CN-122007201-A - Preparation method of composite board with excellent interface bonding

CN122007201ACN 122007201 ACN122007201 ACN 122007201ACN-122007201-A

Abstract

The application provides a preparation method of a composite board with excellent interface bonding, which comprises the steps of polishing one side surface of a base material blank to have a roughness of 0.02T+0.05t+0.5CR-5-0.02T+0.05t+0.5CR, wherein T is a preset heat treatment temperature unit of DEG C, T is a total heat treatment time unit of min, CR is a preset total compression ratio, T takes the highest value if a plurality of heat treatments are needed, polishing one side surface of the base material blank to have a wave shape if the composite board is processed and used at a temperature of 200 ℃, the vertical distance between wave peaks and wave troughs is 0.1T-85-0.1T-80, the unit is mm, and the horizontal distance between wave peaks is 100-12.5 lnT-110-12.5 lnT, and the unit is cm. And carrying out different treatments on the surface of the base material blank through different processing using temperatures so as to ensure the bonding strength of the base material and the coating.

Inventors

SHAO CHUNJUAN
ZHEN FAN
MA HAN
QU JINBO
ZHAO RONGGUI
ZHU HUI
CHENG XIAOBO

Assignees

江苏省沙钢钢铁研究院有限公司
江苏沙钢钢铁有限公司
江苏沙钢集团有限公司
江苏沙通金属复合材料科技有限公司

Dates

Publication Date: 20260512
Application Date: 20260413

Claims (11)

