CN-122007060-A - Detection, cutting and sorting integrated machine for strain gauge chip and production process

CN122007060ACN 122007060 ACN122007060 ACN 122007060ACN-122007060-A

Abstract

The invention belongs to the technical field of strain gauge chip processing equipment, and particularly relates to a detection, cutting and sorting integrated machine for strain gauge chips and a production process, wherein the integrated machine comprises a feeding device, a detection device, a cutting device and a sorting device which are arranged in a cabinet; the feeding device comprises a rotating assembly and an adsorption assembly, wherein the adsorption assembly is configured to adsorb and position the strain foil wafers, the detection device is configured to measure resistance of each strain foil chip of the strain foil wafers, the strain foil wafers after resistance measurement flow to the cutting device, the cutting device is configured to cut the strain foil wafers, the cut strain foil wafers flow to the sorting device, and the sorting device is configured to sort and adsorb the strain foil chips and discharge the strain foil wafers.

Inventors

LIU JIAYUN
AN HUI

Assignees

广东码清激光智能装备有限公司

Dates

Publication Date: 20260512
Application Date: 20260413

Claims (10)

1. The all-in-one machine for detecting, cutting and sorting the strain gauge chips is characterized by comprising a feeding device, a detecting device, a cutting device and a sorting device which are arranged in a cabinet; The feeding device comprises a rotating assembly and an adsorption assembly, the rotating assembly is rotatably arranged on a platform of the cabinet, the adsorption assembly is fixedly arranged at the top of the rotating assembly, the adsorption assembly is configured to adsorb and position the strain gauge wafer, and the positioned strain gauge wafer flows to the detection device; The detection device comprises a resistance measurement moving module, a resistance measurement probe module and a first camera module, wherein the resistance measurement moving module is configured to drive the resistance measurement probe module, the first camera module is arranged on one side of the resistance measurement probe module, the first camera module is configured to identify a strain gauge chip of a strain gauge wafer, the resistance measurement probe module is configured to measure resistance of each strain gauge chip of the strain gauge wafer, and the strain gauge wafer after resistance measurement flows to the cutting device; The cutting device comprises a cutting moving module and a laser module, wherein the cutting moving module is configured to drive the laser module, the laser module is configured to cut the wafer with the strain gauge, and the wafer with the strain gauge after cutting flows to the sorting device; The sorting device comprises a sorting moving module, a sucker module, a second camera module and a blanking module, wherein the sorting moving module is configured to drive the sucker module, the second camera module is arranged on one side of the sucker module and is configured to identify the strain gauge chips after cutting, the sucker module is configured to sort and adsorb the strain gauge chips, and the blanking module is configured to receive the strain gauge chips after sorting.
2. The integrated machine for detecting, cutting and sorting strain gauge chips according to claim 1, wherein the rotating assembly comprises a turntable and a driving motor, the driving motor is fixedly arranged in the cabinet, the turntable is rotatably arranged on the platform and is in transmission connection with the driving motor, and the detecting device, the cutting device and the sorting device are sequentially arranged along the peripheral surface of the turntable.
3. The all-in-one machine for detecting, cutting and sorting strain gauge chips according to claim 2 is characterized in that a flange mounting hole is formed in the center of the turntable, the adsorption assembly comprises a flange pipe, an air vent plate, an air vent connecting plate, a sucker plate and a sucker mesh plate, the flange pipe is fixedly connected with the driving motor and is located in the center of the turntable, the air vent plate is arranged in alignment with the flange pipe and is located on the upper surface of the turntable, four air vents are formed in the circumferential side face of the air vent plate, the sucker plate is respectively communicated with the air vents through the air vent connecting plate, the sucker mesh plate is arranged at the top of the sucker plate, the sucker plate is provided with an air vent groove, the sucker mesh plate is provided with meshes corresponding to the air vent groove, a negative pressure loop is formed among the flange pipe, the air vent plate, the air vent connecting plate, the flange pipe and the sucker mesh plate, and the flange pipe are connected with a negative pressure generating device, and a negative pressure adsorption area is formed at the sucker mesh plate to adsorb strain gauge wafers.
4. The all-in-one machine for detecting, cutting and sorting strain gauge chips of claim 3, wherein the resistance measuring moving module comprises a resistance measuring X-axis linear module, a resistance measuring Y-axis linear module, a resistance measuring Z-axis linear module and a resistance measuring rotary table assembly, the resistance measuring X-axis linear module is fixedly arranged on the platform through a resistance measuring module support, the resistance measuring Y-axis linear module is in sliding connection with the resistance measuring X-axis linear module, the resistance measuring Z-axis linear module is in sliding connection with the resistance measuring Y-axis linear module, the resistance measuring rotary table assembly is arranged on the resistance measuring Z-axis linear module in a sliding manner, and the resistance measuring probe module is arranged below the resistance measuring rotary table assembly.
5. The all-in-one machine for detecting, cutting and sorting strain gauge chips as claimed in claim 4, wherein the cutting moving module comprises a cutting X-axis linear module, a cutting Y-axis linear module and a cutting Z-axis linear module, the cutting X-axis linear module is fixedly arranged on the platform through a cutting module support, the cutting Y-axis linear module is in sliding connection with the cutting X-axis linear module, the cutting Z-axis linear module is in sliding connection with the cutting Y-axis linear module, and the laser module is in sliding connection with the cutting Z-axis linear module; and/or the cutting device further comprises a cutting dust hood and a light source hood, wherein the cutting dust hood is arranged above the strain gauge wafer to be cut through the cantilever plate as a hood, the cutting dust hood is communicated with dust collection equipment, and the light source hood is arranged at the top of the cutting dust hood.
