CN-122003974-A - Integrated sealing sheet and light-emitting electronic component

Abstract

The invention aims to prevent light diffusion between adjacent LEDs and further improve the brightness of the LEDs. The present invention relates to an integrated sealing sheet (1) and a light-emitting electronic component provided with the cured integrated sealing sheet, wherein the integrated sealing sheet (1) is used for sealing a gap between a plurality of light-emitting diodes in a substrate with an element formed by fixing terminals of the plurality of light-emitting diodes on the substrate, and the integrated sealing sheet (1) is provided with a form of sequentially laminating a base material layer (13), a curable black layer (11) for forming a black layer capable of absorbing light emitted from the light-emitting diodes, and a curable reflective layer (12) for forming a reflective layer capable of reflecting light emitted from the light-emitting diodes.

Inventors

• YOSHIDA SHOJIRO
• TANAKA ATSUKO
• YOSHIDA KAZUNORI
• KATAGIRI WATARU

Assignees

• 信越聚合物株式会社

Dates

Publication Date

20260508

Application Date

20240926

Priority Date

20231016

Claims (15)

1. 1. An integrated sealing sheet, characterized in that the sealing sheet is used for sealing a substrate with elements, which is formed by fixing terminals of a plurality of light emitting diodes on a substrate, by filling gaps of the light emitting diodes, The integrated sealing sheet has a form in which the following layers are laminated in order: a substrate layer; a curable black layer for forming a black layer capable of absorbing light emitted from the light emitting diode, and And a curable reflective layer for forming a reflective layer capable of reflecting light emitted from the light emitting diode.
2. 2. The one-piece sealing sheet of claim 1, wherein the thickness of the curable reflective layer is greater than the thickness of the curable black layer.
3. 3. The one-piece sealing sheet according to claim 1 or 2, wherein the curable reflection layer is a layer containing a light-reflective inorganic filler having a function of reflecting light in a curable resin.
4. 4. The integrated sealing sheet according to claim 3, wherein the light-reflective inorganic filler is a filler selected from titanium oxide, hexagonal boron nitride, aluminum oxide, calcium carbonate, barium sulfate, zeolite, talc, silica, or glass beads.
5. 5. The one-piece sealing sheet according to any one of claims 1 to 4, wherein the curable black layer is a layer containing a light-absorbing inorganic filler having a function of absorbing light in a curable resin.
6. 6. The unitary sealing sheet of claim 5, wherein the light-absorbing inorganic filler is a carbon filler.
7. 7. The one-piece sealing sheet according to any one of claims 1 to 6, wherein a curable transparent layer for forming a transparent layer that is transparent to light emitted from the light-emitting diode is provided between the base material layer and the curable black layer.
8. 8. A light-emitting electronic component is characterized by comprising: A plurality of light emitting diodes; a substrate for fixing terminals of the light emitting diodes on a side opposite to the top surface, and An integral sealing cured sheet having a portion on the substrate, the portion being filled in gaps between the plurality of light emitting diodes, The integral sealing cured sheet has a form in which the following layers are laminated: a black layer filled in gaps between the light emitting diodes and filled from the top surface of the light emitting diode to a position short of the side surface of the terminal of the light emitting diode, capable of absorbing light emitted from the light emitting diode, and And a reflective layer filled in gaps between the plurality of light emitting diodes and filled from the terminal to the black layer, the reflective layer being capable of reflecting light emitted from the light emitting diodes.
9. 9. The light-emitting electronic component of claim 8, wherein the thickness of the reflective layer is greater than the thickness of the black layer.
10. 10. The light-emitting electronic component according to claim 8 or 9, wherein the reflective layer is a layer containing a light-reflective inorganic filler having a function of reflecting light in a resin.
11. 11. The light-emitting electronic component according to claim 10, wherein the light-reflective inorganic filler is a filler selected from titanium oxide, hexagonal boron nitride, aluminum oxide, calcium carbonate, barium sulfate, zeolite, talc, silica, or glass beads.
12. 12. The light-emitting electronic component according to any one of claims 8 to 11, wherein the black layer is a layer containing a light-absorbing inorganic filler having a function of absorbing light in a resin.
13. 13. The light-emitting electronic component according to claim 12, wherein the light-absorbing inorganic filler is a carbon filler.
14. 14. The light-emitting electronic component according to any one of claims 8 to 13, wherein the plurality of light-emitting diodes are light-emitting diodes capable of emitting red, green, and blue light, respectively.
15. 15. The light-emitting electronic component according to any one of claims 8 to 14, wherein the cured sheet for integral sealing includes a transparent layer that transmits light emitted from the light-emitting diode on a side of the black layer opposite to the reflective layer.

