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CN-122003480-A - Thermally conductive silicone adhesive composition

CN122003480ACN 122003480 ACN122003480 ACN 122003480ACN-122003480-A

Abstract

The present invention relates to a thermally conductive silicone adhesive composition comprising a mixture of (A) an alkenyl-containing organopolysiloxane, (B) an alkyl-terminated organopolysiloxane, (C) a silane coupling agent, (D) a catalyst, and (E) (E-1) alumina having a D 50 particle size of 4 to 8 [ mu ] m, (E-2) silicon carbide having a D 50 particle size of 1 to 4 [ mu ] m, and (E-3) alumina and/or zinc oxide having a D 50 particle size of less than 1 [ mu ] m. The thermally conductive silicone adhesive composition exhibits low thermal resistance, low viscosity suitable for printing processes, high breakdown voltage, and good pump out resistance.

Inventors

  • ZHU XINGYU
  • XIE DAN
  • CHEN XIAODAN
  • CHEN YAN

Assignees

  • 汉高股份有限及两合公司

Dates

Publication Date
20260508
Application Date
20231013

Claims (14)

  1. 1. A thermally conductive silicone adhesive composition, the thermally conductive silicone adhesive composition comprises: (A) Alkenyl-containing organopolysiloxanes; (B) Alkyl-terminated organopolysiloxanes; (C) A silane coupling agent; (D) Catalyst, and (E) (e-1) alumina having a D 50 particle size of 4 to 8 μm, (e-2) silicon carbide having a D 50 particle size of 1 to 4 μm, and (e-3) alumina and/or zinc oxide having a D 50 particle size of less than 1 μm.
  2. 2. The thermally conductive silicone adhesive composition according to claim 1, wherein the D 50 particle size of component (e-1) is 4.5 to 7 μm, preferably 5 to 6 μm, and more preferably 5 μm.
  3. 3. The thermally conductive silicone adhesive composition according to claim 1 or 2, wherein the D 50 particle size of component (e-2) is 1.5 to 3.5 μm, preferably 2 to 3 μm, and more preferably 2.5 μm.
  4. 4. A thermally conductive silicone adhesive composition as set forth in any one of claims 1 to 3 wherein component (e-3) has a D 50 particle size of less than 0.8 μm, preferably less than 0.6 μm, more preferably less than 0.4 μm, and even more preferably 0.3 μm.
  5. 5. The thermally conductive silicone adhesive composition according to any one of claims 1 to 4, which does not contain a filler other than component (E).
  6. 6. The thermally conductive silicone adhesive composition of any one of claims 1 to 5, wherein each component (e-1) is present in an amount of from 10 to 80 wt%, more preferably from 20 to 63 wt%, and even more preferably from 30 to 55 wt%, based on the total weight of the composition.
  7. 7. The thermally conductive silicone adhesive composition of any one of claims 1 to 6, wherein each component (e-2) is present in an amount of from 5 to 70 wt%, more preferably from 15 to 50wt%, and even more preferably from 20 to 45wt%, based on the total weight of the composition.
  8. 8. The thermally conductive silicone adhesive composition of any one of claims 1 to 7, wherein each component (e-3) is present in an amount of from 1 to 40 wt%, more preferably from 10 to 30 wt%, and even more preferably from 15 to 25 wt%, based on the total weight of the composition.
  9. 9. The thermally conductive silicone adhesive composition of any one of claims 1 to 8 wherein component (a) is a vinyl-terminated polydimethylsiloxane having a viscosity of less than 200mpa.s at 25 ℃.
  10. 10. The thermally conductive silicone adhesive composition of any one of claims 1 to 9 wherein component (B) is a methyl-terminated polydimethylsiloxane having a viscosity of less than 200mpa.s at 25 ℃.
  11. 11. The thermally conductive silicone adhesive composition according to any one of claims 1 to 10, wherein component (C) is trimethoxysilane.
  12. 12. The thermally conductive silicone adhesive composition of any one of claims 1 to 11, wherein component (D) is a platinum-based catalyst.
  13. 13. The cured product of the thermally conductive silicone adhesive composition according to any one of claims 1 to 12.
  14. 14. Use of the thermally conductive silicone adhesive composition according to any one of claims 1 to 12 or the cured product according to claim 13 for manufacturing electronic devices, in particular Insulated Gate Bipolar Transistor (IGBT) power modules, and in telecommunication and data communication devices such as 5G base stations.

