CN-122003389-A - Glass substrate metallization acceleration composition, method for producing same, glass substrate metallization acceleration method, and metallized glass substrate

Abstract

The present disclosure is directed to a glass substrate metallization accelerating composition comprising a silane coupling agent and a Pd binder, wherein the Pd binder is a metal ion-containing compound comprising a functional group capable of binding with the silane coupling agent. The metal layer can be uniformly formed on the glass substrate having a high aspect ratio only by the wet process.

Inventors

• ZHENG DAZHE
• Quan Wuzhuo
• LIU XIANGXU
• CUI YANAN
• Yu Shangmen

Assignees

• 株式会社LG化学

Dates

Publication Date

20260508

Application Date

20250124

Priority Date

20240902

Claims (11)

1. 1. A glass substrate metallization accelerating composition includes a silane coupling agent, and a Pd binder, wherein the Pd binder is a metal ion-containing compound including a functional group capable of binding with the silane coupling agent.
2. 2. The glass substrate metallization acceleration composition of claim 1, wherein the Pd binder is represented by the following chemical formula 1: [ chemical formula 1] In the chemical formula 1, the chemical formula is shown in the drawing, L 1 to L 3 are identical or different and are each independently C1 to C5 alkylene, X 1 is-NH 2 , -OH, -C (=O) OH or-P (=O) (OH) 2 , X 2 and X 3 are identical or different and are each independently -NH 2 、-OH、-C(＝O)OH、-C(＝O)O - M + 、-P(＝O)(OH) 2 、-P(＝O)(OH)(O - M + ) or-P (=o) (O - M + ) 2 , M is Li or Na, and At least one of X 2 and X 3 is-C (=o) O - M + 、-P(＝O)(OH)(O - M + ) or-P (=o) (O - M + ) 2 ).
3. 3. The glass substrate metallization acceleration composition of claim 1, wherein the silane coupling agent is represented by the following chemical formula 2: [ chemical formula 2] In the chemical formula 2, the chemical formula is shown in the drawing, R 1 to R 3 are identical or different and are each independently C1 to C5 alkyl, L 11 and L 12 are identical or different and are each independently C1 to C5 alkylene, N is 0 or 1, and Q is-SH, -NH 2 , or a fused heterocyclic group containing O.
4. 4. The glass substrate metallization acceleration composition of claim 1, further comprising a phase stabilizer selected from the group consisting of hydrochloric acid, sulfuric acid, methanol, ethanol, isopropanol, and sodium hydroxide.
5. 5. The glass substrate metallization accelerating composition of claim 1, further comprising a solvent and a phase stabilizer, and the silane coupling agent is contained in 0.1 to 5 parts by weight, the Pd binder is contained in 0.3 to 5 parts by weight, and the phase stabilizer is contained in 1 to 20 parts by weight based on 100 parts by weight of the glass substrate metallization accelerating composition.
6. 6. A method for preparing a glass substrate metallization accelerating composition comprising the steps of preparing a mixture by mixing a silane coupling agent with a Pd binder, and stirring the mixture, Wherein the Pd binder is a metal ion-containing compound containing a functional group capable of binding with the silane coupling agent.
7. 7. The method for preparing a glass substrate metallization accelerating composition according to claim 6, wherein the step of stirring the mixture is performed at 15 ℃ to 25 ℃.
8. 8. The method for preparing a glass substrate metallization accelerating composition according to claim 6, wherein the step of stirring the mixture is performed for 1 hour to 3 hours.
9. 9. A glass substrate metallization acceleration method comprising the step of surface-treating a glass substrate by using the glass substrate metallization acceleration composition according to any one of claims 1 to 5.
10. 10. A metallized glass substrate includes a glass substrate, and a metal layer disposed on the glass substrate, Wherein a metallization accelerating layer is included between the glass substrate and the metal layer, and The metallization accelerating layer comprises a silane coupling agent and a Pd binder comprising a functional group and a metal ion bound to the silane coupling agent.
11. 11. A metallized glass substrate includes a glass substrate having a through hole, and a metal layer disposed in the through hole of the glass substrate, Wherein a metallization accelerating layer is included between the glass substrate and the metal layer, and The metallization accelerating layer comprises a silane coupling agent and a Pd binder comprising a functional group and a metal ion bound to the silane coupling agent.

