CN-122003972-A - Substrate for assembling semiconductor light emitting element for display pixel and display device including the same

Abstract

The substrate for assembling the semiconductor light emitting element for a display pixel according to an embodiment may include a substrate, a plurality of assembly wires disposed on the substrate, a spacer disposed on the plurality of assembly wires and having an assembly hole, and a spacer channel disposed adjacent to the assembly hole.

Inventors

• AN ZAIYONG
• CHENG JUNHAO
• XU YUNGAO

Assignees

• LG电子株式会社

Dates

Publication Date

20260508

Application Date

20231005

Claims (11)

1. 1. A substrate for assembling a semiconductor light emitting element for a display pixel, comprising: a substrate; A plurality of assembly wires arranged on the substrate; a partition plate arranged on the plurality of assembly lines and having assembly holes, and And a separator passage disposed adjacent to the assembly hole.
2. 2. The substrate for assembling a semiconductor light emitting element for a display pixel according to claim 1, wherein, The assembly holes include a first assembly hole for assembling the first semiconductor light emitting element and a second assembly hole for assembling the second semiconductor light emitting element, The separator channel includes a first separator channel adjacent the first assembly aperture and a second separator channel adjacent the second assembly aperture.
3. 3. The substrate for assembling a semiconductor light emitting element for display pixels according to claim 2, wherein, The width of the first partition passage is smaller than the diameter of the first assembly hole.
4. 4. The substrate for assembling a semiconductor light emitting element for display pixels according to claim 2, wherein, The width of the first spacer channel is smaller than the diameter of the first semiconductor light emitting element and larger than the diameter of the second semiconductor light emitting element.
5. 5. The substrate for assembling a semiconductor light emitting element for a display pixel according to claim 4, wherein, The width of the first partition channel is larger than the height of the second semiconductor light emitting element.
6. 6. The substrate for assembling a semiconductor light emitting element for a display pixel according to claim 1, wherein, The semiconductor light emitting element for display pixels includes a plurality of the assembly holes, The separator channel is integrally formed with the plurality of assembly holes.
7. 7. The substrate for assembling a semiconductor light emitting element for a display pixel according to claim 1, wherein, The substrate for assembling the semiconductor light emitting element for display pixels comprises a plurality of the assembling holes, The substrate for assembling the semiconductor light emitting element for the display pixel further comprises: a first region disposed between the plurality of assembly holes and contacting the separator channel, The width of the first region is greater than the width of the separator channel.
8. 8. The substrate for assembling a semiconductor light emitting element for a display pixel according to claim 1, wherein, The separator channel is arranged to vertically overlap any one of the plurality of assembly wirings.
9. 9. The substrate for assembling a semiconductor light emitting element for a display pixel according to claim 1, wherein, The height of the separator is set to be higher than the weight center of the semiconductor light emitting element.
10. 10. The substrate for assembling a semiconductor light emitting element for a display pixel according to claim 1, wherein, The height of the spacer is less than 1/2 of the diameter of the semiconductor light emitting element.
11. 11. A display device comprising the substrate for assembling a semiconductor light-emitting element for display pixels according to any one of claims 1 to 10.

Description

Substrate for assembling semiconductor light emitting element for display pixel and display device including the same Technical Field Embodiments relate to a substrate for assembling a semiconductor light emitting element for a display pixel and a display device including the same. Background Large displays include Liquid Crystal Displays (LCDs), OLED displays, micro-LED displays (Micro-LED DISPLAY), and the like. The micro-LED display is a display having a semiconductor light emitting element having a diameter or a cross-sectional area of 100 μm or less, that is, a micro-LED as a display element. The micro-LED display uses micro-LEDs as semiconductor light emitting elements as light emitting elements, and thus has excellent performance in various characteristics such as contrast, response speed, color reproduction rate, viewing angle, brightness, resolution, lifetime, light emitting efficiency, and brightness. Especially, the micro-LED display can separate and combine pictures in a modular manner, thus having the advantages of flexible adjustment of size and resolution and realization of a flexible display. However, a large micro-LED display requires more than several million micro-LEDs, and thus there is a technical problem in that it is difficult to rapidly and precisely transfer the micro-LEDs to a display panel. Transfer techniques developed in recent years include a pick-and-place process (PICK AND PLACE process), a laser lift-off method (LASER LIFT-off method), a self-assembly method (self-assembly method), and the like. The self-assembly mode is a mode of automatically searching an assembly position of the semiconductor light-emitting element in fluid, and is a mode of being beneficial to realizing a display device with a large picture. Recently, U.S. registration No. 9,825,202 discloses a micro-LED structure suitable for self-assembly, but the study of the related art for manufacturing a display by self-assembly of micro-LEDs is still insufficient. In particular, in the prior art, when more than several million semiconductor light emitting elements are rapidly transferred to a large display, although the transfer speed (TRANSFER SPEED) can be increased, there is a possibility that the transfer defective rate (transfer error rate) is increased, and there is a problem that the transfer defective rate (TRANSFER YIELD) is lowered. On the other hand, a transfer process using a self-assembly method by dielectrophoresis (dielectrophoresis, DEP) has been attempted in the related art, but there is a problem that the self-assembly rate is low due to the uneven problem of DEP force. In addition, when the semiconductor light emitting elements are assembled one by one, there is a possibility that a problem of color mixing occurs, and there is a problem that an assembling time is prolonged. Disclosure of Invention Technical problem to be solved One of the technical problems to be solved by the embodiments is to realize simultaneous assembly of semiconductor light emitting elements. In addition, one of the technical problems to be solved by the embodiments is to improve the correct assembly rate of the semiconductor light emitting element. In addition, one of the technical problems to be solved by the embodiments is to prevent color mixing in the assembly substrate and the display device. In addition, one of the technical problems to be solved by the embodiments is to facilitate recycling of unassembled chips. In addition, one of the technical problems to be solved by the embodiments is to reduce the assembly time of the semiconductor light emitting element. The technical problems to be solved by the embodiments are not limited to the technical problems described herein, but include technical problems that can be understood by the description of the invention. Means for solving the technical problems The substrate for assembling the semiconductor light emitting element for a display pixel according to an embodiment may include a substrate, a plurality of assembly wires disposed on the substrate, a spacer disposed on the plurality of assembly wires and having an assembly hole, and a spacer channel disposed adjacent to the assembly hole. In addition, in an embodiment, the assembly holes may include a first assembly hole for assembling a first semiconductor light emitting element and a second assembly hole for assembling a second semiconductor light emitting element, and the partition passages may include a first partition passage adjacent to the first assembly hole and a second partition passage adjacent to the second assembly hole. In addition, in an embodiment, a width of the first separator channel may be smaller than a diameter of the first assembly hole. In addition, in an embodiment, the width of the first barrier channel may be smaller than the diameter of the first semiconductor light emitting element and larger than the diameter of the second semiconductor light emitting element. In addition, in an embodim