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CN-122003165-A - Power semiconductor module with molded body and method for producing the same

CN122003165ACN 122003165 ACN122003165 ACN 122003165ACN-122003165-A

Abstract

A power semiconductor module with a molded body having a frame-like molded body with a first base plate arranged therein, the first base plate having a first base plate conductor track, with a second base plate conductor track, and the molded body having a first connecting element, the first base plate conductor track having a normal direction, wherein the molded body has a first frame section and a second frame section, which are preferably positioned opposite the first frame section, wherein the first frame section and the second frame section are connected by a web, wherein the first connecting element has a first contact section, a first mounting section and a first connecting section, the first contact section being connected to an associated section of the first base plate conductor track in a material-bonded manner, the first mounting section being connected to the web, the first connecting section being provided for external connection, and a method for producing the same are proposed.

Inventors

  • Tobias Schutz
  • Lucia Fantazzo
  • Andreas Lister
  • John Assam
  • SHEN YANFENG

Assignees

  • 赛米控丹佛斯有限责任公司

Dates

Publication Date
20260508
Application Date
20251103
Priority Date
20241105

Claims (16)

  1. 1. Power semiconductor module (1) having a frame-like molded body (2) with a first substrate (3) arranged therein, the first substrate (3) having a first substrate conductor track (30), having a second substrate conductor track (32), the first substrate conductor track (30) having a normal direction (N), and the molded body having a first connection element (4), wherein the molded body (2) has a first frame section (20) and a second frame section (22), the second frame section (22) being preferably positioned opposite to the first frame section, wherein the first frame section (20) and the second frame section (22) are connected by a web (24), wherein the first connection element (4) has a first contact section (40), a first mounting section (42) and a first connection section (44), the first contact section (40) being conductively connected to an associated first section (340) of the first substrate conductor track (30) in a material-bonded manner, the first mounting section (42) being connected to the web (24) for connection to an outside arrangement.
  2. 2. The power semiconductor module of claim 1, wherein, The moulded body (2) and the web (24) are formed in one piece.
  3. 3. The power semiconductor module of claim 1, wherein, The moulded body (2) and the web (24) are formed in two pieces, preferably of the same material, and are preferably connected to each other by means of a snap-in latch connection.
  4. 4. A power semiconductor module according to any one of claims 1 to 3, wherein, A second connection element (5) having a second contact section (50) has a second mounting section (52) and a second connection section (54), the second contact section (50) being conductively connected to an associated second section (350) of the second substrate conductor track (32) in a material-bonded manner, the second mounting section (52) being connected to the web (24), the second connection section (54) being provided for external connection.
  5. 5. A power semiconductor module according to any one of claims 1 to 3, wherein, The respective contact section (40, 50), if present, is kept laterally distant with respect to a longitudinal direction (46, 56) of the respective connecting element (4, 5), the longitudinal direction (46, 56) being aligned in the normal direction (N).
  6. 6. The power semiconductor module of claim 4, wherein, The first mounting section (42) and the second mounting section (52) are arranged to remain remote from each other.
  7. 7. A power semiconductor module according to any one of claims 1 to 3, wherein, A third substrate conductor track (36) is arranged on the first substrate (3) or the second substrate (300), and wherein a power semiconductor component (380) is conductively connected to the first substrate conductor track (30) or the second substrate conductor track (32) by means of a connection device (382, 384), the power semiconductor component (380) being arranged on the third substrate conductor track (36).
  8. 8. The power semiconductor module of claim 7 wherein, Viewed from the normal direction (N), the connection device (384) partially overlaps a section of the first connection element (4) or the second connection element (5).
  9. 9. A power semiconductor module according to any one of claims 1 to 3, wherein, The metal body (6) with the third contact section (60) has a third mounting section (62), and preferably a fourth contact section (66), which third contact section (60) is conductively connected in a material-bonded manner to an associated third section (360) of one of the substrate conductor tracks (30, 32, 36, 38) of the substrate (3, 300) or to a metalized surface of the power semiconductor component (380), which third mounting section (62) is connected to the web (24, 26), and which fourth contact section (66) is conductively connected in a material-bonded manner to an associated fourth section (366) of one of the substrate conductor tracks (30, 32, 36) of the substrate (3, 300) or to a metalized surface of the power semiconductor component (380).
  10. 10. The power semiconductor module of claim 9 wherein, The third contact section (60) and the fourth contact section (66) are connected to the same substrate conductor track (30, 32, 36).
  11. 11. A power semiconductor module according to any one of claims 1 to 3, wherein, Preferably, all mounting sections (42, 52, 62), if present, are connected to the web (24, 26) by press fit, form fit or material bonding.
  12. 12. The power semiconductor module of claim 4, wherein, The printed circuit board (7) has respective elongated cutouts (74, 75) for the first connection section (44) and the second connection section (54), the printed circuit board (7) being arranged above the web (24) in the normal direction (N), wherein the broadsides (740, 750) of the cutouts (74, 75) are arranged alongside one another.
  13. 13. Method for producing a power semiconductor module (1) according to any one of claims 1 to 12, comprising the following steps in the order specified: a) -arranging the moulded body (2) to form a first substrate (3), wherein the web (24) is integrally formed with the moulded body (2) and has a first connecting element (4); b) -materially bonding the first contact section (40) of the first connection element (4) to an associated section (340) of the first conductor track (30).
  14. 14. Method for producing a power semiconductor module (1) according to any one of claims 1 to 12, comprising the following steps in the order specified: a) -arranging the moulding body (2) to form a first substrate (3); b) -arranging the web (24) together with the first connecting element (4) and connecting the web (24) to the molded body (2); c) -materially bonding the first contact section (40) of the first connection element (4) to an associated section (340) of the first conductor track (30).
  15. 15. The method according to any one of claims 13 or 14, wherein, The second connecting element (5) and preferably also the metal body (6) are arranged on the web (24).
  16. 16. The method according to any one of claims 13 to 14, wherein, The material bond is realized as an adhesive bond, a braze, a sinter or a welded connection.

