CN-122003469-A - Thermosetting resin composition, prepreg comprising same, metal foil laminate, laminate sheet, and printed wiring board

Abstract

The present invention relates to a thermosetting resin composition comprising (a) a modified polyphenylene ether having an unsaturated substituent at least one end of a molecular chain, (b) two or more curing agents comprising (b 1) a hydrogenated polybutadiene and (b 2) a (hydrogenated) aromatic vinyl compound-conjugated diene copolymer, and (c) a flame retardant, a prepreg, a metal foil laminate, a laminate sheet, and a printed wiring board comprising the same.

Inventors

• ZHENG DONGXI
• Quan Tingdun
• Jin Wuxian
• Hong Duxiong
• SHEN ZHIHONG
• Pu Chengmo

Assignees

• 株式会社斗山

Dates

Publication Date

20260508

Application Date

20241011

Priority Date

20231013

Claims (10)

1. 1. A thermosetting resin composition comprising: (a) Modified polyphenylene ether having an unsaturated substituent at least one terminal of a molecular chain; (b) More than two curing agents, and (C) The flame retardant is used as a flame retardant, The two or more curing agents include (b 1) hydrogenated polybutadiene and (b 2) a (hydrogenated) aromatic vinyl compound-conjugated diene copolymer.
2. 2. The thermosetting resin composition according to claim 1, wherein the content of the hydrogenated polybutadiene and the (hydrogenated) aromatic vinyl compound-conjugated diene copolymer is in the range of 2 to 15% by weight, respectively, based on the total amount of the resin composition.
3. 3. The thermosetting resin composition of claim 1, wherein the hydrogenated polybutadiene has a hydrogenation rate in the range of 80 to 99%.
4. 4. The thermosetting resin composition according to claim 1, wherein the hydrogenated aromatic vinyl compound-conjugated diene copolymer has a hydrogenation ratio in the range of 60 to 85%.
5. 5. The thermosetting resin composition according to claim 1, wherein the two or more curing agents further comprise a curable curing agent.
6. 6. The thermosetting resin composition according to claim 1, wherein the content of the two or more curing agents is in the range of 5 to 25% by weight based on 100% by weight of the thermosetting resin composition.
7. 7. The thermosetting resin composition according to claim 1, further comprising one or more selected from the group consisting of an initiator and a filler.
8. 8. A prepreg comprising the thermosetting resin composition of any one of claims 1 to 7.
9. 9. A metal foil laminate comprising the thermosetting resin composition of any one of claims 1 to 7.
10. 10. A printed circuit substrate comprising the thermosetting resin composition of any one of claims 1 to 7.

Description

Thermosetting resin composition, prepreg comprising same, metal foil laminate, laminate sheet, and printed wiring board Technical Field The present invention relates to a thermosetting resin composition having low dielectric properties and high heat resistance properties, and a prepreg, a metal foil laminate, a laminate sheet and a printed circuit board comprising the same. Background In recent years, with the advent of the super-connection and intellectualization times such as artificial intelligence, big data, and automatic driving automobiles, development and popularization of various electronic devices such as smartphones have been accelerated, and thus next generation 5G communication capable of transmitting large-capacity data in a wireless format has been developed comprehensively instead of the existing 4G LTE communication. In particular, in order to automatically drive automobiles, smart cities, and intelligent factories, a next-generation 5G communication technology capable of connecting large-capacity data and processing the data in real time without delay has become necessary. The 5G is operated at a high frequency (26 or more GHz), that is, millimeter wave (mmWave) 5G, and can transfer a large amount of data at a time, and the resolution is high to ensure a high-precision image. However, the higher the frequency band used by the communication/electronic device, the more the transmission loss of the electric signal increases, and problems such as heat generation, signal attenuation, and delay may occur. Therefore, in order to reduce the transmission loss, materials having low dielectric constants and low dielectric loss tangents have been developed. For example, when the hydroxyl groups of the polyphenylene ether resin are Modified with unsaturated bond substituents on both sides of the molecular chain, or when Liquid Crystal Polymers (LCP) or Modified Polyimide (MPI) which can be used in a high frequency band are applied to a printed circuit board, there are problems in that processability such as heat resistance and adhesion to copper foil is low, or improvement of dielectric characteristics is difficult. Disclosure of Invention Technical problem The present invention aims to provide a thermosetting resin composition excellent in heat resistance and low dielectric characteristics. In addition, the present invention aims to provide a prepreg, a metal foil laminate, a laminate sheet and a printed circuit board which can be used in a high frequency to ultra-high frequency band using the above thermosetting resin composition. Means for solving the problems In order to achieve the above object, the present invention provides a thermosetting resin composition for high frequency, comprising (a) a modified polyphenylene ether having an unsaturated substituent at least one terminal of a molecular chain, (b) two or more curing agents comprising (b 1) a hydrogenated polybutadiene and (b 2) a (hydrogenated) aromatic vinyl compound-conjugated diene copolymer, and (c) a flame retardant. According to an example, the hydrogenated polybutadiene may have a hydrogenation rate in the range of 80 to 99%. According to another example, in the above (hydrogenated) aromatic vinyl compound-conjugated diene copolymer, the hydrogenated aromatic vinyl compound-conjugated diene copolymer may have a hydrogenation rate in the range of 60 to 85%. According to still another example, the two or more kinds of curing agents may further contain a curable curing agent. According to still another example, the content of the two or more curing agents may be in the range of 5 to 25% by weight based on 100% by weight of the thermosetting resin composition. According to still another example, the thermosetting resin composition may further include one or more selected from the group consisting of an inorganic filler, an initiator, and a curing accelerator. In addition, the present invention provides a prepreg comprising the above thermosetting resin composition. The present invention also provides a metal foil laminate comprising the thermosetting resin composition. The present invention also provides a laminate sheet comprising a polymer film and a resin layer which is disposed on at least one surface of the polymer film and is composed of the thermosetting resin composition. Further, the present invention provides a printed circuit board comprising the thermosetting resin composition. Effects of the invention The thermosetting resin composition of the present invention has a high glass transition temperature (Tg), a low dielectric constant and a low dielectric loss tangent, and excellent resin flowability, and therefore, is excellent in processability when applied to a printed circuit board, and can improve low dielectric loss and heat resistance of the printed circuit board. Therefore, the thermosetting resin composition of the present invention can be effectively used for parts of printed circuit boards used for various electric an