Description

Integrated sealing sheet and light-emitting electronic component Cross reference The present application is based on the priority of Paris convention claimed in Japanese patent application No. 2023-178141 filed in Japan at 10/16 of 2023, the entire contents of which are incorporated herein by reference. Technical Field The present invention relates to an integrated sealing sheet and a light-emitting electronic component. Background In recent years, a display using very small light emitting diodes called small LEDs or micro LEDs has been attracting attention. As a method of using the very small light emitting diode for a display, there are known roughly 2 methods. One is a method of forming a backlight of liquid crystal by disposing a plurality of light emitting diodes on a substrate and locally controlling the brightness of the backlight. Another method is to make light emitting diodes of each of R (red), G (green) and B (blue) emit light of each color to eyes of a viewer of the display in pixel units. Light emitting diodes (hereinafter, referred to as "LEDs") such as small LEDs and micro LEDs are generally arranged on a substrate such as a circuit board. As the size of the LED has a tendency to become smaller toward the future, difficulty in mounting to the substrate is increasing. Therefore, a method of integrating a plurality of small LEDs as one large unit and easily installing even existing devices has been attempted. When a plurality of LEDs are arranged on a substrate, there are approximately 2 technical problems. One is to prevent light diffusion between adjacent LEDs. Another is to improve the reduction in brightness accompanying the downsizing of the LED. First, as a method for solving the first technical problem, there is a method for blocking light between a plurality of LEDs by using a resin having a light diffusion preventing function. As a resin used in this method, a dry film is known as an example (see patent document 1). The dry film is obtained by applying a light-shielding resin composition onto a protective film and drying the film. If the dry film is bonded to the plurality of LEDs, a light-shielding resin layer is formed not only in the gaps between the LEDs but also on the upper surface (light-emitting surface) of the LEDs. In such a case, the resin layer may also block light reaching the viewer from the display. In order to prevent this, in the conventional technique, a method is adopted in which a light emitting surface of an LED is etched by plasma treatment or the like, a resin layer on the light emitting surface is removed, and a light-transmitting sealing material is covered on the removed surface. Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2022-22562 Disclosure of Invention Technical problem to be solved by the invention However, the above-described prior art requires a lot of time for the etching process, and thus causes an increase in manufacturing cost. In addition, it is difficult to completely remove the resin layer on the light emitting surface of the LED, and as a result, it is difficult to completely prevent the diffusion of light from the display to the viewer side. In addition, a process of laminating a film of a sealing material having high transparency after etching treatment is also required, and thus there is a problem in that the number of processes in production is increased. In view of the above problems, the present inventors have developed an integrated sealing sheet in which 1 layer or 2 or more curable resin layers are formed on one surface of a film base material. It is found that by pressing the integral sealing sheet against the LEDs so that the curable resin layer faces the light emitting surface of the LEDs and curing the curable resin layer, it is possible to realize a structure that can reduce light diffusion between the LEDs and does not block light emission from the LEDs. In this case, there is another technical problem to be solved. As described above, this is to further increase the brightness of the LED. If the size of the LEDs is small, there is a tendency that the brightness of each LED becomes low. Therefore, it is also considered to increase the current value to increase the luminance, but there is another problem that the heat generation of the LED becomes large. In particular, since the LED emits light not in one direction but from the side surface and the bottom surface of the LED, the luminance in the direction in which light emission is desired becomes low. The present invention has been made to solve the above-described problems, and an object of the present invention is to prevent light diffusion between adjacent LEDs and to further improve the brightness of the LEDs. Technical scheme for solving technical problems (1) One embodiment for achieving the above object is an integrated sealing sheet for sealing a gap between a plurality of light emitting diodes by filling a substrate