Description

Glass substrate metallization acceleration composition, method for producing same, glass substrate metallization acceleration method, and metallized glass substrate Technical Field The present disclosure relates to glass substrate metallization acceleration compositions, methods for preparing the same, glass substrate metallization acceleration methods, and metallized glass substrates. The present application claims the benefits of korean patent application No. 10-2024-0116871 filed on month 2 of 2024 to the korean intellectual property office and korean patent application No. 10-2024-0201693 filed on month 31 of 2024 to the korean intellectual property office, the entire disclosures of which are incorporated herein by reference. Background Since glass substrates are excellent in warpage and Coefficient of Thermal Expansion (CTE), they can realize a large area substrate, and are advantageous in high-speed signal conduction and heat discharge through an increase in the number of I/os. However, glass substrates have problems in that they exhibit low adhesion to metals and cannot allow electroless plating of glass substrates directly. Accordingly, research is required on a technique for improving the adhesion between glass and copper, and in particular, a technique capable of ensuring reliability even at high temperature and high humidity is required. According to the related art, electroless copper plating is performed after forming Cu seeds on the surface of the glass substrate by Cu sputtering. However, there is a disadvantage in that Cu seeds are not formed at the central portion inside the glass through-hole (through glass via, TGV) hole when the thickness of the glass substrate is increased or the diameter of the TGV hole is reduced (i.e., when the aspect ratio is increased). Therefore, when electroless plating is performed by a conventional method, there is a difficulty in increasing the aspect ratio of the glass substrate. Under these circumstances, there is a need to develop a metal surface treatment method capable of performing metal plating on the surface of a glass substrate, particularly even at high temperature and high humidity, while increasing the aspect ratio of the glass substrate. [ Citation ] (Patent document 1) korean patent laid-open publication No. 10-2010-013603 Disclosure of Invention Technical problem The present disclosure is directed to glass substrate metallization acceleration compositions, methods for preparing the same, glass substrate metallization acceleration methods, and metallized glass substrates. Technical proposal An exemplary embodiment of the present disclosure provides a glass substrate metallization acceleration composition comprising a silane coupling agent and a Pd binder, wherein the Pd binder comprises a functional group capable of binding with the silane coupling agent and is a metal ion-containing compound. Another exemplary embodiment of the present disclosure provides a method for preparing a glass substrate metallization accelerating composition. Yet another exemplary embodiment of the present disclosure provides a glass substrate metallization acceleration method comprising the step of surface treating a glass substrate by using the above-described glass substrate metallization acceleration composition. Yet another exemplary embodiment of the present disclosure provides a metallized glass substrate comprising a glass substrate and a metal layer disposed on the glass substrate, wherein a metallization accelerating layer is included between the glass substrate and the metal layer, and the metallization accelerating layer comprises a silane coupling agent and a Pd binder comprising a functional group and a metal ion that are bound to the silane coupling agent. Still another exemplary embodiment of the present disclosure provides a metallized glass substrate including a glass substrate having a through hole and a metal layer disposed in the through hole of the glass substrate, wherein a metallization accelerating layer is included between the glass substrate and the metal layer, and the metallization accelerating layer includes a silane coupling agent and a Pd binder including a functional group and a metal ion bonded to the silane coupling agent. Advantageous effects The glass substrate metallization acceleration composition according to one exemplary embodiment of the present disclosure is characterized in that it comprises at least one silane coupling agent, at least one Pd binder, and at least one phase stabilizer. When using the glass substrate metallization accelerating composition, cu seed formation by Cu sputtering during the conventional electroless copper plating process of the glass substrate may be omitted, and metallization of the glass substrate may be accomplished by a wet process alone. Further, plating can be performed without Cu seeds by a Pd catalyst by using a Pd binder, and thus such plating is not affected by the thickness of the glass su