CN-122003956-A - Glass substrate metallization method, method for manufacturing glass substrate comprising same, and metallized glass substrate

Abstract

The present disclosure is directed to a glass substrate metallization method that includes a glass substrate metallization acceleration process using a specific composition, and thus can uniformly form a metal layer on a glass substrate having a high aspect ratio only by a wet process.

Inventors

• CUI YANAN
• Quan Wuzhuo
• LIU XIANGXU
• ZHENG DAZHE
• Yu Shangmen

Assignees

• 株式会社LG化学

Dates

Publication Date

20260508

Application Date

20250124

Priority Date

20240902

Claims (17)

1. 1. A glass substrate metallization method includes a glass substrate metallization acceleration process, a glass substrate plating process, and an annealing process, Wherein the glass substrate metallization acceleration process comprises the step of surface treating the glass substrate by using a glass substrate metallization acceleration composition, The glass substrate metallization accelerating composition comprises a silane coupling agent and a Pd binder, and The Pd binder is a metal ion-containing compound containing a functional group capable of binding with the silane coupling agent.
2. 2. The glass substrate metallization method of claim 1, wherein the Pd binder is represented by the following chemical formula 1: [ chemical formula 1] , In the chemical formula 1, the chemical formula is shown in the drawing, L 1 to L 3 are identical or different and are each independently C1 to C5 alkylene, X 1 is-NH 2 , -OH, -C (=O) OH or-P (=O) (OH) 2 , X 2 and X 3 are identical or different and are each independently -NH 2 、-OH、-C(=O)OH、-C(=O)O - M + 、-P(=O)(OH) 2 、-P(=O)(OH)(O - M + ) or-P (=o) (O - M + ) 2 , M is Li or Na, and At least one of X 2 and X 3 is-C (=o) O - M + 、-P(=O)(OH)(O - M + ) or-P (=o) (O - M + ) 2 ).
3. 3. The glass substrate metallization method of claim 1, further comprising a glass substrate pretreatment process.
4. 4. The glass substrate metallization method of claim 1, wherein the glass substrate metallization acceleration process further comprises the step of applying a Pd catalyst.
5. 5. The glass substrate metallization method of claim 1, wherein the glass substrate metallization acceleration process and the glass substrate plating process are wet processes.
6. 6. The glass substrate metallization method of claim 1, wherein the glass substrate has a thickness of 0.3 mm to 1.2 mm.
7. 7. The glass substrate metallization method of claim 1, wherein the glass substrate comprises a via.
8. 8. The glass substrate metallization method of claim 7, wherein the diameter of the through hole is 10 μιη to 140 μιη.
9. 9. The glass substrate metallization method of claim 7, wherein the glass substrate has an aspect ratio of 1:3 to 1:20.
10. 10. A method for manufacturing a glass substrate comprising the glass substrate metallization method according to any one of claims 1 to 9.
11. 11. The method for manufacturing a glass substrate according to claim 10, further comprising a process for forming a through hole in the glass substrate.
12. 12. The method for manufacturing a glass substrate according to claim 11, wherein the process for forming a through-hole in the glass substrate comprises a glass substrate laser modification process, and a glass substrate hole etching process.
13. 13. A metallized glass substrate obtained by the method for manufacturing a glass substrate according to claim 10.
14. 14. A metallized glass substrate includes a glass substrate, and a metal layer disposed on the glass substrate, Wherein a metallization accelerating layer is included between the glass substrate and the metal layer, and The metallization accelerating layer comprises a silane coupling agent and a Pd binder containing a functional group and a metal ion combined with the silane coupling agent.
15. 15. A metallized glass substrate includes a glass substrate having a through hole, and a metal layer disposed in the through hole of the glass substrate, Wherein a metallization accelerating layer is included between the glass substrate and the metal layer, and The metallization accelerating layer comprises a silane coupling agent and a Pd binder containing a functional group and a metal ion combined with the silane coupling agent.
16. 16. The metallized glass substrate of claim 15, wherein the glass substrate has an aspect ratio of 1:5 to 1:20.
17. 17. The metallized glass substrate of claim 15 having a plating coverage of 80% or greater, Wherein the plating coverage is calculated by using the following formula 1 after measuring a thickness (T1) of the metal layer at a position spaced apart from the through hole by 100 μm on the top surface of the glass substrate, a thickness (T2) of the metal layer at a position spaced apart from the top surface of the glass substrate by 25% of a thickness (wherein the thickness of the glass substrate is regarded as 100%) of the through hole, a thickness (T3) of the metal layer at a position spaced apart by 50% of a thickness of the through hole, and a thickness (T4) of the metal layer at a position spaced apart by 75% of a thickness of the through hole, based on a cross section obtained by cutting the through hole of the metallized glass substrate with a focused ion beam in a direction perpendicular to the top surface of the glass substrate: [ 1] 。