6. The all-in-one machine for detecting, cutting and sorting strain gauge chips according to claim 4, wherein the resistance testing turntable assembly comprises a hollow turntable, a turntable module motor and a turntable mounting flange, the hollow turntable is fixedly mounted on a mounting slide plate of the resistance testing Z-axis linear module through a turntable mounting plate, the turntable module motor is in transmission connection with the hollow turntable, and the resistance testing probe module is connected with the hollow turntable through the turntable mounting flange so as to enable the resistance testing probe module to rotate along a rotation shaft of the hollow turntable; the first camera module comprises a first camera bracket, a first industrial camera and a resistance measurement positioning light source, the first industrial camera is fixedly arranged on one side of the turntable mounting flange through the first camera bracket, and the resistance measurement positioning light source is arranged below the first industrial camera through a light source mounting plate; The resistance testing probe module comprises a resistance testing probe bakelite seat and a resistance testing probe box cover plate, wherein the resistance testing probe bakelite seat is arranged at the bottom of the turntable mounting flange through the resistance testing probe box cover plate, the resistance testing probe box cover plate is provided with a wire inserting groove, the resistance testing probe bakelite seat is provided with a plurality of mounting holes and probe units mounted in the mounting holes, and the probe units are connected with the resistance testing wiring board; the hollow turntable, the turntable mounting flange and the resistance measurement probe box cover plate form a plug wire channel.
7. The all-in-one machine for detecting, cutting and sorting strain gauge chips as claimed in claim 3, wherein the sorting movement module comprises a sorting X-axis movement module, a sorting Y-axis movement module, a sorting Z-axis movement module and a suction cup rotation module for driving the suction cup module to realize three-dimensional movement and driving the suction cup module to rotate around an axis perpendicular to the turntable plane; The sucker module comprises a sucker rotating module, a sucker rotating plate, a sucker group and a sucker control valve assembly, wherein the sucker rotating module is arranged on an installation sliding block of the sorting Z-axis moving module through a turntable installation plate, the sucker group is arranged at the bottom of the sucker rotating module through the sucker rotating plate, and the sucker control valve assembly is arranged on the sorting Z-axis moving module and is used for controlling the starting and stopping of the sucker group; The second camera module comprises a second industrial camera and a second camera light source, the second industrial camera is arranged on the other side of the sucker rotating plate, and the second camera light source is arranged below the second industrial camera.
8. The all-in-one machine for detecting, cutting and sorting foil gauge chips of claim 2, wherein the blanking module comprises a blanking bin, an empty-load tray stacking assembly, a full-load tray stacking assembly, a transferring assembly and a tray driving assembly, the blanking bin is slidably arranged on the cabinet through a bin sliding rail, a jacking cylinder is arranged on the bin sliding rail and used for fixing the blanking bin, the empty-load tray stacking assembly and the full-load tray stacking assembly are sequentially arranged at the end part of the blanking bin and used for containing empty-load trays without foil gauge chips and full-load trays with foil gauge chips, the transferring assembly is slidably arranged in the blanking bin, the tray driving assembly is in transmission connection with the transferring assembly and used for driving the transferring assembly to take out the empty-load tray from the empty-load tray stacking assembly and transfer the empty-load tray to the blanking bin, or driving the transferring assembly to transfer the full-load tray stacking assembly from the blanking bin of the blanking bin.
9. The all-in-one machine for detecting, cutting and sorting strain gauge chips of claim 8, wherein the empty tray stacking assembly comprises an empty tray rack fixedly provided to the discharging bin, empty tray supporting forks provided at opposite sides of a bottom of the empty tray rack, and driving cylinders through which the empty tray supporting forks are driven, respectively, the empty tray supporting forks being configured to retract when the transfer assembly carries an empty tray at the bottom, and to reset to support an empty tray at the sub-bottom after the empty tray at the bottom descends by a preset height; The full-load disc stacking assembly comprises a full-load disc material frame and full-load disc baffles, wherein the full-load disc material frame is fixedly arranged on the discharging bin, the full-load disc baffles are arranged on two opposite sides of the bottom of the full-load disc material frame, the full-load disc baffles are unidirectional baffles which are turned upwards, and the full-load disc baffles are configured to receive full-load discs lifted by the transferring assembly; The transfer assembly comprises a first mounting plate, a second mounting plate, a lifting plate, lifting cylinders and lifting rods, wherein the first mounting plate is arranged on a sliding rail of the blanking bin in a sliding mode, the second mounting plate is arranged below the first mounting plate in a hanging mode through a connecting rod, the lifting cylinders are arranged on the second mounting plate, driving ends of the lifting cylinders are connected with the lifting plate, the lifting rods are arranged on the lifting plates and penetrate through the first mounting plate and the second mounting plate, and the lifting cylinders are configured to drive a plurality of lifting rods to synchronously lift and used for placing a carrying disc on the first mounting plate or lifting the carrying disc from the first mounting plate.
10. A production process, which is applicable to the detection, cutting and sorting integrated machine for strain gauge chips according to any one of claims 1 to 9, comprising: Adsorbing and positioning a strain gauge wafer through the feeding device, and transferring the strain gauge wafer to the detection device; The resistance measurement moving module is controlled to drive the resistance measurement probe module to sequentially move to each strain gauge chip for contact resistance measurement, and the strain gauge wafer flows to the cutting device through the rotating assembly; cutting the strain gauge wafer through the cutting device, and transferring the cut strain gauge wafer to the sorting device through the rotating assembly; The cut strain foil chips are identified through the sorting device, and the strain foil chips are sorted and adsorbed through the sucker module configuration; and receiving the sorted strain gauge chips through the blanking module, and rotating the rotating assembly to an initial position for receiving a new strain gauge wafer.

