CN-122007200-A - Preparation method of composite board with excellent interface bonding

CN122007200ACN 122007200 ACN122007200 ACN 122007200ACN-122007200-A

Abstract

The application provides a preparation method of a composite board with excellent interface bonding, which comprises the steps of blank surface treatment, assembly sealing plate, welding, vacuumizing, heating, rolling, cooling, heat treatment and board separation, wherein in the assembly sealing plate step, a composite blank is obtained by placing blanks according to the sequence of a base material, a coating material and a base material, in the rolling step, if t cp /t sp is more than or equal to 4, the reduction of a rough rolling single pass is more than or equal to 30mm, the rough rolling pass is more than or equal to 1, the reduction of three single passes before finish rolling is more than or equal to 25mm, the finish rolling pass is less than or equal to 7, if t cp /t sp is less than or equal to 4, the reduction of the rough rolling single pass is more than or equal to 35mm, the reduction of the finish rolling single pass is less than or equal to 25mm, the finish rolling pass is less than or equal to 7, the total compression ratio CR is more than or equal to 7, the cooling is controlled after rolling, t cp is the target thickness of the base material in the composite board, and t sp is the target thickness of the coating material in the composite board, and the unit is mm. The rolling reduction is controlled by the target proportion of the base material and the coating material in the composite board, so that the combination of different thickness ratios is promoted.

Inventors

SHAO CHUNJUAN
ZHEN FAN
MA HAN
QU JINBO
ZHAO RONGGUI
ZHU HUI
CHENG XIAOBO

Assignees

江苏省沙钢钢铁研究院有限公司
江苏沙钢钢铁有限公司
江苏沙钢集团有限公司
江苏沙通金属复合材料科技有限公司

Dates

Publication Date: 20260512
Application Date: 20260413

Claims (15)

