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CN-122003426-A - Compounds and compositions comprising the same

CN122003426ACN 122003426 ACN122003426 ACN 122003426ACN-122003426-A

Abstract

Provided are a compound represented by formula (I), a polymer X comprising a structural unit I 'represented by formula (I'), and a method of forming a cured film.

Inventors

  • XIAO MANCHAO
  • SASAKI HIROSHI
  • ATUHIKO SATO
  • Hoshi Kosuke
  • TAKAGISHI HIDEYUKI

Assignees

  • 默克专利有限公司

Dates

Publication Date
20260508
Application Date
20241010
Priority Date
20231013

Claims (15)

  1. 1. A compound represented by formula (I): Wherein the method comprises the steps of N1 is 1 or 2; n2 and n3 are each independently 1 or 0; L 1 to L 8 are each independently a single bond or C 1-10 alkylene; When L 1 to L 8 are alkylene, one or more non-adjacent methylene groups (-CH 2 -) of L 1 to L 8 may each independently be replaced by-O-, -S-, -CO-O-, -O-CO-O-, -ch=ch-, or-c≡c-; and is also provided with R 1 to R 12 are each independently-ch=ch 2 or-c≡ch.
  2. 2. A composition comprising: A compound according to claim 1, and A polymer Y comprising a repeating unit a represented by formula (a) or a repeating unit B represented by formula (B): Wherein R a1 to R a3 are each independently a single bond, H, C 1-10 alkyl or C 1-10 alkoxy, Wherein each R b1 is independently H, C 1-30 an unsubstituted or fluoro-substituted saturated aliphatic hydrocarbon group, an unsubstituted or fluoro-substituted aromatic hydrocarbon group, or a (meth) acryloyloxy group; One or more non-adjacent-CH 2 -of the saturated aliphatic and aromatic hydrocarbon groups may each be independently replaced by-O-, -S-, -CO-O-, -O-CO-O-, -ch=ch-, or-c≡c-; One or more H of the saturated aliphatic and aromatic hydrocarbon groups may each independently be replaced by-NH 2 , -n=c=o, -OH, or an epoxy group; nb2 is 2, 3 or 4, and Nb1 is 4-nb2.
  3. 3. The composition of claim 2, further comprising a polymerization initiator.
  4. 4. A composition according to claim 2 or 3, further comprising a solvent.
  5. 5. Composition according to one or more of claims 2 to 4, in which the molar ratio of the compound to the polymer Y is 0.195 or lower.
  6. 6. A polymer X comprising a structural unit I 'represented by formula (I'): Wherein the method comprises the steps of N1 is 1 or 2; n2 and n3 are each independently 1 or 0; L 1 to L 8 are each independently a single bond or C 1-10 alkylene; When L 1 to L 8 are alkylene, one or more non-adjacent methylene groups (-CH 2 -) of L 1 to L 8 may each independently be replaced by-O-, -S-, -CO-O-, -O-CO-O-, -ch=ch-, or-c≡c-; Each of X 1 to X 12 is independently-ch=ch 2 , -c≡ch, a linking group derived from the structure-ch=ch 2 or a linking group derived from the structure-c≡ch; Provided that at least one of X 1 to X 12 is a linking group derived from the structure-ch=ch 2 or a linking group derived from the structure-c≡ch, and that the linking group is bonded to another structural unit.
  7. 7. The polymer X according to claim 6, further comprising a repeating unit a represented by formula (a) or a repeating unit B represented by formula (B): Wherein R a1 to R a3 are each independently a single bond, H, C 1-10 alkyl or C 1-10 alkoxy, Wherein each R b1 independently represents H, C 1-30 saturated aliphatic hydrocarbon group, aromatic hydrocarbon group or (meth) acryloyloxy group; one or more non-adjacent-CH 2 -of the aliphatic and aromatic hydrocarbon groups may each be independently replaced by-O-, -S-, -CO-O-, -O-CO-O-, -ch=ch-, or-c≡c-; One or more H of the aliphatic and aromatic hydrocarbon groups may each independently be replaced by-NH 2 , -n=c=o, -OH, or an epoxy group; nb2 is 2, 3 or 4, and Nb1 is 4-nb2.
  8. 8. The polymer X according to claim 7, wherein the ratio of the number of repeating units I' to the number of repeating units a or B is 0.0095 or less.
  9. 9. A composition comprising: the polymer X according to claim 6 to 8, and And (3) a solvent.
  10. 10. A method of making a cured film comprising the steps of: Coating the composition according to claim 2 to 5 or 9 over a substrate to form a coating film, and The coating film is heated.
  11. 11. The method for producing a cured film according to claim 10, wherein the heating is performed in an oxidizing atmosphere.
  12. 12. A cured film obtained by the method according to claim 10 or 11.
  13. 13. An electronic device comprising the film of claim 12.
  14. 14. A method of manufacturing an electronic device comprising the method of claim 10 or 11.
  15. 15. Use of the composition according to claim 2 to 5 or 9 to form a cured film over a substrate.

