CN-122003707-A - Display module and display device

CN122003707ACN 122003707 ACN122003707 ACN 122003707ACN-122003707-A

Abstract

The display module and the display device comprise a flexible display panel, a chip, a main flexible circuit board, a component, a chip and a binding area, wherein the main flexible circuit board and/or the binding area of the main flexible circuit board can be bent to enable the main flexible circuit board to be located on one side, close to the display area, of the binding area or one side, far away from the display area, of the binding area, the front projection of the component in the display area is not overlapped with the front projection of the binding area in the display area, and/or the front projection of the chip in the display area is not overlapped with the front projection of the main flexible circuit board in the display area, and in a second direction, the component is at least partially overlapped with the binding area, and/or the chip is at least partially overlapped with the main flexible circuit board.

Inventors

YANG HAOTIAN
LIU XIAOXIA
ZHANG HAN
BI DANYANG
WEI XIANGDONG

Assignees

京东方科技集团股份有限公司
成都京东方光电科技有限公司

Dates

Publication Date: 20260508
Application Date: 20240830

Claims (15)

A display module, comprising: The flexible display panel comprises a display area, a bending area and a binding area which are sequentially connected in a first direction, wherein the display area is provided with a first surface and a second surface which are oppositely arranged, and the bending area can be bent to enable the binding area to be positioned on one side of the second surface of the display area; the chip is arranged in the binding area; A main flexible circuit board, the main flexible circuit board including a first binding end electrically connected with the binding region, the main flexible circuit board and/or the binding region being bendable to enable the main flexible circuit board to be located at one side of the binding region near the display region or at one side of the binding region far from the display region, and The component is arranged on the main flexible circuit board; the front projection of the component in the display area is not overlapped with the front projection of the binding area in the display area, and/or the front projection of the chip in the display area is not overlapped with the front projection of the main flexible circuit board in the display area; in the second direction, the components and parts and the binding area are at least partially overlapped, and/or the chip and the main flexible circuit board are at least partially overlapped, wherein the first direction is the direction in which the display area, the bending area and the binding area are sequentially connected, the second direction is the direction perpendicular to the display area, and the third direction is the direction perpendicular to the first direction and the second direction.
The display module of claim 1, wherein the component is located at a side of the main flexible circuit board near the binding region, at least one side of the binding region is retracted a first retraction distance relative to the main flexible circuit board in the third direction, and the component is disposed at a protruding region of the main flexible circuit board relative to the binding region.
The display module of claim 2, wherein the component is at least 1.0mm from the edge of the main flexible circuit board and the component is at least 2.0mm from the bonding region in the first and third directions.
The display module of claim 1, wherein the component is located at a side of the main flexible circuit board near the binding area, and a first component avoiding hole is formed in a region of the binding area corresponding to the component.
The display module of claim 4, wherein the component is spaced from the first component relief aperture edge by at least 0.5mm in the first direction and the third direction.
The display module of claim 1, wherein the chip is located at a side of the binding area near the main flexible circuit board, and a first chip avoiding hole is formed in a region of the main flexible circuit board corresponding to the chip.
The display module of claim 6, wherein the chip is spaced from the edge of the first chip relief hole by at least 1.0mm in the first direction and the third direction.
The display module of claim 1, wherein an adhesive layer is provided on a side of the main flexible circuit board adjacent to the display area to bond the main flexible circuit board to the display area, and/or the adhesive layer is provided on a side of the main flexible circuit board adjacent to the bonding area to bond the main flexible circuit board to the bonding area.
The display module of claim 8, wherein the adhesive layer is retracted at least 0.2mm relative to an edge of the main flexible circuit board, the adhesive layer is retracted at least 0.2mm relative to an edge of the bonding region, and the adhesive layer is retracted at least 0.2mm relative to an edge of the display region in the first direction and the third direction.
The display module of any one of claims 1 to 9, wherein the main flexible circuit board is located at a side of the bonding region remote from the display region, the display module further comprising: And the bending gasket is arranged on one side of the display area, which is close to the binding area, and in the second direction, the bending gasket is respectively connected with the display area and the binding area.
The display module of claim 10, wherein the area of the bending gasket corresponding to the component is provided with a second component avoiding hole, and/or the area of the bending gasket corresponding to the chip is provided with a second chip avoiding hole.
The display module of claim 11, wherein the distance between the edge of the second device relief hole and the device in the first direction and the third direction is at least 1.0mm, the orthographic projection of the bending pad on the main flexible circuit board is retracted by at least 0.2mm relative to the edge of the main flexible circuit board, and/or the distance between the edge of the second chip relief hole and the chip in the first direction and the third direction is at least 1.0mm, and the orthographic projection of the bending pad on the binding area is retracted by at least 0.2mm relative to the edge of the binding area.
The display module of claim 11, wherein in the second direction, the bending gasket interfaces with the main flexible circuit board.
The display module assembly of claim 10, further comprising: And an under-screen material layer disposed on the second surface of the display area.
A display device comprising the display module of any one of claims 1 to 14.