1. A preparation method of a composite board with excellent interface bonding is characterized by comprising the following processes of blank surface treatment, assembly and closing plate, welding, vacuumizing, heating, rolling, cooling, heat treatment and board separation which are sequentially carried out, In the step of assembling and sealing plates, the blanks are placed according to the sequence of base materials, covering materials and base materials, and the composite blanks are obtained through combination; In the rolling step, if t cp /t sp is more than or equal to 4, the single pass reduction of rough rolling is more than or equal to 30mm, the single pass reduction of rough rolling is more than or equal to 1, the single pass reduction of three times before finish rolling is more than or equal to 25mm, and the finish rolling pass is less than or equal to 7; If t cp /t sp is less than 4, the reduction of the rough rolling single pass is more than or equal to 35mm, the rough rolling single pass is more than or equal to 3, the reduction of the finish rolling single pass is less than or equal to 25mm, the finish rolling pass is less than or equal to 7, the total compression ratio CR is more than or equal to 7, and the controlled cooling is performed after rolling; t cp is the target thickness of the substrate in the composite board, t sp is the target thickness of the cladding in the composite board, and the units are all mm.
2. The method for manufacturing the composite board with excellent interface bonding according to claim 1, wherein in the step of assembling and sealing the board, four strips are placed around the blank of the covering material, the material of the strips is consistent with that of the base material, the inner sides of the strips are tightly attached to the covering material, and round holes are formed in the strips; In the welding step, welding is carried out between the strake and the base material blank, wherein the welding process comprises the steps of enabling the welding wire to extend 15-20 mm, enabling the welding current to be 300-750A, enabling the welding voltage to be 20-50V and enabling the welding speed to be 300-500 mm/min.
3. The method for manufacturing a composite board excellent in interface bonding according to claim 2, wherein the preheating is performed at 180-220 ℃ before welding, the inter-channel temperature is controlled to be 100-180 ℃ during welding, and the composite board is naturally cooled to room temperature after welding.
4. The method for manufacturing the composite board excellent in interface bonding according to claim 2, wherein after welding, the cavity between the four side bars and the two base material blanks is vacuumized through the round hole until the pressure is less than or equal to 10 -4 torr, the pressure maintaining time is 2V-4V, the unit is h, the unit is the total volume of the two-layer covering material blanks, the unit is m 3 , and the round hole is sealed after the pressure maintaining is finished.
5. The method for producing a composite plate excellent in interface bonding according to claim 1, wherein in the step of surface treatment of the blank, one side of the base material blank is polished until the surface roughness Ra of the blank is not more than 30 μm, and both sides of the cover material blank are polished until the surface roughness Ra of the blank is not more than 1 μm.
6. The method for producing a composite plate excellent in interface bonding according to claim 1, wherein in the heat treatment step, the composite plate large plate obtained after rolling and cooling is heat treated by normalizing, normalizing water-cooling matching tempering or quenching matching tempering, In the normalizing heat treatment, the normalizing temperature is T N +30~T N +50 ℃, and the normalizing water cooling final cooling temperature is T NC +100~T NC +150 ℃; In the quenching heat treatment, the quenching temperature is T N +30~T N +50 ℃, In the tempering heat treatment, the tempering temperature is T T -10~T T +10 ℃, T N =900-203 -15[Ni]-45[Si]+104[V]+31.5[Mo]+t f , T NC =650-423[C]-30[Mn]-20[Si]-12[Cr]-18[Ni]-7[Mo]-t f , T T = 700-0.16H+7CE, CE = [ C ] + [ Mn ]/6+ ([ Cr ] + [ Mo ] + [ V ])/5+ [ Ni ]/15, [ C ], [ Mn ], [ Si ], [ Cr ], [ Ni ], [ Mo ], [ V ] are respectively 100 times of the mass percent of the corresponding elements in the substrate, T f is the thickness of the large composite plate, the unit is mm, and H is the maximum value of Brinell hardness required by the strength level of the substrate steel plate in the composite plate.
7. The method for producing a composite board excellent in interface bonding according to claim 6, wherein the chemical composition of the base material blank comprises ：C：0.10~0.20%,Si：0.15~0.35%,Mn：0.6~1.7%,Cr≤0.30%,Ni≤0.30%,Mo≤0.20%,Nb≤0.030%,Ti≤0.03%,Al：0.02~0.06%,V≤0.040%,P≤0.020%,S≤0.005%,CE：0.22~0.50, by mass percent of the balance iron and unavoidable impurities.
8. The method for producing a composite board excellent in interface bonding according to claim 7, wherein the chemical composition of the base material blank comprises ：C：0.14~0.17%,Si：0.15~0.25%,Mn：0.60~1.00%,Nb≤0.020%,Cr≤0.30,Ti≤0.030%,Al：0.020~0.050%,P≤0.020%,S≤0.005%,CE：0.22~0.32, by mass percent of the balance iron and unavoidable impurities; and (3) carrying out normalizing heat treatment, wherein the normalizing heat preservation coefficient is 1.5-1.7 min/mm.
9. The method for manufacturing the composite board with excellent interface bonding according to claim 8, wherein in the step of assembling and sealing the board, four strips are placed around the blank of the covering material, the material of the strips is consistent with that of the base material, the inner sides of the strips are tightly attached to the covering material, and round holes are formed in the strips; in the welding step, welding is carried out between the strake and the base material blank, wherein the welding process comprises the steps of enabling the welding wire to extend out by 15-20 mm, enabling the welding current to be 300-500A, enabling the welding voltage to be 20-40V and enabling the welding speed to be 300-400 mm/min.
10. The method for producing a composite board excellent in interface bonding according to claim 7, wherein the chemical composition of the base material blank comprises ：C：0.14~0.18%,Si：0.15~0.25%,Mn：1.30~1.60%,Nb≤0.030%,Ti：0.010~0.020%,Al：0.020~0.050%,P≤0.015%,S≤0.005%,CE：0.35~0.50, by mass percent of the balance iron and unavoidable impurities; and (3) adopting normalizing water cold and hot treatment, wherein the normalizing heat preservation coefficient is 1.5-1.7 min/mm.
11. The method for manufacturing the composite board with excellent interface bonding according to claim 10, wherein in the step of assembling and sealing the board, four strips are placed around the blank of the covering material, the material of the strips is consistent with that of the base material, the inner sides of the strips are tightly attached to the covering material, and round holes are formed in the strips; In the welding step, welding is carried out between the strake and the base material blank, wherein the welding process comprises the steps of enabling the welding wire to extend 15-20 mm, enabling the welding current to be 400-600A, enabling the welding voltage to be 25-45V and enabling the welding speed to be 300-450 mm/min.
12. The method for producing a composite board excellent in interface bonding according to claim 7, wherein the chemical composition of the base material blank comprises ：C：0.14~0.20%,Si：0.25~0.35%,Mn：1.30~1.60%,Nb：0.015~0.030%,Cr：0.10~0.20%,Ti：0.010~0.020%,V≤0.020%,Al：0.020~0.060%,P≤0.013%,S≤0.003%,CE：0.40~0.45, by mass percent of the balance iron and unavoidable impurities; And carrying out heat treatment by adopting normalizing water cooling and tempering, wherein the normalizing heat preservation coefficient is 1.5-1.7 min/mm, and the tempering heat preservation coefficient is 2.8-3.2 min/mm.
13. The method for manufacturing the composite board with excellent interface bonding according to claim 12, wherein in the step of assembling and sealing the board, four strips are placed around the blank of the covering material, the material of the strips is consistent with that of the base material, the inner sides of the strips are tightly attached to the covering material, and round holes are formed in the strips; In the welding step, welding is carried out between the strake and the base material blank, wherein the welding process comprises the steps of enabling a welding wire to extend 15-20 mm, enabling welding current to be 500-700A, enabling welding voltage to be 30-50V and enabling welding speed to be 300-500 mm/min.
14. The method for producing a composite board excellent in interface bonding according to claim 7, wherein the chemical composition of the base material blank comprises ：C：0.10~0.15%,Si：0.15~0.35%,Mn：1.10~1.70%,Nb≤0.02%,Cr：0.10~0.20%,Ti≤0.030%,V≤0.040%,Ni：0.10~0.30%,Mo≤0.20%,Al：0.020~0.060%,P≤0.013%,S≤0.003%,CE：0.30~0.50, by mass percent of the balance iron and unavoidable impurities; And carrying out heat treatment by adopting quenching and tempering, wherein the normalizing heat preservation coefficient is 1.5-1.7 min/mm, and the tempering heat preservation coefficient is 2.8-3.2 min/mm.
15. The method for manufacturing the composite board with excellent interface bonding according to claim 14, wherein in the step of assembling and sealing the board, four strips are placed around the blank of the covering material, the material of the strips is consistent with that of the base material, the inner sides of the strips are tightly attached to the covering material, and round holes are formed in the strips; In the welding step, welding is carried out between the strake and the base material blank, wherein the welding process comprises the steps of enabling the welding wire to extend 15-20 mm, enabling the welding current to be 550-750A, enabling the welding voltage to be 35-50V and enabling the welding speed to be 300-500 mm/min.

