CN-122004646-A - High-melting-point liquid metal heat conduction structure and equipment

Abstract

A high-melting-point liquid metal heat conducting structure is characterized in that a liquid metal with a melting point higher than the working temperature of a heat source is arranged on a heat conducting interface between the heat source and a heat radiating component, the liquid metal is heated and melted to fill a contact gap when the heat source is installed, and the working temperature of the heat source is lower than the melting point of the heat source when the liquid metal is in operation, so that the liquid metal cannot be melted. The liquid metal is only melted during installation, is easy to control and does not overflow, and the packaging cost is low. The liquid metal is not melted and is solid when in operation, so that the advantages of good heat conduction performance, capability of filling contact gaps in a flowing way, high temperature resistance and the like of the liquid metal are utilized, and the defects of easy flowing and overflowing, high conductivity, corrosiveness to most metals and the like of the liquid metal are avoided. Because the working temperature of the electric heating part of the household appliance cooker is higher, zinc alloy, aluminum alloy and the like can be used as liquid metal. The liquid metal is doped with lubricating materials such as graphite powder, or lubricating agents are smeared on the heat source and the heat dissipation part. An apparatus comprising the above thermally conductive structure.

Inventors

• ZHOU ZHEMING

Assignees

• 广州洛书计算机有限公司

Dates

Publication Date

20260512

Application Date

20241112

Claims (4)

1. 1. A high-melting-point liquid metal heat conduction structure is characterized in that liquid metal with a melting point higher than the working temperature of a heat source is arranged on a heat conduction interface between the heat source and a heat dissipation part, and the liquid metal is heated and melted during installation so as to fill a contact gap.
2. 2. A thermally conductive structure as claimed in claim 1, wherein said liquid metal is doped with a lubricating material.
3. 3. A thermally conductive structure as claimed in claim 1, wherein said heat source and/or heat sink member is coated with a lubricant to avoid sticking to said liquid metal.
4. 4. An apparatus comprising the thermally conductive structure of any of the preceding claims.

Description

High-melting-point liquid metal heat conduction structure and equipment Technical Field The invention relates to the field of heat transfer, in particular to the field of heat conduction of electronic products and household appliances. Background In the field of household electrical appliances, the current household electrical appliances are generally made of stainless steel materials, and heavy metal precipitation easily occurs in the long-term high-temperature heating process, so that the household electrical appliances are not beneficial to human health. Thus, some all-glass or all-ceramic cookers are commercially available and are popular. The heat conduction of glass and ceramic is slow, and the bottom of the glass and ceramic is uneven due to easy deformation in the manufacturing process, so that the glass and ceramic are in poor contact with an electrothermal disk, therefore, the power of the all-glass or all-ceramic cooker is generally not high, and the electrothermal disk can be prevented from being overheated. There is also a titanium metal pot which has a melting crystallization step during the manufacturing process, resulting in easy deformation and uneven bottom, and poor contact with the electric heating plate. In the field of electronic products, at present, power of electronic components of servers, new energy automobiles, wearable devices and the like is higher and higher, and heat dissipation requirements of the electronic components face larger challenges. Traditional thermal interface materials, including heat conductive silicone grease, phase change materials, heat conductive silicone rubber sheets and the like, are generally composed of polymer materials and heat conductive particles, have poor heat conductive performance and are not resistant to high temperature, and have difficulty in meeting the increasing heat dissipation demands. The liquid metal is a novel heat conducting material, the heat conducting performance is far higher than that of the polymer material, and the liquid metal can flow and fill the contact gap of the heat conducting interface between the heat source and the heat radiating part, so that the heat radiating problem can be effectively solved. However, the liquid metal has the characteristics of good fluidity, large surface tension, high conductivity, corrosiveness to most metals, and the like, so that the problems of high packaging cost, easy overflow, and the like exist. Disclosure of Invention In order to alleviate the deficiencies of the prior art, the present invention provides a high melting point liquid metal heat conducting structure and apparatus. A high-melting-point liquid metal heat conducting structure is characterized in that a liquid metal with a melting point higher than the working temperature of a heat source is arranged on a heat conducting interface between the heat source and a heat radiating component, the liquid metal is heated and melted to fill a contact gap when the heat source is installed, and the working temperature of the heat source is lower than the melting point of the heat source when the liquid metal is in operation, so that the liquid metal cannot be melted. Because the working temperature of the electric heating part of the household appliance cooker is higher, zinc alloy, aluminum alloy and the like can be used as liquid metal. The liquid metal is doped with a lubricating material such as graphite powder, or a lubricating agent is smeared on a chip, a glass or ceramic cooker and other parts contacted with the liquid metal so as to avoid sticking to the liquid metal. The beneficial effects of the invention are as follows: a high-melting-point liquid metal heat conducting structure is characterized in that a liquid metal with a melting point higher than the working temperature of a heat source is arranged on a heat conducting interface between the heat source and a heat radiating component, the liquid metal is heated and melted to fill a contact gap when the heat source is installed, and the working temperature of the heat source is lower than the melting point of the heat source when the liquid metal is in operation, so that the liquid metal cannot be melted. The liquid metal is only melted during installation, is easy to control and does not overflow, and the packaging cost is low. The liquid metal is not melted and is solid when in operation, so that the advantages of good heat conduction performance, capability of filling contact gaps in a flowing way, high temperature resistance and the like of the liquid metal are utilized, and the defects of easy flowing and overflowing, high conductivity, corrosiveness to most metals and the like of the liquid metal are avoided. Because the working temperature of the electric heating component of the household appliance cooker is higher, zinc alloy, aluminum alloy and the like can be used as liquid metal, and zinc alloy, aluminum alloy and the like are used as liquid metal, and the hous