Description

Display module and display device Technical Field The disclosure belongs to the technical field of display equipment, and particularly relates to a display module and a display device. Background With the development of technology, the production capacity and yield of flexible Organic Light-Emitting Diode (OLED) display modules have gradually risen to higher levels, and products based on flexible OLED display modules also tend to be diversified, multifunctional and multipurpose, and have gradually been incorporated into daily life, industrial production and high-tech intelligent manufacturing. The flexible OLED display products such as intelligent wearing and mobile phones are lighter and thinner, the manuscript screen ratio, the impact resistance and the aesthetic property are more concerned by consumers, and meanwhile, the multi-form, the diversity and the multifunctionality of the flexible OLED display products also become further points of the consumers. In the related art, in a flexible OLED display product, components and parts are located on one side of a main flexible circuit board (Main Flexible Printed Circuit, MFPC) away from a display area, meanwhile, a chip (IC) is located on one side of a binding area away from the display area, the components and the chip have a certain height, larger space can be occupied, meanwhile, the whole machine of the flexible OLED display product needs to avoid the components and the chip positions, so that the whole thickness of the flexible OLED display product is larger, and the light and thin requirements of the flexible OLED display product are not met. It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art. Disclosure of Invention The technical problem that the overall thickness of the flexible OLED display product is large and the light and thin requirements of the flexible OLED display product are not met is solved by utilizing one or more embodiments of the present disclosure. The display module comprises a flexible display panel, a bending area and a binding area, wherein the flexible display panel comprises a display area, a bending area and a binding area which are sequentially connected in a first direction, the display area is provided with a first surface and a second surface which are oppositely arranged, and the bending area can be bent to enable the binding area to be positioned on one side of the second surface of the display area; the device comprises a binding area, a chip arranged on the binding area, a main flexible circuit board, a component and a first display area, wherein the main flexible circuit board comprises a first binding end, the first binding end is electrically connected with the binding area, the main flexible circuit board and/or the binding area can be bent to enable the main flexible circuit board to be positioned on one side of the binding area close to the display area or one side of the binding area far away from the display area, the component is arranged on the main flexible circuit board, the front projection of the component in the display area is not overlapped with the front projection of the binding area in the display area, and/or the front projection of the chip in the display area is not overlapped with the front projection of the main flexible circuit board in the display area, the component is at least partially overlapped with the binding area in the second direction, and/or the chip is at least partially overlapped with the main flexible circuit board, the first direction is the display area, the bending area and the binding area are sequentially connected with the second direction, and the first direction is the second direction, and the second direction is the third direction is the perpendicular to the first direction. In some embodiments, the component is located at one side of the main flexible circuit board close to the binding area, at least one side of the binding area is retracted by a first retraction distance relative to the main flexible circuit board in the third direction, and the component is arranged at a protruding area of the main flexible circuit board relative to the binding area. In some embodiments, the component is at least 1.0mm from the edge of the primary flex circuit and the component is at least 2.0mm from the binding area in the first direction and the third direction. In some embodiments, the component is located at one side of the main flexible circuit board close to the binding area, and a first component avoiding hole is formed in a region of the binding area corresponding to the component. In some embodiments, the component is at least 0.5mm from the first component relief hole edge in the first direction and the third direction. In some embodiments, the chip is