Description

Compounds and compositions comprising the same Technical Field The present invention relates to a compound having a specific structure. Furthermore, the present invention relates to a composition comprising a compound having a specific structure and a solvent. Furthermore, the present invention relates to a polymer having a specific structure, a composition comprising the polymer, and a method for preparing a cured film. Background In the manufacturing process of an electronic device (particularly, a semiconductor device), an interlayer insulating film is generally formed between a transistor element and a bit line, between a bit line and a capacitor, between a capacitor and a metal wire, between a plurality of metal wires, or the like. In addition, an insulating material is sometimes embedded in an isolation trench formed in the surface of the substrate. After the semiconductor device is formed on the surface of the substrate, a coating layer is formed using a sealing material, and the semiconductor device is packaged. The interlayer insulating film and the coating layer are generally made of a silicon-containing material. For the preparation of silicon-containing films such as silicon-based films, silicon nitride films, silicon carbide films and silicon carbonitride films, chemical Vapor Deposition (CVD) methods, sol-gel methods and methods of coating a silicon-containing polymer composition and heat curing are generally employed. Among them, a method of coating a composition, heat-curing to form a silicon-containing film (i.e., a cured film) is widely used because of its relatively simple operation and excellent coating properties for narrow grooves. Examples of silicon-containing polymers include polysilazanes, polysiloxanes, polycarbosilanes, polysilanes, and the like. It has been proposed to form a silicon-containing film using a composition containing an organoamino-polysiloxane compound (patent document 1). Prior art literature Patent literature [ Patent document 1] WO2018/148201A Disclosure of Invention Problems to be solved by the invention The present inventors have recognized that there are still one or more problems in the compounds and compositions used to form cured films that require improvement. For example: The film is shrunk when heated and cured, the film thickness of the cured film is thinner, the curing time is longer, peeling is easy to occur due to the shrinkage of the film, the generation of cracks cannot be restrained, the yield of the cured film is required to be improved, the composition cannot be uniformly coated, the insulating property of the cured film is insufficient, the electrical property of the cured film is insufficient, the heat resistance of the cured film is insufficient, the adhesiveness to a wire material, a silicon dioxide film and the like is insufficient, and the acid resistance of the cured film is insufficient. Means for solving the problems The compounds according to the invention are represented by the following formula (I): wherein n1 is 1 or 2; n2 and n3 are each independently 1 or 0; L 1 to L 8 are each independently a single bond or C 1-10 alkylene; When L 1 to L 8 are alkylene, one or more non-adjacent methylene groups (-CH 2 -) of L 1 to L 8 may each independently be replaced by-O-, -S-, -CO-O-, -O-CO-O-, -ch=ch-, or-c≡c-; and is also provided with R 1 to R 12 are each independently-ch=ch 2 or-c≡ch. The composition according to the present invention comprises a compound represented by the above formula (I), and a polymer Y comprising a repeating unit A represented by the formula (A) or a repeating unit B represented by the formula (B): Wherein R a1 to R a3 are each independently a single bond, H, C 1-10 alkyl or C 1-10 alkoxy, Wherein each R b1 is independently H, C 1-30 saturated aliphatic hydrocarbon group, aromatic hydrocarbon group, or (meth) acryloyloxy group, and any of-CH 2 -in the saturated aliphatic hydrocarbon group and aromatic hydrocarbon group may each independently be replaced by-O-, -S-, -CO-O-, -O-CO-, -O-, -CH=CH-, or-C≡C-; One or more H of the saturated aliphatic and aromatic hydrocarbon groups may each independently be replaced by-NH 2, -n=c=o, -OH, or an epoxy group; nb2 is 2, 3 or 4; nb1 is 4-nb2. The polymer X according to the invention comprises a structural unit I 'represented by formula (I'): wherein n1 is 1 or 2; n2 and n3 are each independently 1 or 0; L 1 to L 8 are each independently a single bond or C 1-10 alkylene; When L 1 to L 8 are alkylene, one or more non-adjacent methylene groups (-CH 2 -) of L 1 to L 8 may each independently be replaced by-O-, -S-, -CO-O-, -O-CO-O-, -ch=ch-, or-c≡c-; Each of X 1 to X 12 is independently-ch=ch 2, -c≡ch, a linking group derived from the structure-ch=ch 2 or a linking group derived from the structure-c≡ch; Provided that at least one of X 1 to X 12 is a linking group derived from the structure-ch=ch 2 or a linking group derived from the structure-c≡ch, and that the linking group is bon