Description

Detection, cutting and sorting integrated machine for strain gauge chip and production process Technical Field The invention belongs to the technical field of strain gauge chip processing equipment, and particularly relates to a detection, cutting and sorting integrated machine for a strain gauge chip and a production process. Background The strain gauge chip is used as a precise sensing core component, and the manufacturing process of the strain gauge chip relates to key links such as wafer feeding, resistance detection, laser cutting, finished chip sorting and the like, and the processing quality of each link directly determines the performance stability and the production yield of the sensing component. The traditional processing mode generally adopts independent equipment such as probe station, cutting machine, sorter to operate step by step, leads to wafer and chip to need frequently transport between different equipment, and obvious breakpoint exists in process connection, and the continuity of production flow is serious not enough, and whole machining efficiency is difficult to adapt to the large-scale volume production demand. Because the strain gauge chip is small in size and precise in structure, each independent device lacks a uniform high-precision coordinate system and a cooperative control mechanism, a wafer generates obvious accumulated errors in the repeated feeding and positioning processes, and the technical problems of poor contact between a resistance measuring probe and the chip, offset of a laser cutting path, sorting, picking, positioning and misplacement and the like are easily caused, so that the processing precision is reduced and the consistency of products is fluctuated. The existing detection equipment is generally not provided with a special probe structure for measuring the four-end resistance of the adaptive strain foil chip, the detection reliability is limited, and meanwhile, the traditional distributed operation mode relies on manual intervention, so that the existing detection equipment has the inherent defects of low efficiency, insufficient precision, high loss, weak automation degree and the like. In view of the above, there is a need for an integrated solution that integrates multiple critical processes and enables fully automated precision machining. Disclosure of Invention In order to overcome the defects of the prior art, the invention provides the detection, cutting and sorting integrated machine for the strain gauge chip and the production process, and the integrated machine has the advantages of improving the processing efficiency of the strain gauge chip, reducing the accumulated error and improving the consistency and the yield of products. The integrated machine for detecting, cutting and sorting the strain gauge chips comprises a feeding device, a detecting device, a cutting device and a sorting device which are arranged in a cabinet; The feeding device comprises a rotating assembly and an adsorption assembly, the rotating assembly is rotatably arranged on a platform of the cabinet, the adsorption assembly is fixedly arranged at the top of the rotating assembly and is configured to adsorb and position the wafer with the strain gauge, and the wafer with the strain gauge after being positioned flows to the detection device; The detection device comprises a resistance measurement moving module, a resistance measurement probe module and a first camera module, wherein the resistance measurement moving module is configured to drive the resistance measurement probe module, the first camera module is arranged on one side of the resistance measurement probe module, the first camera module is configured to identify the strain gauge chips of the strain gauge wafer, the resistance measurement probe module is configured to measure resistance of each strain gauge chip of the strain gauge wafer, and the strain gauge wafer after resistance measurement flows to the cutting device; The cutting device comprises a cutting moving module and a laser module, wherein the cutting moving module is configured to drive the laser module, the laser module is configured to cut the wafer with the strain gauge, and the cut wafer with the strain gauge flows to the sorting device; The sorting device comprises a sorting moving module, a sucker module, a second camera module and a blanking module, wherein the sorting moving module is configured to drive the sucker module, the second camera module is arranged on one side of the sucker module, the second camera module is configured to identify the cut strain gauge chips, the sucker module is configured to sort and adsorb the strain gauge chips, and the blanking module is configured to receive the sorted strain gauge chips. The application further provides a rotary assembly which comprises a rotary table and a driving motor, wherein the driving motor is fixedly arranged in the cabinet, the rotary table is rotatably arranged on the platform and is