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CN-122003645-A - Microlithographic projection exposure system

CN122003645ACN 122003645 ACN122003645 ACN 122003645ACN-122003645-A

Abstract

The invention relates to a microlithographic projection exposure system comprising an illumination system (10) and a projection objective (22). The illumination system (10) has a first set of optical elements (18, 19) designed to direct electromagnetic radiation emitted by the radiation source (14) onto the photomask (13) in order to illuminate the photomask (13) with electromagnetic radiation. The projection objective (22) may have a second set of optical elements (M1-M6) in order to form an imaging beam path through which the photomask (13) is imaged onto the lithographic object. The actuator (33,39,67) can be designed to adjust an operating parameter of an optical element (18, 19) of the illumination system (10) or of an optical element (M1-M6) of the projection objective (22). The actuator (33, 39, 67) is electrically actuated via an input interface (42), wherein the electrical actuation runs between the input interface (42) and the actuator (33, 39, 67) via a printed circuit board (70). The printed circuit board (70) is disposed inside the housing (34), and the housing (34) is equipped with cooling channels (46). The printed circuit board (70) is releasably connected to the housing (34) such that the printed circuit board (70) can be separated from the housing (34) without opening the cooling channel (46).

Inventors

  • A. WALTER
  • T. Wolfsteiner

Assignees

  • 卡尔蔡司SMT有限责任公司

Dates

Publication Date
20260508
Application Date
20241008
Priority Date
20231013

Claims (15)

  1. 1. A microlithographic projection exposure apparatus having an illumination system (10) and a projection lens (22), wherein the illumination system (10) comprises a first set of optical elements (18, 19) designed to direct electromagnetic radiation emitted by a radiation source (14) onto a photomask (13) for illuminating the photomask (13) with the electromagnetic radiation, wherein the projection lens (22) comprises a second set of optical elements (M1-M6) for shaping an imaging beam path for imaging the photomask (13) onto a lithographic object, having an actuator (33, 39, 67) for adjusting an operating parameter of the optical elements (18, 19) of the illumination system (10) or of the optical elements (M1-M6) of the projection lens (22), and having an input interface (42) for electrically controlling the actuator (33, 39, 67), wherein an electrical control path between the input interface (42) and the actuator (33, 39, 67) extends via a printed circuit board (70), wherein the printed circuit board (70) is arranged in an interior of a housing (34) of the housing (34) is provided with a detachable cooling circuit (34), so that the printed circuit board (70) can be separated from the housing (34) without opening the cooling channel (46).
  2. 2. Microlithographic projection exposure apparatus according to claim 1, comprising a vacuum chamber (23), wherein the optical elements (18, 19) of the illumination system (10) and/or the optical elements (M1-M6) of the projection lens (22) are arranged within the vacuum chamber (23), wherein the housing (34) is arranged within the vacuum chamber (23), and wherein the pressure in the housing (34) is higher than the pressure in the vacuum chamber (23).
  3. 3. Microlithographic projection exposure apparatus according to claim 1 or 2, wherein the cooling channel (46) extends in a structure (50) of the housing (34).
  4. 4. A microlithographic projection exposure apparatus according to any of claims 1 to 3, comprising a printed circuit board module (40), which printed circuit board module (40) can be separated from the housing (34) without the cooling channel (46) being opened, wherein the printed circuit board module (40) comprises the printed circuit board (70) and a cooling plate (72) thermally coupled to the printed circuit board (40).
  5. 5. Microlithographic projection exposure apparatus according to claim 4, wherein the printed circuit board (40) is coated with a thermally conductive material in an area of the printed circuit board (40) resting on the cooling plate (72).
  6. 6. Microlithographic projection exposure apparatus according to claim 4 or 5, wherein a bearing surface (57) is formed in the structure (50) of the housing (34), on which bearing surface a cooling plate (72) of the printed circuit board module (40) rests.
  7. 7. Microlithographic projection exposure apparatus according to any one of claims 4 to 6, wherein the housing (34) comprises a mating surface (58) opposite the bearing surface (57), and wherein an expansion mechanism (52) is supported on the mating surface (58) for pressing the cooling plate (72) of the printed circuit board module (40) against the bearing surface (57).
  8. 8. Microlithographic projection exposure apparatus according to claim 7, wherein the expansion mechanism (52) is designed to extend transversely to its actuation direction (56).
  9. 9. Microlithographic projection exposure apparatus according to claim 7 or 8, wherein the expansion mechanism (52) forms a thermal path between the cooling plate (72) of the printed circuit board module (40) and the structure (50) of the housing (34), such that heat from the printed circuit board module (40) enters the structure (50) of the housing (34) through the expansion mechanism (52).
  10. 10. Microlithographic projection exposure apparatus according to any one of claims 1 to 9, wherein the housing (34) hermetically separates an interior of the housing (34) from a vacuum condition in the vacuum chamber (23).
  11. 11. Microlithographic projection exposure apparatus according to any one of claims 1 to 10, wherein the housing (34) comprises a first housing part (28) and a second housing part (29) which can be separated from one another at a separation point (47), wherein the cooling channel (46) extends over the separation point (47).
  12. 12. Microlithographic projection exposure apparatus according to any one of claims 1 to 11, wherein the optical element is an EUV mirror (M1-M6) of an EUV projection lens (22).
  13. 13. The microlithographic projection exposure apparatus according to any of claims 1 to 12, wherein the optical element is a MEMS mirror module.
  14. 14. Microlithographic projection exposure apparatus according to any one of claims 1 to 11, wherein the optical element is an EUV mirror (M1-M6) of the projection lens (22).
  15. 15. Microlithographic projection exposure apparatus according to any one of claims 1 to 11, wherein the optical element is a DUV mirror or a lens element of a DUV projection lens (22).

