CN-122003467-A - Resin composition, prepreg, metal foil laminate, and printed circuit board using same

Abstract

The invention relates to a resin composition, a prepreg, a metal foil laminated plate, a laminated sheet and a printed circuit board using the resin composition, wherein the resin composition comprises (a) an epoxy resin containing modified dicyclopentadiene (DCPD) epoxy resin, (b) an aliphatic benzoxazine resin, and (c) a curing agent.

Inventors

• LI XIANGHUAN
• LI ENHAO
• SUN SHOUZHI

Assignees

• 株式会社斗山

Dates

Publication Date

20260508

Application Date

20241011

Priority Date

20231013

Claims (17)

1. 1. A resin composition comprising: (a) An epoxy resin comprising a modified dicyclopentadiene DCPD epoxy resin; (b) Aliphatic benzoxazine resin, and (C) And (3) a curing agent.
2. 2. The resin composition of claim 1, the modified dicyclopentadiene epoxy resin being an isocyanate modified dicyclopentadiene epoxy resin.
3. 3. The resin composition according to claim 1, wherein the modified dicyclopentadiene epoxy resin is an epoxy resin represented by the following chemical formula 1: [ chemical formula 1] In the above-mentioned chemical formula 1, X 1 is an isocyanate group or an epoxy group, and at least one of one or more X 1 is an isocyanate group, N is an integer from 1 to 100.
4. 4. The resin composition according to claim 1, wherein the modified dicyclopentadiene epoxy resin has a modification rate in the range of 5 to 30%.
5. 5. The resin composition of claim 1, the modified dicyclopentadiene epoxy resin having an epoxy equivalent weight of 200 to 400 g/eq.
6. 6. The resin composition according to claim 1, wherein the epoxy resin further contains one or more non-dicyclopentadiene epoxy resins selected from the group consisting of bisphenol epoxy resin, novolac epoxy resin, biphenyl aralkyl epoxy resin, arylalkylene epoxy resin, naphthalene epoxy resin, anthracene epoxy resin, phenoxy epoxy resin, norbornene epoxy resin, adamantane epoxy resin, and fluorene epoxy resin.
7. 7. The resin composition according to claim 6, wherein the weight ratio of the modified dicyclopentadiene epoxy resin to the non-dicyclopentadiene epoxy resin is 40:60 to 85:15.
8. 8. The resin composition according to claim 6, wherein the epoxy resin further comprises dicyclopentadiene type epoxy resin.
9. 9. The resin composition according to claim 1, wherein the aliphatic benzoxazine-based resin is a compound represented by the following chemical formula 3: [ chemical formula 3] In the above-mentioned chemical formula 3, M is an integer of 1 to 10, R 1 is selected from the group consisting of alkylene of C 1 ~C 40 , alkenylene of C 2 ~C 40 , alkynylene of C 2 ~C 40 , R 2 and R 3 are identical or different from each other and are each independently selected from the group consisting of hydrogen, alkyl of C 1 ~C 40 , alkenyl of C 2 ~C 40 , alkynyl of C 2 ~C 40 and aryl of C 6 ~C 40 , The alkylene, alkenylene, and alkynylene groups of R 1 and the alkyl, alkenyl, alkynyl, and aryl groups of R 2 and R 3 are each independently substituted or unsubstituted with substituents selected from the group consisting of deuterium, halogen, and cyano.
10. 10. The resin composition according to claim 1, wherein the curing agent contains a phenolic curing agent.
11. 11. The resin composition according to claim 1, further comprising one or more selected from the group consisting of an inorganic filler, a flame retardant and a curing accelerator.
12. 12. The resin composition according to claim 1, comprising, based on the total amount of the resin composition: 10 to 30 weight percent of modified dicyclopentadiene epoxy resin; 5 to 25% by weight of an aliphatic benzoxazine-based resin, and 5 To 20% by weight of a curing agent.
13. 13. The resin composition according to claim 1, which has a modulus after curing of 8 GPa or less and a glass transition temperature Tg of 140 ℃ or more.
14. 14. A prepreg, comprising: Fibrous substrate The resin composition according to any one of claims 1 to 13 impregnated in the fibrous base material.
15. 15. A metal foil laminate, comprising: metal foil substrate A resin layer formed on one or both sides of the metal foil substrate and cured from the resin composition according to any one of claims 1 to 13.
16. 16. A laminate sheet, comprising: Polymer film base material A resin layer formed on one or both surfaces of the polymer film base material and cured from the resin composition according to any one of claims 1 to 13.
17. 17. A printed circuit substrate comprising the prepreg of claim 14 or the metal foil laminate of claim 15.

