CN-122003984-A - Processor for processing electronic components and tray for loading electronic components

Abstract

The present invention relates to a handler for handling electronic components. According to the present invention, the electronic component handling apparatus includes a first handling unit handling a first loader holding electronic components by bonding, a second handling unit handling a second loader holding electronic components by being placed in a loading slot, and a moving robot moving electronic components on the first loader to the second loader. According to the invention, the setup cost required for testing the whole system of the electronic component can be saved.

Inventors

• LUO RUNCHENG

Assignees

• 泰克元有限公司

Dates

Publication Date

20260508

Application Date

20250905

Priority Date

20240905

Claims (20)

1. 1. A handler for handling electronic components, wherein, Comprising the following steps: a first processing unit that manipulates a first loader capable of loading electronic components; a second processing unit that manipulates a second loader capable of loading electronic components and having a structure different from that of the first loader; A stacker unit disposed in front of the first and second processing units for supplying or recovering the first loader to or from the first processing unit, supplying or recovering the second loader to or from the second processing unit, and A moving manipulator that moves the electronic component on the first loader to the second loader; the first loader operated by the first processing unit has a structure in which the loaded electronic components are held by bonding, The second loader manipulated by the second processing unit has a structure in which the loaded electronic components are placed in the loading slot while being held in place.
2. 2. The handler for handling electronic components of claim 2, wherein, The mobile robot is capable of moving the electronic component on the second loader to the first loader.
3. 3. The handler for handling electronic components of claim 1, wherein, The first processing unit has a separator for separating the electronic components from the first loader when the moving robot moves the electronic components loaded on the first loader to the second loader.
4. 4. The handler for handling electronic components of claim 1, wherein, The first processing unit has an adhesive for adhering the electronic component loaded on the second loader to the first loader when the moving robot moves the electronic component to the first loader.
5. 5. The handler for handling electronic components of claim 1, wherein, The loading capacity of the first loader is N times that of the second loader, wherein N is a natural number of 2 or more.
6. 6. The handler for handling electronic components of claim 1, wherein, The second processing unit includes: At least one supporter for supporting the second loader, and A base plate on which the supporter is mounted.
7. 7. The handler for handling electronic components of claim 6, wherein, The base plate is movably mounted.
8. 8. The handler for handling electronic components of claim 6, wherein, The supporter is installed in plurality.
9. 9. The handler for handling electronic components of claim 6, wherein, The supporter includes: A support plate supporting the second loader; A buffer plate for supporting the second loader and disposed below the support plate, and And the lifter drives the supporting plate and the buffer plate to lift.
10. 10. The handler for handling electronic components of claim 6, wherein, The second processing unit further includes a translator that moves the second loader on the stacker unit to the supporter or moves the second loader on the supporter to the stacker unit.
11. 11. The handler for handling electronic components of claim 10, wherein, The translator includes: a first holder capable of holding the second loader or releasing the holding state; a first advancing and retreating machine for driving the first holder to advance and retreat; A second holder configured to be able to hold the second loader or release the holding state, and disposed below the first holder; a second advancing and retreating machine for advancing or retreating the second holder, and And an elevator for driving the first holder and the second holder to be lifted.
12. 12. The handler for handling electronic components of claim 1, wherein, Comprising an opener for opening the second loader.
13. 13. The handler for handling electronic components of claim 1, wherein, The stacker unit has a plurality of loading spaces capable of loading cassettes capable of carrying the first loader or the second loader, The cassette transfer device is capable of moving the cassette between the plurality of loading spaces.
14. 14. A handler for handling electronic components, wherein, Comprising the following steps: a processing unit that manipulates a loader capable of loading electronic components; A stacker unit disposed in front of the processing unit for supplying or recovering the loader to or from the processing unit, and Moving a manipulator to move an electronic component between loaders on the processing unit; the processing unit includes: A supporter for supporting the loader, and A base plate on which the supporter is mounted, The base plate is movably mounted.
15. 15. The handler for handling electronic components of claim 14, wherein, The supporter includes: A support plate supporting the loader; a buffer plate for supporting the loader and arranged below the supporting plate, and And an elevator (921 c) for driving the support plate and the buffer plate to be lifted.
16. 16. The handler for handling electronic components of claim 14, wherein, The processing unit further includes a translator that moves the loader on the stacker unit to the supporter or moves the loader on the supporter to the stacker unit.
17. 17. The handler for handling electronic components of claim 16, wherein, The translator includes: a first holder capable of holding the loader or releasing the holding state; a first advancing and retreating machine for driving the first holder to advance and retreat; A second holder configured to hold the loader or release the holding state, and disposed below the first holder; a second advancing and retreating machine for advancing and retreating the second holder, and And an elevator for driving the first holder and the second holder to be lifted.
18. 18. The handler for handling electronic components of claim 14, wherein, The processing unit further comprises an opener for opening the loader.
19. 19. The handler for handling electronic components of claim 14, wherein, The stacker unit has a plurality of loading spaces capable of loading cassettes capable of carrying the loader, The cassette transfer device is capable of moving the cassette between the plurality of loading spaces.
20. 20. A handler for handling electronic components, wherein, Comprising the following steps: a processing unit that manipulates a loader capable of loading electronic components; A stacker unit disposed in front of the processing unit, the stacker unit supplying or recovering the loader to or from the processing unit; moving a robot arm to move electronic components between loaders on the processing unit, and A translator that moves the loader on the stacker unit to the processing unit or moves the loader on the processing unit to the stacker unit; The translator includes: a first holder capable of holding the loader or releasing the holding state; a first advancing and retreating machine for driving the first holder to advance and retreat; A second holder configured to hold the loader or release the holding state, and disposed below the first holder; a second advancing and retreating machine for advancing and retreating the second holder, and And an elevator for driving the first holder and the second holder to be lifted.

