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CN-122003203-A - Thin film diaphragm capacitive electrode

CN122003203ACN 122003203 ACN122003203 ACN 122003203ACN-122003203-A

Abstract

An implantable sensor device includes a deflectable diaphragm layer comprising vapor deposited thin film metal, a first capacitive electrode conformally formed on a first side of the deflectable diaphragm layer, and a second capacitive electrode coupled to a rigid substrate, the second capacitive electrode and the first capacitive electrode forming a variable capacitor. An implantable sensor device is fabricated by depositing a thin film metal layer on a substrate using a physical vapor deposition process and depositing a conformal electrical conductor layer on a stack including the thin film metal layer.

Inventors

  • G. Rios
  • A.H. Simmons

Assignees

  • 爱德华兹生命科学公司

Dates

Publication Date
20260508
Application Date
20240826
Priority Date
20230907

Claims (20)

  1. 1. An implantable sensor device, comprising: a deflectable diaphragm layer comprising vapor deposited film metal; a first capacitive electrode conformally formed on a first side of the deflectable diaphragm layer, and A second capacitive electrode coupled to the rigid substrate, the second capacitive electrode and the first capacitive electrode forming a variable capacitor.
  2. 2. The implantable sensor device of claim 1, further comprising a first dielectric layer disposed between the deflectable diaphragm layer and a first side of the first capacitive electrode.
  3. 3. The implantable sensor device of claim 2, wherein the first dielectric layer electrically insulates the first capacitive electrode from the deflectable diaphragm layer.
  4. 4. The implantable sensor device of claim 2, further comprising a second dielectric layer disposed on a second side of the first capacitive electrode.
  5. 5. The implantable sensor device of any one of claims 1-4, further comprising one or more electrical contacts protruding from the first capacitive electrode, the one or more electrical contacts physically contacting the first capacitive electrode.
  6. 6. The implantable sensor device of claim 5, wherein: The shape of the first capacitive electrode is elliptical, and The one or more electrical contacts are elongated contacts disposed along a perimeter of the first capacitive electrode.
  7. 7. The implantable sensor device according to any one of claims 1 to 4, wherein the deflectable diaphragm layer and the first capacitive electrode form a stack having a thickness of less than 10 μιη.
  8. 8. The implantable sensor device of any one of claims 1-4, wherein the deflectable membrane layer includes protrusions associated with one or more sides thereof.
  9. 9. The implantable sensor device of claim 8, wherein the protrusions are formed using etching, masking, or plating.
  10. 10. The implantable sensor device of claim 8, wherein the protrusions are corrugations.
  11. 11. The implantable sensor device of any one of claims 1-4, wherein the first capacitive electrode includes a protrusion associated with one or more sides thereof.
  12. 12. The implantable sensor device of claim 11, wherein the protrusions are formed using etching, masking, or plating.
  13. 13. A method of manufacturing an implantable sensor device, the method comprising: Depositing a thin film metal layer on a substrate using a physical vapor deposition process, and A conformal electrical conductor layer is deposited over the stack including the thin film metal layer.
  14. 14. The method of claim 13, further comprising forming a first dielectric layer on a surface of the thin film metal layer after the depositing the thin film metal layer and before the depositing the electrical conductor layer, wherein the electrical conductor layer is deposited on the first dielectric layer.
  15. 15. The method of claim 14, further comprising forming a second dielectric layer on the electrical conductor layer.
  16. 16. The method of any one of claims 13-15, further comprising forming an electrical contact flange on the electrical conductor layer.
  17. 17. The method of any one of claims 13-15, further comprising forming surface protrusions on a surface of the thin film metal layer.
  18. 18. The method of any one of claims 13-15, further comprising forming surface protrusions on the electrical conductor layer.
  19. 19. The method of any one of claims 13 to 15, further comprising: Bonding a plate structure comprising at least the thin film metal layer and the electrical conductor layer to a base structure comprising a capacitive electrode to form a sealed cavity comprising a space between the electrical conductor layer and the capacitive electrode, and Forming a sealing flange in or on the thin film metal layer, wherein the bonding of the plate structure to the base structure involves bonding a contact surface of the sealing flange to the base structure.
  20. 20. The method of any one of claims 13-15, further comprising forming one or more corrugations in a portion of the thin film metal layer, wherein the one or more corrugations are coaxial with the electrical conductor layer.