Description

Microlithographic projection exposure system The present patent application claims priority from german patent application DE 10 2023 210 078.9 filed on 10/13 of 2023, which is incorporated by reference in its entirety ("incorporated by reference"). Technical Field The present invention relates to a microlithographic projection exposure apparatus. Background Microlithographic projection exposure apparatus comprising an illumination system and a projection lens are used for manufacturing microstructured components. The illumination system is used to direct very short wave deep ultraviolet radiation (DUV radiation) or extreme ultraviolet radiation (EUV radiation) to the photomask. Projection lenses are used to image a photomask onto a lithographic object (e.g., a silicon wafer) to transfer the mask structure onto a photosensitive coating of the lithographic object. The projection exposure apparatus comprises several optical elements for shaping the beam path of the illumination system and the beam path of the projection lens. In the case of DUV radiation, the optical element may be a lens element or a DUV mirror. In the case of EUV radiation, these may be optical elements comprising an optical surface that reflects EUV radiation. The optical element has a precisely defined shape and is precisely positioned so that the imaging of the photomask onto the lithographic object is of sufficient quality. In order to be able to set the optical element in a manner corresponding to the requirements of the projection exposure apparatus, an actuator is provided which can be used to influence one or more operating parameters of the optical element. For example, actuators may be used to affect the position, alignment, and/or temperature of the optical element. An electrical control signal is used to control the actuator. The actuator may be controlled by a printed circuit board module. For efficient heat dissipation, the printed circuit board module may be equipped with liquid cooling, wherein the cooling liquid is conducted through the components of the printed circuit board module to dissipate heat of the electronic components of the printed circuit board module. However, liquid cooled printed circuit board modules often add some expense in the case of maintenance or repair. Disclosure of Invention The problem addressed by the present invention is to propose a microlithographic projection exposure apparatus with which these disadvantages can be reduced. This problem is solved by the features of the independent claims. Advantageous embodiments are specified in the dependent claims. A microlithographic projection exposure apparatus according to the invention comprises an illumination system and a projection lens, wherein the illumination system comprises a first set of optical elements designed to direct electromagnetic radiation emitted by a radiation source onto a photomask for illuminating the photomask with electromagnetic radiation, and wherein the projection lens comprises a second set of optical elements for shaping an imaging beam path for imaging the photomask onto a lithographic object. The microlithographic projection exposure apparatus comprises an actuator for adjusting an operating parameter of an optical element and an electronically controlled input interface for the actuator. The electrical control path between the input interface and the actuator extends via the printed circuit board. The housing is provided with cooling channels. The printed circuit board is detachably connected to the housing such that the printed circuit board can be separated from the housing without opening the cooling passage. The invention proposes a functional separation of a printed circuit board and a liquid-cooled housing. It has been found that it is the opening of the cooling circuit around the microlithographic projection exposure apparatus that is a common source of faults during maintenance operations and repair work. According to the present invention, since the printed circuit board can be replaced without opening the cooling passage, maintenance and repair work is significantly simplified. In an embodiment, the microlithographic projection exposure apparatus comprises a vacuum chamber, wherein the optical elements of the illumination system and/or the optical elements of the projection lens are arranged in the vacuum chamber. The housing in which the printed circuit board is disposed may be disposed in a vacuum chamber. The pressure in the housing may be higher than the pressure in the vacuum chamber. Heretofore, control in such designs has typically been achieved by a printed circuit board module disposed outside the vacuum enclosure. With this design, it is almost inevitable that the printed circuit board module is arranged at a distance from the controlled actuator. As the complexity of the system increases and the number of actuators to be controlled increases, transmission losses due to distance become increasingly