Description

Glass substrate metallization method, method for manufacturing glass substrate comprising same, and metallized glass substrate Technical Field The present disclosure relates to a glass substrate metallization method, a method for manufacturing a glass substrate including the same, and a metallized glass substrate. The present application claims the benefits of korean patent application No. 10-2024-0118561 filed in the korean intellectual property office at 2 nd of 2024 and korean patent application No. 10-2024-0201651 filed in the korean intellectual property office at 31 nd of 2024, the entire disclosures of which are incorporated herein by reference. Background Since glass substrates are excellent in warpage and Coefficient of Thermal Expansion (CTE), they can realize a large area substrate and facilitate high-speed signal transmission and heat discharge by an increase in the number of I/os. However, glass substrates have problems in that they exhibit low adhesion to metals and cannot allow electroless plating of glass substrates directly. Accordingly, research is required on a technique for improving the adhesion between glass and copper, and in particular, a technique capable of ensuring reliability even at high temperature and high humidity is required. According to the related art, electroless copper plating is performed after forming Cu seeds on the surface of the glass substrate by Cu sputtering. However, there is a disadvantage in that Cu seeds are not formed at the central portion inside the glass through-hole (through glass via, TGV) hole when the thickness of the glass substrate is increased or the diameter of the TGV hole is reduced (i.e., when the aspect ratio is increased). Therefore, when electroless plating is performed by a conventional method, there is a difficulty in increasing the aspect ratio of the glass substrate. Under these circumstances, development of a metal surface treatment method capable of performing metal plating on the surface of a glass substrate, particularly even at high temperature and high humidity, while increasing the aspect ratio of the glass substrate, is required. [ Citation ] (Patent document 1) korean patent laid-open publication No. 10-2010-013603 Disclosure of Invention Technical problem The present disclosure is directed to a glass substrate metallization method, a method for manufacturing a glass substrate including the same, and a metallized glass substrate. Technical proposal An exemplary embodiment of the present disclosure provides a glass substrate metallization method including a glass substrate metallization acceleration process, a glass substrate plating process, and an annealing process, wherein the glass substrate metallization acceleration process includes a step of surface-treating a glass substrate by using a glass substrate metallization acceleration composition including a silane coupling agent and a Pd binder, and the Pd binder is a metal ion-containing compound including a functional group capable of binding with the silane coupling agent. Another exemplary embodiment of the present disclosure provides a method for manufacturing a glass substrate, which includes a glass substrate metallization method. Yet another exemplary embodiment of the present disclosure provides a metallized glass substrate obtained by a method for manufacturing a glass substrate. Yet another exemplary embodiment of the present disclosure provides a metallized glass substrate comprising a glass substrate and a metal layer disposed on the glass substrate, wherein a metallization accelerating layer is included between the glass substrate and the metal layer, and the metallization accelerating layer comprises a silane coupling agent and a Pd binder containing functional groups and metal ions that bind to the silane coupling agent. Still another exemplary embodiment of the present disclosure provides a metallized glass substrate including a glass substrate having a through hole and a metal layer disposed in the through hole of the glass substrate, wherein a metallization accelerating layer is included between the glass substrate and the metal layer, and the metallization accelerating layer includes a silane coupling agent and a Pd binder containing a functional group and a metal ion bonded to the silane coupling agent. Advantageous effects The glass substrate metallization method according to one exemplary embodiment of the present disclosure includes a glass substrate metallization acceleration process using a specific composition, and thus Cu seed formation by Cu sputtering during a conventional electroless copper plating process of a glass substrate may be omitted, and metallization of the glass substrate may be completed only by a wet process. Further, it is contemplated that the glass substrate metallization method according to one exemplary embodiment of the present disclosure increases the aspect ratio of the glass substrate by increasing the thickness of the glass