Description

Processor for processing electronic components and tray for loading electronic components Technical Field The present invention relates to a handler for handling electronic components. Background Electronic components are subjected to a wide variety of processes during the manufacturing process. Among the various processes are testing or sorting, etc. A handler is a device that gives support for the processing required by an electronic component. For example, a handler for testing electronic components provides support for the handling of electronic components to be tested and the testing of electrical connections. The handler supporting the test also needs to be additionally equipped according to the kind of test. For example, a handler for classifying electronic components provides support for reconfiguring electronic components that are required to be classified according to a classification reference. Generally, electronic components required to be processed are supplied to a processing machine in a state of being loaded on a tray. The handler extracts the electronic components mounted on the tray from the tray, performs necessary processing, and reloads the processed electronic components to the tray. The tray is a loader capable of loading electronic components, and there are many kinds of the same. The pallet may be a ring mount 10 as shown in fig. 1. The ring carrier 10 includes a support ring 11 and an adhesive film 12. The support ring 10 has a substantially circular ring shape, and has a recess N1 for identifying the direction. The adhesive film 12 is fixed on the support ring 10, supporting the loaded electronic components. The electronic component is bonded to the adhesive film 12. The electronic components bonded to the adhesive film 12 may be held in place by adhesive means. Fig. 2 shows schematically a state in which several electronic components ED are bonded to the adhesive film 12. The adhesive film 12 is damaged when the electronic component ED is peeled off. And therefore is disposable and requires continuous replacement. The tray may be a JEDEC tray (JEDEC tray) designed and manufactured according to standard specifications set by JEDEC. The invention is particularly relevant to ring carriers 10. The ring carrier 10 is primarily used to handle electronic components ED in a die stack state for the purpose of producing a high bandwidth memory (HBM: high Bandwidth Memory) or die state. In order to perform a job after the die, a test needs to be performed for the die. The electronic component ED in the state of a die or in the state of a stack of dies is tested by electrically connecting the contact pads with the test machine. The finer the process, the finer the pitch between the contact pads on the die. This constitutes an obstacle in developing a handler that supports automatic testing of electronic components ED in a die state or in a die stack state. Omitting the testing of the electronic component ED in the die state or in the die stack state results in reduced yield and reduced reliability of the final product. For this, the present inventors have disclosed korean laid-open patent No. 10-2021-0088373 (hereinafter referred to as "prior art"). The prior art relates to a handler that aligns the positions of the electronic components by a reconfiguration process before connecting the electronic components ED to the tester. The prior art uses a camera to scan the electronic component ED on a test bed (which is named as a "chuck" in the prior art) to grasp the position of the electronic component ED, and to perform a reconfiguration process to adjust to the correct position. According to the related art, the electronic components ED can be finely arranged on the test bench because the error range of the positions of the electronic components ED can be reduced. Thereby, an automatic test of the electronic component ED in the die state or the die stack state can be achieved. According to the prior art, when the electronic component ED is carried into or out of the handler, the ring loading base 10 for carrying the electronic component ED is used. The electronic components ED are supplied to the handler in a state of being loaded into the ring loading seat, and are carried out of the handler in a state of being loaded into the ring loading seat. The electronic component ED is in a state of being adhered to the ring carrier 10, and thus it is necessary to peel the electronic component ED from the ring carrier 10 for testing, and then to adhere the electronic component ED to the ring carrier 10 when it is recovered. However, the electronic components ED are subjected to various testing or processing processes, and each time a different processor supply is required. This can lead to excessive wastage of the disposable adhesive film 12, damage to the electronic component ED occurring during multiple bonding and separation processes. [ Prior Art literature ] [ Patent literature ] (Patent document