CN-122003968-A - Image sensor package including pillar bumps

Abstract

The invention relates to an image sensor package comprising a columnar bump, which comprises an image sensor, a substrate and a columnar bump, wherein the image sensor is provided with a light receiving part, a contact pad part is arranged close to the light receiving part, the substrate comprises a plurality of windows, a connecting pad, a first contact part, a second contact part and a solder ball, the windows penetrate through at a specified interval, the connecting pad is used for electrically connecting an integrated circuit integrated on one surface except the windows with the outside, the first contact part is arranged on the connecting pad close to the windows and is contacted with the contact pad part of the image sensor, the second contact part is arranged on the connecting pad and is close to the first contact part and is arranged on the outer side than the outer peripheral surface of the image sensor, and the solder ball is arranged on the second contact part, and the columnar bump is arranged between the second contact part and the solder ball and has a height larger than or equal to the height of the image sensor and is used for electrically connecting the connecting pad and the solder ball.

Inventors

• JIN CHENGHAO

Assignees

• 金成浩

Dates

Publication Date

20260508

Application Date

20241127

Priority Date

20231204

Claims (2)

1. 1. An image sensor package including stud bumps, comprising: an image sensor having a light receiving portion, and a contact pad portion disposed in proximity to the light receiving portion; a substrate including a plurality of windows formed through a predetermined interval, a connection pad for electrically connecting an integrated circuit integrated on one surface except the windows to the outside, a first contact portion on the connection pad near the windows and contacting a contact pad portion of the image sensor, a second contact portion on the connection pad near the first contact portion and further outside than an outer peripheral surface of the image sensor, and a solder ball disposed on the second contact portion, and And a pillar bump located between the second contact portion and the solder ball and having a height greater than or equal to a height of the image sensor for electrically connecting the connection pad and the solder ball.
2. 2. The image sensor package including stud bumps of claim 1, The conductive body is arranged on the first contact part through one of anisotropic conductive adhesive, anisotropic conductive adhesive film, nano ink and stitch bumps, and the first contact part and the contact pad part are directly bonded so that the first contact part and the contact pad part are electrically connected.

Description

Image sensor package including pillar bumps Technical Field The invention relates to an image sensor package including pillar bumps. Background In general, an image sensor (image sensor) is a photoelectric conversion element that is integrated by a semiconductor device manufacturing technique as a device that detects subject information and converts the subject information into an electrical image signal. There is a line image sensor (one-dimensional image sensor) used for a facsimile or a copier, and an array image sensor (two-dimensional image sensor) used for a television camera, a notebook camera, a CCTV, a smart phone, or a digital camera. The array image sensor is formed by arranging photodiodes in two dimensions, and can obtain the whole image of a screen at one time, so that the array image sensor can be used in dynamic images such as videos. The charge generated by the photodiode is output, and as a transfer function, there are a CCD (charge coupled device) and a CMOS (complementary metal oxide semiconductor) element, and a CCD image sensor, a CMOS image sensor are called due to such a difference. In such a two-dimensional image sensor, an IR filter formed of a light-transmissive material is provided at an upper portion of the image sensor module, thereby preventing an external foreign object from adversely affecting the image sensor and collecting light in the image sensor. Electronic components required for electronic devices include a variety of active and passive circuit elements, which may be integrated on a semiconductor substrate known as a semiconductor chip (chip) or die (die). The electronic components of the integrated circuit may be mounted on a package (package) substrate including circuit wiring, such as a Printed Circuit Board (PCB) or a silicon interposer (Si interposer), and provided in the form of an electronic component package. Such an electronic component package may be mounted on a main board (main board) of an electronic device for constituting an electronic system (electronic system) such as a computer (computer) or a mobile device or a data storage (data storage). Recently, when a semiconductor chip is mounted on a package substrate and electrically connected to each other by a conductive wire or the semiconductor chip and the chip are connected to each other, a stacked structure using a Via (Via) is widely used for a package of an electronic component. For example, in order to embody a stacked structure of semiconductor chips of various forms in a flip chip package, and in order to secure a greater number of input/output (I/O) terminals (terminals), a connection bump structure by way of vias stacked as an electrical signal connection structure is employed. In order to realize insulation by surrounding a fastening structure of a connection bump of a package substrate and a semiconductor chip after fastening the connection bump to realize electrical connection, an underfill insulation layer can be formed in an underfill process to constitute a typical flip chip package structure. However, the wire bonding method is still operating as a step of a main product, and in addition, the CSP product in which the bump is formed by the via hole of the laminated structure is also operating, but there is a disadvantage in that the yield and the process cost of the image sensor are increased, and the cost is increased. For this reason, it is expected to reduce the cost by shortening the process and improving the yield by performing Direct Bonding (Direct Bonding) on the image sensor and the bump substrate (PCB) after sawing (Sawing). Disclosure of Invention Technical problem The present invention relates to an image sensor package including a pillar bump, and an object thereof is to provide an image sensor package in which an image sensor is directly bonded in a substrate using the pillar bump to simplify a process, minimize a physical height, and thus, flexibly provide a design of a camera module. Technical proposal The invention relates to an image sensor package comprising a columnar bump, which comprises an image sensor, a substrate and a columnar bump, wherein the image sensor is provided with a light receiving part, a contact pad part is arranged close to the light receiving part, the substrate comprises a plurality of windows, a connecting pad, a first contact part, a second contact part and a solder ball, the windows are formed in a penetrating way through a specified interval, the connecting pad is used for electrically connecting an integrated circuit integrated on one surface except the windows with the outside, the first contact part is arranged on the connecting pad close to the windows and is in contact with the contact pad part of the image sensor, the second contact part is arranged on the connecting pad and is positioned on the outer side than the outer peripheral surface of the image sensor, the solder ball is arranged on the second contact part, and the columnar bump i