Description

Thermally conductive silicone adhesive composition Technical Field The present invention relates to thermally conductive silicone adhesive compositions, and in particular to thermally conductive silicone adhesive compositions that exhibit low thermal impedance (THERMAL IMPEDANCE), low viscosity suitable for printing processes, high breakdown voltage, and good pump out resistance. Background In recent years, as electronic devices have been reduced in size and improved in performance, heat conductive silicone grease has been increasingly required in terms of heat conductivity, viscosity, electrical insulation, and pump-out resistance. In particular, all the silicone greases currently on the market do not meet the requirements of a thermal resistance of less than 0.06 K.cm 2/W, a viscosity of 100 to 300Pa.s at 25 ℃, a breakdown voltage of more than 3kV/mm, and good pump out resistance at 200 cycles at-40 to 125 ℃. In view of the above, it is desirable to provide a thermally conductive silicone composition that exhibits low thermal resistance, low viscosity suitable for printing processes, high breakdown voltage, and good pump out resistance. Disclosure of Invention The present invention provides a thermally conductive silicone adhesive composition comprising: (A) Alkenyl-containing organopolysiloxanes; (B) Alkyl-terminated organopolysiloxanes; (C) A silane coupling agent; (D) Catalyst, and (E) (e-1) alumina having a D 50 particle size of 4 to 8 μm, (e-2) silicon carbide having a D 50 particle size of 1 to 4 μm, and (e-3) alumina and/or zinc oxide having a D 50 particle size of less than 1 μm. The present invention also provides a cured product of the thermally conductive silicone adhesive composition according to the present invention. The invention further provides the use of the thermally conductive silicone adhesive composition according to the invention or the cured product according to the invention for the manufacture of electronic devices. The thermally conductive silicone adhesive composition according to the invention, the cured product and the use are all based on the surprising finding by the inventors that the thermally conductive silicone adhesive composition according to the invention, which utilizes specific combinations of components (a) to (E), in particular specific combinations of components (E-1), (E-2) and (E-3), exhibits a low thermal resistance, a low viscosity suitable for printing processes, a high breakdown voltage and good pump-out resistance, and in particular, it exhibits at the same time a thermal resistance of less than 0.06 k.cm 2/W, a viscosity at 25 ℃ of 100 to 300pa.s, a breakdown voltage of more than 3kV/mm, and good pump-out resistance for 200 cycles at-40 to 125 ℃. Detailed Description It is to be understood by one of ordinary skill in the art that the present discussion is a description of exemplary embodiments only, and is not intended as limiting the broader aspects of the present invention. Each aspect so described may be combined with any one or more other aspects, unless clearly indicated to the contrary. In particular, any feature indicated as being preferred or advantageous may be combined with any one or more other features indicated as being preferred or advantageous. The terms "a," "an," "the," and "the" as used herein include both singular and plural referents unless the context clearly dictates otherwise. The term "comprising" as used herein is synonymous with "including", "containing" or "containing" and is inclusive or open-ended and does not exclude additional, unrecited members, elements or method steps. Unless otherwise indicated, recitation of numerical endpoints includes all numbers subsumed within that range, fractions, and endpoints recited. All terms "room temperature" as used herein refer to 23±2 ℃ unless otherwise indicated. All molecular weights as used herein refer to weight average molecular weights (Mw) as obtained by Gel Permeation Chromatography (GPC) according to DIN 55672, unless otherwise indicated. As used herein, unless otherwise indicated, all "D 50 particle sizes" refer to the median diameter in a volume-based particle size distribution curve obtained by measurement with a laser diffraction particle size analyzer. All parameters used herein, unless otherwise indicated, are measured according to the methods set forth in the working examples of this specification, if any. Unless otherwise defined, all terms (including technical and scientific terms) used in disclosing the present invention have the meanings commonly understood by one of ordinary skill in the art to which the present invention belongs. In accordance with the present invention, surprisingly, the inventors of the present invention have found a thermally conductive silicone adhesive composition comprising: (A) Alkenyl-containing organopolysiloxanes; (B) Alkyl-terminated organopolysiloxanes; (C) A silane coupling agent; (D) Catalyst, and (E) (e-1) a mixture of alumina having