Description

Resin composition, prepreg, metal foil laminate, and printed circuit board using same Technical Field The present invention relates to a resin composition, a prepreg, a metal foil laminate, a laminate, and a printed circuit board using the same, and more particularly, to a resin composition having a low modulus after curing, a high glass transition temperature, and a low occurrence of a surface sticking (tack) phenomenon, a prepreg, a metal foil laminate, a laminate, and a printed circuit board using the same. Background With the development of 5G technology, the technology is also tending to be applied in the automotive field. The reliability level required in the automotive field is higher than usual, and particularly when combined with the vital 5G of data collection and processing, no flash-off can occur during processing. Therefore, the standard of solder (Solder) reliability between the semiconductor Chip (Chip) and the Main Board (Main Board) is increasing. However, due to the nature of the materials, the Coefficient of Thermal Expansion (CTE) is not uniform between the chip, solder, motherboard (MISMATCHING). In addition, improvement of solder cracking (Solder Crack) characteristics caused by a severe external environment, i.e., vibration, is required. Disclosure of Invention Technical problem The present invention aims to provide a resin composition having a low modulus after curing, a high glass transition temperature and a low surface tack (tack) property, and a prepreg, a metal foil laminate, a laminate and a printed circuit board using the same. Means for solving the problems In order to achieve the above object, the present invention provides a resin composition comprising (a) an epoxy resin containing a modified dicyclopentadiene (DCPD) epoxy resin, (b) an aliphatic benzoxazine-based resin, and (c) a curing agent. As an example of the present invention, the modified dicyclopentadiene epoxy resin may be an isocyanate modified dicyclopentadiene epoxy resin. As an example of the present invention, the modified dicyclopentadiene epoxy resin may have a modification rate of 5 to 30%. As an example of the present invention, the modified dicyclopentadiene epoxy resin may have an epoxy equivalent weight of 200 to 400 g/eq. As an example of the present invention, the epoxy resin may further contain one or more non-dicyclopentadiene epoxy resins selected from the group consisting of bisphenol epoxy resins, novolak epoxy resins, biphenyl aralkyl epoxy resins, arylalkylene epoxy resins, naphthalene epoxy resins, anthracene epoxy resins, phenoxy epoxy resins, norbornene epoxy resins, adamantane epoxy resins, and fluorene epoxy resins. As an example of the present invention, the weight ratio of the modified dicyclopentadiene epoxy resin to the non-dicyclopentadiene epoxy resin may be 40:60 to 85:15. As an example of the present invention, the epoxy resin may further contain dicyclopentadiene type epoxy resin. As an example of the present invention, the curing agent may contain a phenol-based curing agent. As an example of the present invention, the resin composition may further contain one or more selected from the group consisting of an inorganic filler, a flame retardant and a curing accelerator. As an example of the present invention, the resin composition may contain 10 to 30% by weight of the modified dicyclopentadiene epoxy resin, 5 to 25% by weight of the aliphatic benzoxazine-based resin, and 5 to 20% by weight of the curing agent, based on the total amount of the resin composition. As an example of the present invention, the resin composition may have a modulus after curing (modulus) of 8 GPa or less and a glass transition temperature (Tg) of 140 ℃ or more. The present invention also provides a prepreg comprising a fibrous base material and the resin composition impregnated in the fibrous base material. The present invention also provides a metal foil laminate comprising a metal foil substrate and a resin layer formed on one or both surfaces of the metal foil substrate and cured from the resin composition. The present invention also provides a laminate sheet comprising a polymer film base material and a resin layer formed on one or both surfaces of the polymer film base material and cured from the resin composition. The present invention also provides a printed circuit board comprising the prepreg or the metal foil laminate. Effects of the invention The resin composition of the present invention has a low modulus after curing and a high glass transition temperature, and therefore can absorb and eliminate solder stress (solder stress) caused by external stimulus such as heat or vibration when applied to a printed circuit board, and thus can improve the reliability of the printed circuit board. In addition, since the resin composition of the present invention has a low occurrence of post-curing tack (tack) phenomenon, it can improve workability in manufacturing a printed circuit board, and resin (res