Description

Power semiconductor module with molded body and method for producing the same Technical Field The invention relates to a power semiconductor module and a method for producing the same, comprising a frame-like molded body, in which a first base plate is arranged, and comprising a first connecting element, wherein the molded body comprises a first frame section and a second frame section, which is preferably located opposite the first frame section, wherein the first frame section and the second frame section are connected by a web. Background DE 10 2021 134 003 A1 discloses a power semiconductor module and a method for producing the same, which has a housing, a switching device arranged therein, and a plurality of connecting elements, wherein the respective connecting elements have a first connecting section and a second connecting section, the first connecting section being arranged in the housing in a form-fitting manner, and the second connecting section being arranged in the housing in a material-bonded or press-fitting manner. Disclosure of Invention With the above in mind, the present invention is based on the object of proposing a power semiconductor module with improved electrical properties and improved mounting, and a method for producing the same. According to the invention, this object is achieved by a power semiconductor module having a frame-like molded body with a first base plate arranged therein and having a first connection element, the first base plate having a first base plate conductor track with a second base plate conductor track, the first base plate conductor track having a normal direction, wherein the molded body has a first frame section and a second frame section, which are preferably located opposite the first frame section, wherein the first frame section and the second frame section are connected by a web, wherein the first connection element has a first contact section, a first mounting section and a first connection section, the first contact section being connected to an associated section of the first base plate conductor track in a material-bonded manner, the first mounting section being provided for external connection. Preferably, the moulded body and the web are formed as one piece. It is also preferred that the moulded body and the web are formed in two pieces, preferably of the same material, and are preferably connected to each other by means of a snap-in latch connection. It may be advantageous if the second connection element has a second contact section which is electrically conductively connected to an associated section of the second conductor track in a material-bonded manner, the second connection element having a second mounting section which is connected to the web and a second connection section which is provided for external connection. It may also be preferable if the respective contact section (if present) is kept laterally distant with respect to a longitudinal direction of the respective connecting element, wherein the longitudinal direction is aligned in the normal direction. It may also be preferred that the first and second mounting sections are arranged to remain remote from each other. Furthermore, it may be advantageous if a third conductor track is arranged on the first or second substrate and wherein a power semiconductor component conductively connected to the first or second conductor track by means of a connection device is arranged on this third conductor track. It may be advantageous if the connection device is observed to overlap partially with a section of the first or second connection element in the normal direction. It may likewise be preferred if the metal body 6 with the third contact section has a third mounting section, which is connected to the web, and preferably a fourth contact section, which is connected to the associated section 360 of one of the conductor tracks of one of the substrates or the metallized surface of the power semiconductor component in a material-bonded manner, which is connected to the associated section of one of the conductor tracks of one of the substrates or the metallized surface of the power semiconductor component in a material-bonded manner. It may be advantageous if said third and fourth contact sections are connected to the same said conductor track. It may also be advantageous if preferably all mounting sections (if present) are connected to the web in a press fit, form fit or material bonding. It may be preferred if the printed circuit board has respective elongated cutouts for the first and second connection sections, the printed circuit board being arranged above the web in the normal direction, wherein the broadsides of the cutouts are arranged beside each other. According to the invention, the above object is also achieved by a method for manufacturing the above power semiconductor module, comprising the following steps in the order specified: a) Arranging the molded body to form a first su