module as set forth in claim 1, wherein said solder layer (30) is 。
  3. 3. The PIN needle for power module according to claim 3, wherein the lining plate (20) further comprises a second layer plate (22) and a third layer plate (23) which are sequentially arranged below the first layer plate (21), the second layer plate (22) is fixedly connected with the first layer plate (21) and the third layer plate (23) respectively, and the first layer plate (21) and the third layer plate (23) are made of copper metal.
  4. 4. A PIN needle for a power module according to claim 3, characterized in that said second layer (22) is of ceramic material.
  5. 5. Pin for power modules according to claim 2, characterized in that the PIN body (10) is copper metal.
  6. 6. A method for manufacturing a PIN, for manufacturing a PIN according to any one of claims 2-5, characterized in that: s100, plating or vapor depositing tin solder on the lower end face and the lower end circumference of the needle body (10); s200, mounting the needle body (10) in the positioning groove (24); s300, performing nitrogen-based atmosphere protection heat treatment on the needle body (10) and the lining plate (20).
  7. 7. The method of manufacturing a PIN needle as claimed in claim 6, wherein the heating temperature is 250℃and the duration is 30-40 minutes in step S300.

Description

PIN needle applied to power module and manufacturing method Technical Field The invention relates to a power semiconductor packaging technology, in particular to a PIN needle applied to a power module and a manufacturing method thereof. Background Some functional PIN signal terminals (such as drive control, temperature sensor, current detection, etc.) in the power module generally need to be managed separately from the power terminals, and PIN connection is often adopted. The PIN is not only the current channel between the internal chip of the module and the external circuit board, but also the main mechanical connection point between the module and the external circuit, and bears the stress caused by PCB installation, connector plugging and connector plugging, transportation vibration and the like. As shown in fig. 1 and 2, the PIN is soldered to the board by solder paste provided on the board in advance in the reflow process. However, the existing PIN needle is easy to generate poor tin climbing during reflow soldering due to the shape of the existing PIN needle, so that the effective soldering area is insufficient, the mechanical strength of the PIN needle is weak, and even the risk of cold soldering is caused, meanwhile, although the interface of the traditional reflow soldering layer is an intermetallic compound, the existence of solder in the soldering layer still causes the low melting point of the whole soldering layer, and the module cannot be applied to a high-temperature environment. Disclosure of Invention The invention provides a PIN needle applied to a power module and a manufacturing method thereof, and aims to solve the problem of insufficient welding strength between the PIN needle and a lining plate. To achieve the above object, an embodiment of the present invention provides a PIN needle applied to a power module, including: The lower end of the needle body is provided with an inclined side surface, and the lower end of the needle body is in a frustum shape; the lining plate comprises a first layer plate, wherein a positioning groove is formed in the first layer plate, the shape of the positioning groove is matched with that of the lower end of the needle body and is larger than that of the lower end of the needle body; And a solder layer is arranged between the needle body and the positioning groove, and the needle body is fixed in the positioning groove through the solder layer. Preferably, the solder layer is。 Preferably, the lining plate further comprises a second layer plate and a third layer plate which are sequentially arranged below the first layer plate, the second layer plate is fixedly connected with the first layer plate and the third layer plate respectively, and the first layer plate and the third layer plate are made of copper metal. Preferably, the second layer plate is made of ceramic material. Preferably, the needle body is copper metal. The application also provides a manufacturing method of the PIN needle, which is used for manufacturing the PIN needle: s100, plating or vapor depositing tin solder on the lower end face and the lower end circumference of the needle body; s200, mounting the needle body in the positioning groove; s300, performing nitrogen-based atmosphere protection heat treatment on the needle body and the lining plate. Preferably, in step S300, the heating temperature is 250 ° and the duration is 30-40 minutes. The scheme of the invention has the following beneficial effects: In the application, the lower end of the needle body is arranged in the shape of the right circular truncated cone, so that when the needle body is heated and welded, solder flows downwards along the side surface of the lower end of the needle body into the positioning groove, and the welding area between the needle body and the positioning groove is enhanced, thereby improving the mechanical strength. Further, tin and copper formation in high temperature environmentsThe melting point of which is much higher than the soldering temperature, so that the power module can operate at a higher ambient temperature. Additional features and advantages of the invention will be set forth in the detailed description which follows. Drawings FIG. 1 is a schematic diagram of a prior art PIN needle; FIG. 2 is an enlarged view of portion A of FIG. 1; FIG. 3 shows a lining board according to the present application, FIG. 4 is a schematic view of a needle body of the present application; FIG. 5 is a schematic illustration of the present application; Fig. 6 is an enlarged view of a portion B in fig. 5. [ Reference numerals description ] 10-Needle body, 20-lining board, 21-first layer board, 22-second layer board, 23-third layer board, 24-positioning groove, 30-Solder layer. Detailed Description In order to make the technical problems, technical solutions and advantages to be solved more apparent, the following detailed description will be given with reference to the accompanying drawings and specific