CN-122007004-A - Backing structure applied to ultrasonic transducer and ultrasonic transducer with backing structure

CN122007004ACN 122007004 ACN122007004 ACN 122007004ACN-122007004-A

Abstract

The invention belongs to the technical field of ultrasonic equipment, and provides a backing structure applied to an ultrasonic transducer and the ultrasonic transducer with the backing structure, wherein the backing structure comprises a backing main body and a heat dissipation outer frame coated on the side surface of the backing main body, the upper surface of the backing main body is contacted with a piezoelectric interface to receive incident sound waves, the inside of backing main part has set gradually heat-conducting layer and two sets of sound absorption cavity group from top to bottom, and the heat-conducting layer can be with backing main part's heat conduction to the heat dissipation frame to give off the heat to the external world through the heat dissipation frame, the sound absorption cavity staggered arrangement in each set of sound absorption cavity group is in order to form compound sound absorption array. According to the scheme provided by the invention, the heat conduction layer and the heat dissipation outer frame are used as backing structures to build an efficient active heat dissipation channel, and the transmission path of sound waves is complicated and greatly prolonged through the dislocation arrangement of the two layers of sound absorption cavities, so that the effect of consuming the sound wave energy through the backing main body is achieved, and the effect of considering the heat dissipation performance and the sound absorption performance is achieved on the premise of not increasing the volume of the backing.

Inventors

ZHANG ZHIQIANG
ZHOU JIANXIONG
QIU WEIBAO
ZHENG HAIRONG

Assignees

中国科学院深圳先进技术研究院

Dates

Publication Date: 20260512
Application Date: 20260213

Claims (10)

1. The backing structure is characterized by comprising a backing main body and a heat dissipation outer frame coated on the side surface of the backing main body, wherein the upper surface of the backing main body is contacted with a piezoelectric interface and is used for receiving incident sound waves; The inside of the back lining main body is provided with a first heat conduction layer, a first sound absorption cavity group and a second sound absorption cavity group in sequence from top to bottom along a first direction vertical to the upper surface; the first heat conduction layer is used for conducting heat of the back lining main body to the heat dissipation outer frame and radiating the heat to the outside through the heat dissipation outer frame; the first sound absorption cavity group comprises a plurality of first sound absorption cavities which are sequentially arranged along a second direction parallel to the upper surface, the second sound absorption cavity group comprises a plurality of second sound absorption cavities which are sequentially arranged along the second direction, and the first sound absorption cavities and the second sound absorption cavities are staggered along the second direction on a projection plane perpendicular to the first direction so as to form a composite sound absorption array.
2. The backing structure for an ultrasonic transducer of claim 1, wherein the first thermally conductive layer comprises a plurality of sets of thermally conductive powder, each set of thermally conductive powder extending from an interior of the backing body toward the heat-dissipating frame to form one or more thermally conductive network paths that transfer heat from the interior of the backing body to the heat-dissipating frame.
3. The backing structure applied to an ultrasonic transducer according to claim 1 or 2, wherein a second heat conducting layer and/or a third heat conducting layer are further provided inside the backing body, the second heat conducting layer is provided between the first sound absorbing cavity group and the second sound absorbing cavity group, and the third heat conducting layer is provided below the second sound absorbing cavity group.
4. A backing structure for an ultrasonic transducer according to claim 2, Each group of the heat conducting powder is in a sheet-shaped form, a granular form, a dendritic form, a needle-shaped form and/or a polyhedral form; the heat conducting powder comprises aluminum oxide powder, silicon carbide powder, aluminum nitride powder, boron nitride powder, magnesium oxide powder, zinc oxide powder and/or silicon nitride powder; the heat dissipation outer frame comprises a metal outer frame, a high heat conduction plastic outer frame and/or a high heat conduction ceramic outer frame.
5. The backing structure for an ultrasonic transducer of claim 1, The first sound absorption cavity and the second sound absorption cavity are columnar cavities, and the extending direction of each columnar cavity is perpendicular to the first direction and parallel to each other; each first sound absorption cavity and each second sound absorption cavity are periodically staggered along the second direction on a projection plane perpendicular to the first direction; The first sound absorption cavities and the second sound absorption cavities are hollow cavities, and the first sound absorption cavities and the second sound absorption cavities are periodically staggered along the second direction and periodically staggered along a third direction on a projection plane perpendicular to the first direction, wherein an included angle which is not 0 DEG is formed between the third direction and the second direction; Or, columnar cavities and hole-shaped cavities are mixed in the first sound absorption cavity group and/or the second sound absorption cavity group.
6. Backing structure for application to an ultrasound transducer according to claim 1, wherein the columnar cavities comprise polygonal prismatic cavities and/or cylindrical cavities.
7. Backing structure for application to an ultrasound transducer according to claim 1, wherein the hole-like cavities comprise polygonal pyramid cavities and/or sphere cavities.
8. The backing structure applied to an ultrasonic transducer according to any one of claims 1, 5 to 7, wherein the interior of the backing body is further provided with a plurality of groups of sound absorbing cavity groups in sequence along the first direction below the second sound absorbing cavity group; Any one sound absorption cavity group comprises a plurality of sound absorption cavities which are sequentially arranged in the second direction, and the sound absorption cavities in any two adjacent sound absorption cavity groups in the first direction are staggered along the second direction on a projection plane perpendicular to the first direction.
9. Backing structure for application to an ultrasonic transducer according to any one of claims 1, 5-7, characterized in that the backing body and each of the first sound absorbing cavities, each of the second sound absorbing cavities are cast by a three-dimensional printing process and/or by a die casting process.
10. An ultrasound transducer comprising a piezoelectric element and a backing structure as claimed in any one of claims 1 to 9 applied to an ultrasound transducer, the piezoelectric element being directly or indirectly connected to an upper surface of the backing body.

