CN-122003955-A - Method for manufacturing wired circuit board
Abstract
A method for producing a wired circuit board includes a first step of recovering a waste liquid of a wired circuit forming treatment liquid used in a wired circuit forming step, the waste liquid being subjected to at least one of electrochemical treatment and dialysis treatment, to obtain a recovered treatment liquid containing a treatment liquid component, a second step of preparing a reusable wired circuit forming treatment liquid using the recovered treatment liquid, and a third step of forming a wired circuit using the reusable wired circuit forming treatment liquid.
Inventors
- Xing Neiguiye
- NIINOU TEPPEI
- SHIBATA SHUSAKU
Assignees
- 日东电工株式会社
Dates
- Publication Date
- 20260508
- Application Date
- 20240426
- Priority Date
- 20231011
Claims (8)
- 1. A method for manufacturing a wired circuit board, comprising: A first step of subjecting a waste liquid of the wiring circuit forming treatment liquid used in the wiring circuit forming step to at least one of an electrochemical treatment and a dialysis treatment to obtain a recovered treatment liquid containing a treatment liquid component; a second step of preparing a treatment liquid for forming a reused wiring circuit by using the recovered treatment liquid, and And a third step of forming a wiring circuit by using the treatment liquid for forming a reused wiring circuit.
- 2. The method for manufacturing a wired circuit board according to claim 1, wherein the recovery treatment is an electrodialysis treatment.
- 3. The method for manufacturing a wired circuit board according to claim 1, wherein the waste liquid, the recovery treatment liquid, and the treatment liquid for forming a reused wired circuit contain an acid.
- 4. The method for manufacturing a wired circuit board according to claim 1, wherein the treatment liquid for forming a wired circuit includes at least any one of an acidic cleaning liquid for cleaning a surface in the process of forming a wired circuit and an acidic etching liquid for etching in the process of forming a wired circuit.
- 5. The method for producing a wired circuit board according to claim 1, wherein the waste liquid, the recovery treatment liquid, and the treatment liquid for forming a reuse wired circuit contain alcohol and water.
- 6. The method for manufacturing a wired circuit board according to claim 1, wherein the method for manufacturing comprises: A fourth step of subjecting the waste liquid of the treatment liquid for forming a reuse wiring circuit used in the third step to at least one of an electrochemical treatment and a dialysis treatment to obtain a second recovered treatment liquid containing a treatment liquid component; a fifth step of preparing a second treatment liquid for forming a reuse wiring circuit by using the second recovery treatment liquid, and And a sixth step of forming a wiring circuit using the second reusable wiring circuit forming treatment liquid.
- 7. The method for manufacturing a wired circuit board according to claim 1, wherein the second step comprises: Measuring the effective components in the recovered treatment liquid, and And a step of preparing the treatment liquid for forming a reuse wiring circuit by adjusting the composition of the recovery treatment liquid to a predetermined composition using the measurement result of the active ingredient.
- 8. The method for manufacturing a wired circuit board according to claim 1, wherein the first step, the second step, and the third step are performed in one place of work.
Description
Method for manufacturing wired circuit board Technical Field The present invention relates to a method for manufacturing a wired circuit board. Background The wired circuit board is manufactured by laminating conductor portions such as wires and various insulating layers on a base material. The conductor portions and/or the insulating layer are patterned, for example, by photolithography. In the production of wired circuit boards, various processing liquids are used for cleaning metal substrates, rinsing after development when forming resist patterns, removal of seed layers, and the like. The treatment liquid used cannot be reused directly, and is thus treated as a waste liquid. As a method for treating the waste liquid, there are, for example, a method for collecting the waste liquid by a manufacturer. On the other hand, as a method for removing copper from a solution or a liquid (particularly, an etching solution containing used copper produced by printed circuit board manufacturing), there is proposed a method for removing copper from a mixture containing a copper complexing agent, the method comprising providing a system comprising an electrolytic cell comprising an anode and a cathode isolated by a copper ion permeable membrane, adding a liquid containing copper and a copper complexing agent to the system, and subjecting the liquid to electrolytic treatment (for example, refer to patent document 1). Prior art literature Patent literature Patent document 1 Japanese patent laid-open No. 2000-317458 Disclosure of Invention Technical problem to be solved by the invention The invention provides a method for manufacturing a wired circuit board, which can reduce environmental load by recycling a processing liquid for forming a wired circuit after being used in a process for forming the wired circuit. Technical scheme for solving technical problems The present inventors have conducted intensive studies to solve the above-described problems, and as a result, have found that the above-described problems can be solved, and have completed the present invention having the following gist. That is, the present invention includes the following. [1] A method of manufacturing a wired circuit board, comprising: A first step of subjecting a waste liquid of the wiring circuit forming treatment liquid used in the wiring circuit forming step to at least one of an electrochemical treatment and a dialysis treatment to obtain a recovered treatment liquid containing a treatment liquid component; a second step of preparing a treatment liquid for forming a reused wiring circuit by using the recovered treatment liquid, and And a third step of forming a wiring circuit by using the treatment liquid for forming a reused wiring circuit. [2] The method for producing a wired circuit board according to [1], wherein the recovery treatment is an electrodialysis treatment. [3] The method for producing a wired circuit board according to [1] or [2], wherein the waste liquid, the recovery treatment liquid, and the treatment liquid for forming a reused wired circuit contain an acid. [4] The method for producing a wired circuit board according to any one of [1] to [3], wherein the treatment liquid for forming a wired circuit contains at least any one of an acidic cleaning liquid for cleaning a surface in a forming process of the wired circuit and an acidic etching liquid for etching in the forming process of the wired circuit. [5] The method for producing a wired circuit board according to any one of [1] to [4], wherein the waste liquid, the recovery treatment liquid, and the treatment liquid for forming a reused wired circuit contain alcohol and water. [6] The method for manufacturing a wired circuit board according to any one of [1] to [5], comprising: A fourth step of subjecting the waste liquid of the treatment liquid for forming a reuse wiring circuit used in the third step to at least one of an electrochemical treatment and a dialysis treatment to obtain a second recovered treatment liquid containing a treatment liquid component; a fifth step of preparing a second treatment liquid for forming a reuse wiring circuit by using the second recovery treatment liquid, and And a sixth step of forming a wiring circuit using the second reusable wiring circuit forming treatment liquid. [7] The method for manufacturing a wired circuit board according to any one of [1] to [6], wherein the second process includes: Measuring the effective components in the recovered treatment liquid, and And a step of preparing the treatment liquid for forming a reuse wiring circuit by adjusting the composition of the recovery treatment liquid to a predetermined composition using the measurement result of the active ingredient. [8] The method for manufacturing a wired circuit board according to any one of [1] to [7], wherein the first step, the second step, and the third step are performed in one work place. Effects of the invention According to the present invention, it