Description

Preparation method of composite board with excellent interface bonding Technical Field The application relates to the technical field of composite board preparation, in particular to a preparation method of a composite board with excellent interface bonding. Background The stainless steel composite board is a bimetal material formed by compounding stainless steel coating materials and carbon steel base materials through a specific process, has the advantages of corrosion resistance of stainless steel, mechanical properties of carbon steel and cost, and is widely applied to the fields of petrochemical industry, ocean engineering, food medicine and the like. However, stainless steel and carbon steel have significant differences in physicochemical properties, resulting in interfacial bonding becoming a key technical bottleneck limiting composite board performance. The linear expansion coefficients of stainless steel and carbon steel have large difference, and thermal stress is easy to generate in the thermal processing and service processes, so that the interface bonding strength is reduced and even layering occurs. In the traditional rolling composite process, interface bonding mainly depends on mechanical occlusion and atomic diffusion, but the bonding strength is difficult to meet the use requirement under severe working conditions. Disclosure of Invention The application aims to provide a preparation method of a composite board with excellent interface bonding, which solves the problem that the interface bonding strength in the prior art cannot meet the use requirement. In order to achieve one of the above objects, an embodiment of the present application provides a method for preparing a composite board excellent in interface bonding, the method comprising sequentially performing a blank surface treatment, a blank sealing plate, welding, vacuumizing, heating, rolling, cooling, heat treatment, and a board separation process flow, wherein, In the step of assembling and sealing plates, the blanks are placed according to the sequence of base materials, covering materials and base materials, and the composite blanks are obtained through combination; In the rolling step, if t cp/tsp is more than or equal to 4, the single pass reduction of rough rolling is more than or equal to 30mm, the single pass reduction of rough rolling is more than or equal to 1, the single pass reduction of three times before finish rolling is more than or equal to 25mm, and the finish rolling pass is less than or equal to 7; if t cp/tsp is less than 4, the reduction of the rough rolling single pass is more than or equal to 35mm, the rough rolling single pass is more than or equal to 3, the reduction of the finish rolling single pass is less than or equal to 25mm, the finish rolling pass is less than or equal to 7, the total compression ratio CR is more than or equal to 7, and the controlled cooling is performed after rolling; t cp is the target thickness of the substrate in the composite board, t sp is the target thickness of the cladding in the composite board, and the units are all mm. As a further improvement of an embodiment of the application, in the step of assembling and sealing plates, four side strips are placed around the blank of the covering material, the material of the side strips is consistent with that of the base material, the inner sides of the side strips are tightly attached to the covering material, and round holes are formed in the side strips; In the welding step, welding is carried out between the strake and the base material blank, wherein the welding process comprises the steps of enabling the welding wire to extend 15-20 mm, enabling the welding current to be 300-750A, enabling the welding voltage to be 20-50V and enabling the welding speed to be 300-500 mm/min. As a further improvement of an embodiment of the application, preheating is carried out at 180-220 ℃ before welding, the temperature between channels is controlled to be 100-180 ℃ during welding, and the welding is naturally cooled to room temperature. As a further improvement of an embodiment of the application, after welding, the cavities between the four edge strips and the two base material blanks are vacuumized through the round holes until the pressure is less than or equal to 10 -4 torr, the pressure maintaining time is 2V-4V, the unit is h, the unit is the total volume of the two layers of the covering material blanks, the unit is m 3, and the round holes are sealed after the pressure maintaining is finished. As a further improvement of an embodiment of the application, in the blank surface treatment step, one side of the base material blank is polished until the surface roughness Ra of the blank is less than or equal to 30 mu m, and the two sides of the covering material blank are polished until the surface roughness Ra of the blank is less than or equal to 1 mu m. As a further improvement of an embodiment of the present application, in the he