Description

Backing structure applied to ultrasonic transducer and ultrasonic transducer with backing structure Technical Field The invention belongs to the technical field of ultrasonic equipment, and particularly relates to a backing structure applied to an ultrasonic transducer and the ultrasonic transducer with the backing structure. Background The ultrasonic transducer is a core component of ultrasonic imaging, treatment, nerve regulation and control and other technologies, the performance of the ultrasonic transducer directly determines the imaging quality, treatment precision and working stability of the system, the backing is used as one of key components of the transducer, and mainly bears the functions of absorbing the acoustic energy of the backward radiation of the piezoelectric element, providing mechanical support for the transducer and effectively leading out the heat generated in the working process, thereby shortening the pulse width, improving the imaging resolution and ensuring the long-term stable working of the ultrasonic transducer. With the development of ultrasonic technology toward miniaturization, high power, wearable and intracavity application, unprecedented stringent requirements are put on a backing, for example, in a wearable imaging regulation dual-mode array ultrasonic transducer, in order to realize accurate nerve regulation and high-quality imaging, the ultrasonic transducer is required to have high energy output and broadband response at a very small size, so that the backing must have very strong sound absorption performance and very high heat dissipation performance at the same time, and in high-resolution endoscopic ultrasonic imaging, in order to realize high-frequency broadband, dense array elements and long-time continuous operation, the transducer is also required to solve the contradiction between heat dissipation and sound absorption in a very small packaging space. However, conventional backing materials are limited in their physical properties, acoustic attenuation coefficient and thermal conductivity tend to be mutually constrained, high sound absorption and high heat dissipation properties are difficult to combine within a limited size, and to obtain sufficient sound absorption, a backing is generally required to have a large thickness, but a bulky backing is in counter to the trend of miniaturization of devices. Disclosure of Invention In order to overcome the defects in the prior art, the invention provides a backing structure applied to an ultrasonic transducer, which comprises a backing main body and a heat dissipation outer frame coated on the side surface of the backing main body, wherein the upper surface of the backing main body is contacted with a piezoelectric interface and is used for receiving incident sound waves; The inside of the back lining main body is provided with a first heat conduction layer, a first sound absorption cavity group and a second sound absorption cavity group in sequence from top to bottom along a first direction vertical to the upper surface; the first heat conduction layer is used for conducting heat of the back lining main body to the heat dissipation outer frame and radiating the heat to the outside through the heat dissipation outer frame; the first sound absorption cavity group comprises a plurality of first sound absorption cavities which are sequentially arranged along a second direction parallel to the upper surface, the second sound absorption cavity group comprises a plurality of second sound absorption cavities which are sequentially arranged along the second direction, and the first sound absorption cavities and the second sound absorption cavities are staggered along the second direction on a projection plane perpendicular to the first direction so as to form a composite sound absorption array. Preferably, the first heat conducting layer comprises a plurality of groups of heat conducting powder, each group of heat conducting powder extends from the inner part of the back lining main body to the heat dissipation outer frame so as to form one or more heat conducting network passages for transferring heat from the inner part of the back lining main body to the heat dissipation outer frame. Further, a second heat conduction layer and/or a third heat conduction layer are/is further arranged in the back lining main body, the second heat conduction layer is arranged between the first sound absorption cavity group and the second sound absorption cavity group, and the third heat conduction layer is arranged below the second sound absorption cavity group. Preferably, each group of the heat conductive powder is in a flake form, a granular form, a dendritic form, a needle form and/or a polyhedral form; the heat conducting powder comprises aluminum oxide powder, silicon carbide powder, aluminum nitride powder, boron nitride powder, magnesium oxide powder, zinc oxide powder and/or silicon nitride powder; the heat dissipation outer frame