CN-122003987-A - Marking device, marking method, semiconductor wafer and semiconductor chip

Abstract

A marking device (EA) capable of reducing the motivation of a third party to copy a semiconductor wafer or a semiconductor chip, for example, is provided with a first marking means (10) for imparting a first mark (MK 1) to the semiconductor Wafer (WF) or the semiconductor Chip (CP) by a first imparting means (12), and a second marking means (20) for imparting a second mark (MK 2) to the semiconductor Wafer (WF) or the semiconductor Chip (CP) to which the first mark (MK 1) has been imparted by the first marking means (10) by a second imparting means (22).

Inventors

• GAO YEJIAN
• Tian Jiuzhenye

Assignees

• 琳得科株式会社

Dates

Publication Date

20260508

Application Date

20240917

Priority Date

20231030

Claims (8)

1. 1. A marking device for giving a predetermined mark to a semiconductor wafer or a semiconductor chip, characterized in that, The marking device is provided with: A first marking unit for marking the semiconductor wafer or the semiconductor chip with a first mark by a first marking method, and And a second marking unit that applies a second mark to the semiconductor wafer or the semiconductor chip to which the first mark is applied by the first marking unit, by a second applying method.
2. 2. The marking device of claim 1 wherein, A laminate is laminated on the semiconductor wafer or the semiconductor chip; At least one of the first marking unit and the second marking unit imparts the predetermined mark to the laminate, thereby imparting the predetermined mark to the semiconductor wafer or the semiconductor chip via the laminate.
3. 3. The marking device of claim 2, wherein the marking device comprises a plurality of marking elements, The laminate produces a change specific to a predetermined energy by imparting the predetermined energy; the marking device includes an energy applying unit that applies the predetermined energy to the laminate.
4. 4. Marking device according to claim 1 or 2, characterized in that, The image processing apparatus includes an image capturing unit that captures at least one of the first mark and the second mark to form a mark image, and outputs the mark image to another apparatus.
5. 5. Marking device according to claim 1 or 2, characterized in that, The device is provided with a coating unit which is provided with a coating material in a manner of coating at least one of the first mark and the second mark.
6. 6. A marking method for giving a predetermined mark to a semiconductor wafer or a semiconductor chip, characterized in that, The marking method is implemented by: A first marking step of giving a first mark to the semiconductor wafer or the semiconductor chip by a first giving means, and And a second marking step of applying a second mark to the semiconductor wafer or the semiconductor chip to which the first mark is applied by the first marking step, by a second applying method.
7. 7. A semiconductor wafer to which a predetermined mark is given, characterized in that, The predetermined mark comprises: A first mark provided by a first providing means, and The second mark is given by a second giving means.
8. 8. A semiconductor chip to which a predetermined mark is given, characterized in that, The predetermined mark comprises: A first mark provided by a first providing means, and The second mark is given by a second giving means.

Description

Marking device, marking method, semiconductor wafer and semiconductor chip Technical Field The invention relates to a marking device, a marking method, a semiconductor wafer and a semiconductor chip. Background A marking device for imparting a predetermined mark to a semiconductor wafer is known (see, for example, patent document 1). Prior art literature Patent literature Patent document 1 (Japanese patent application laid-open No. 2016-112579). Disclosure of Invention First, the technical problem to be solved In the laser processing apparatus (marking apparatus) described in patent document 1, an ID mark (first mark) can be provided to a semiconductor wafer, and a tamper-proof mark (second mark) can be provided to a semiconductor wafer, but there is a problem that, when a third party wants to copy a semiconductor wafer to which the first mark and the second mark are provided by the marking apparatus, only one laser irradiation unit (marking unit) is required. The invention provides a marking device, a marking method, a semiconductor wafer and a semiconductor chip, which can reduce the motivation of a third party to copy the semiconductor wafer or the semiconductor chip. (II) technical scheme The present invention adopts the structure described in the claims. (III) beneficial effects According to the present invention, since the second mark is given to the semiconductor wafer or the semiconductor chip to which the first mark is given by the first giving method by the second giving method, the semiconductor wafer or the semiconductor chip cannot be reproduced by only one mark unit. Therefore, it can be easily understood that the burden such as cost and labor is increased, and the incentive of a third party to copy the semiconductor wafer or the semiconductor chip can be reduced. Drawings Fig. 1 (a) to (D) are explanatory views of a marking device, a semiconductor wafer, and a semiconductor chip according to an embodiment of the present invention. Fig. 1 (E) to (H) are explanatory diagrams of modifications. Detailed Description An embodiment of the present invention will be described below based on the drawings. In the present embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. In the present embodiment, when the direction is displayed without designating the drawing, the "upper" is the arrow direction of the Z axis, the "lower" is the opposite direction of the "upper", the "left" is the arrow direction of the X axis, the "right" is the opposite direction of the "left", the "front" is the arrow direction of the Y axis, and the "rear" is the opposite direction of the "front", based on the case of viewing from the front direction in fig. 1 (a). The marking device EA for performing the marking method of the present invention is a device for applying a predetermined mark MK (see (B) in FIG. 1) to a semiconductor wafer (hereinafter, also simply referred to AS a "wafer") WF, and includes a first marking unit 10 for performing a first marking step of applying the first mark MK1 to the wafer WF by a laser printer 12 AS a first applying method, a second marking unit 20 for performing a second marking step of applying the second mark MK2 to the wafer WF to which the first mark MK1 is applied by an ink jet printer 22 AS a second applying method, an energy applying unit 30 for performing an energy applying step of applying ultraviolet UV AS a predetermined energy to the adhesive sheet AS, and an imaging unit 40 for performing an imaging step of imaging both the first mark MK1 and the second mark MK2 to form a mark image and outputting the mark image to other devices, and the marking device EA being disposed above a moving unit 50 for transporting the wafer WF 50. Further, an adhesive sheet AS which is a laminate is attached to one surface of the wafer WF of the present embodiment, and the first marking unit 10 and the second marking unit 20 impart a predetermined mark MK to the adhesive sheet AS, whereby the predetermined mark MK is imparted to the wafer WF via the adhesive sheet AS. In addition, the adhesive sheet AS is cured by applying ultraviolet light UV, which is a change unique to the ultraviolet light UV. The first marking unit 10 includes a so-called XY stage 11 AS a driving device capable of moving a slider 11A in the front-rear direction and the left-right direction, and a laser printer 12 supported by the slider 11A, and the first marking unit 10 marks a first mark MK1 on an adhesive sheet AS. As shown in each of fig. 1 (C), the first mark MK1 inscribed by the laser printer 12 has an irregular outer edge shape when viewed in enlargement, and has different features due to the irregular outer edge shape. The second marking unit 20 includes a so-called XY stage 21 AS a driving device capable of moving the slider 21A in the front-rear direction and the left-rig