Description

Thin film diaphragm capacitive electrode RELATED APPLICATIONS The present application claims priority from U.S. provisional patent application serial No. 63/581,226 filed on 7 of 9 of 2023 and entitled "THIN film membrane capacitive electrode (THIN-FILM DIAPHRAGM CAPACITIVE ELECTRODE"), the entire disclosure of which is hereby incorporated by reference in its entirety. Background The present disclosure relates generally to the field of sensor devices. Some sensor devices (e.g., suitable for medical implants) may include deflectable diaphragms. The size, elasticity, compliance, biocompatibility, shape, and other characteristics of such deflectable diaphragm assemblies can affect the suitability for implementation in an implantable sensor device. Disclosure of Invention Methods, systems, and devices are described herein that facilitate transduction of pressure (e.g., blood/fluid pressure levels within a human body) into electrical signals for purposes of sensing pressure. In particular, various pressure sensor packaging solutions are disclosed herein that provide for depositing layers of metal or other materials to form a diaphragm structure that includes one or more layers, at least one of which includes/forms a conductive capacitive electrode (e.g., 'anode') layer. Such membrane structures/stacks may advantageously have relatively thin profiles and/or superelastic properties. For example, a sensor device according to aspects of the present disclosure that may serve as a biocompatible sensor implant device for cardiac or other implants may include one or more diaphragms formed of a thin superelastic vapor deposited layer that may be formed of nitinol (or a similar material, with a capacitive electrode layer formed on the nitinol layer. The conductive electrode layer may be disposed directly on the deposited film, the superelastic metal (e.g., nitinol) layer, or one or more dielectric/insulator layers may be formed between the electrode and the superelastic metal layer. The thin film superelastic metal and/or electrode layer may have certain topological/surface features, such as corrugations, ridges, valleys, bumps, struts, pillars, spikes/pyramids, clusters, and/or other geometric/uniform and/or amorphous/irregular features that advantageously increase the linear deflection and/or effective surface area of the separator film on one or more sides thereof. Examples of the present disclosure may include a thin superelastic metal (e.g., nitinol) membrane with one or more layers of high-k dielectric deposited/formed thereon, wherein the superelastic metal layer provides a mechanical structure/substrate for dielectric and conductor stacks. The deposited thin film metal layer may advantageously provide a superelastic, biocompatible face/shell for the sensor device. Any of the various systems, devices, apparatuses, etc. in the present disclosure may be sterilized (e.g., with heat, radiation, ethylene oxide, hydrogen peroxide, etc.) to ensure that they are safely used with a patient, and the methods herein may include sterilizing the associated systems, devices, apparatuses, etc. (e.g., with heat, radiation, ethylene oxide, hydrogen peroxide, etc.). The methods and structures for treating a patient disclosed herein also encompass similar methods and structures performed on or placed on a simulated patient, which may be used for example for training, demonstration, program and/or device development, and the like. The simulated patient may be physical, virtual, or a combination of physical and virtual. The simulation may include a simulation of all or part of the patient, e.g., the entire body, a portion of the body (e.g., the chest), a system (e.g., the cardiovascular system), an organ (e.g., the heart), or any combination thereof. The physical element may be natural, including human or animal carcasses or parts thereof, synthetic, or any combination of natural and synthetic. The virtual element may be entirely in computer simulation, or overlaid on one or more of the physical components. The virtual elements may be presented on any combination of screens, headphones, holographic projections, speakers, headphones, pressure transducers, temperature transducers, or using any combination of suitable technologies. Certain aspects, advantages and novel features have been described for purposes of summarizing the disclosure. It should be understood that not all such advantages may be necessarily achieved according to any particular example. Thus, the disclosed examples can be carried out in a manner that achieves or optimizes one advantage or group of advantages as taught herein without necessarily achieving other advantages as may be taught or suggested herein. Drawings For purposes of illustration, various examples are depicted in the drawings and should not be construed to limit the scope of the invention in any way. In addition, various features of the different disclosed examples can be combined to form further example