1. A preparation method of a composite board with excellent interface bonding is characterized by comprising the following processes of blank surface treatment, blank assembly sealing plate, welding, vacuumizing, heating, rolling, cooling, heat treatment and board separation which are sequentially carried out, In the surface treatment step, if the processing and using temperature of the composite board is less than or equal to 200 ℃, polishing one side surface of the base material blank until the roughness Ra is 0.02T+0.05t+0.5CR-5 is less than or equal to 0.02T+0.05t+0.5CR, wherein T is the preset heat treatment temperature, the unit is the temperature, T is the total heat treatment time, the unit is min, CR is the preset total compression ratio, and if a plurality of heat treatments are needed, T takes the highest value of the preset heat treatment temperatures; If the processing and using temperature of the composite board is more than 200 ℃, polishing one side surface of the base material blank into a wave shape, wherein the vertical distance lambda 1 between wave crests and wave troughs is more than or equal to 0.1T-85 and less than or equal to 0.1T-80, the unit is mm, the horizontal distance lambda 2 between wave crests and wave crests is more than or equal to 100-12.5lnT and less than or equal to 2 and less than or equal to 110-12.5lnT, the unit is cm, the vertical direction is the thickness direction of the base material blank, and the horizontal direction is vertical to the vertical direction and is consistent with the extending direction of the wave.
2. The method for producing a composite board excellent in interface bonding according to claim 1, wherein in the surface treatment step, both sides of a clad material blank are polished to a surface roughness Ra of 1 μm or less, and then placed in the order of substrate-clad material-substrate, and combined to obtain a composite board; In the step of assembling and sealing plates, four edge strips are placed around the blank of the covering material, the material of the edge strips is consistent with that of the base material, the inner sides of the edge strips are tightly attached to the covering material, and vacuum holes are formed in the edge strips; In the welding step, welding is carried out between the strake and the base material blank, wherein the welding process comprises the steps of enabling the welding wire to extend 15-20 mm, enabling the welding current to be 300-750A, enabling the welding voltage to be 20-50V and enabling the welding speed to be 300-500 mm/min.
3. The method for manufacturing a composite board excellent in interface bonding according to claim 2, wherein the preheating is performed at 180-220 ℃ before welding, the inter-channel temperature is controlled to be 100-180 ℃ during welding, and the composite board is naturally cooled to room temperature after welding.
4. The method for manufacturing the composite board excellent in interface bonding according to claim 2, wherein in the step of vacuumizing, after welding is completed, vacuumizing is carried out on the cavities between the four edge strips and the two base material blanks through vacuum holes until the pressure is less than or equal to 10 -4 torr, the pressure maintaining time is 2V-4V, the unit is h, the unit is m 3 , and the vacuum holes are sealed after the pressure maintaining is completed.
5. The method for producing a composite plate excellent in interface bonding according to claim 1, wherein in the heat treatment step, the composite plate large plate obtained after rolling and cooling is heat treated by normalizing, normalizing water-cooling matching tempering or quenching matching tempering, In the normalizing heat treatment, the normalizing temperature is T N +30~T N +50 ℃, and the normalizing water cooling final cooling temperature is T NC +100~T NC +150 ℃; in the quenching heat treatment, the quenching temperature is T N +30~T N +50 ℃, In the tempering heat treatment, the tempering temperature is T T -10~T T +10 ℃, T N =900-203 -15[Ni]-45[Si]+104[V]+31.5[Mo]+t f , T NC =650-423[C]-30[Mn]-20[Si]-12[Cr]-18[Ni]-7[Mo]-t f , T T = 700-0.16H+7CE, CE = [ C ] + [ Mn ]/6+ ([ Cr ] + [ Mo ] + [ V ])/5+ [ Ni ]/15, [ C ], [ Mn ], [ Si ], [ Cr ], [ Ni ], [ Mo ], [ V ] are respectively 100 times of the mass percent of the corresponding elements in the substrate, T f is the thickness of the large composite board in mm, and the maximum value of Brinell hardness required by the strength grade of the substrate steel board in the H composite board.
6. The method for preparing the composite board with excellent interface bonding according to claim 5, wherein the heat preservation coefficient of normalizing and quenching heat treatment is 1.5-1.7 min/mm, and the tempering heat preservation coefficient is 2.8-3.2 min/mm.
7. The method for producing a composite plate excellent in interface bonding according to claim 2, wherein the chemical composition of the base material blank comprises ：C：0.10~0.20%,Si：0.15~0.35%,Mn：0.6~1.7%,Cr≤0.30%,Ni≤0.30%,Mo≤0.20%,Nb≤0.030%,Ti≤0.03%,Al：0.02~0.060%,V≤0.040%,P≤0.020%,S≤0.005%,CE：0.22~0.50,, the balance being iron and unavoidable impurities in mass%, wherein ce= [ C ] + [ Mn ]/6+ ([ Cr ] + [ Mo ] + [ V ])/5+ [ Ni ]/15, [ C ], [ Mn ], [ Cr ], [ Mo ], [ V ], [ Ni ] is 100 times the mass percentage of the corresponding element in the base material blank, respectively.
8. The method for producing a composite board excellent in interface bonding according to claim 7, wherein the chemical composition of the base material blank comprises ：C：0.14~0.17%,Si：0.15~0.25%,Mn：0.60~1.00%,Nb≤0.020%,Cr≤0.30,Ti≤0.030%,Al：0.020~0.050%,P≤0.020%,S≤0.005%,CE：0.22~0.32, by mass percent of the balance iron and unavoidable impurities; in the welding step, welding is carried out between the strake and the base material blank, wherein the welding process comprises the steps of enabling the welding wire to extend out by 15-20 mm, enabling the welding current to be 300-500A, enabling the welding voltage to be 20-40V and enabling the welding speed to be 300-400 mm/min.
9. The method for producing a composite board excellent in interface bonding according to claim 7, wherein the chemical composition of the base material blank comprises ：C：0.14~0.18%,Si：0.15~0.25%,Mn：1.30~1.60%,Nb≤0.030%,Ti：0.010~0.020%,Al：0.020~0.050%,P≤0.015%,S≤0.005%,CE：0.35~0.50, by mass percent of the balance iron and unavoidable impurities; In the welding step, welding is carried out between the strake and the base material blank, wherein the welding process comprises the steps of enabling the welding wire to extend 15-20 mm, enabling the welding current to be 400-600A, enabling the welding voltage to be 25-45V and enabling the welding speed to be 300-450 mm/min.
10. The method for producing a composite board excellent in interface bonding according to claim 7, wherein the chemical composition of the base material blank comprises ：C：0.14~0.20%,Si：0.25~0.35%,Mn：1.30~1.60%,Nb：0.015~0.030%,Cr：0.10~0.20%,Ti：0.010~0.020%,V≤0.020%,Al：0.020~0.060%,P≤0.013%,S≤0.003%,CE：0.40~0.45, by mass percent of the balance iron and unavoidable impurities; In the welding step, welding is carried out between the strake and the base material blank, wherein the welding process comprises the steps of enabling a welding wire to extend 15-20 mm, enabling welding current to be 500-700A, enabling welding voltage to be 30-50V and enabling welding speed to be 300-500 mm/min.
11. The method for producing a composite board excellent in interface bonding according to claim 7, wherein the chemical composition of the base material blank comprises ：C：0.10~0.15%,Si：0.15~0.35%,Mn：1.10~1.70%,Nb≤0.02%,Cr：0.10~0.20%,Ti≤0.030%,V≤0.040%,Ni：0.10~0.30%,Mo≤0.20%,Al：0.020~0.060%,P≤0.013%,S≤0.003%,CE：0.30~0.50, by mass percent of the balance iron and unavoidable impurities; In the welding step, welding is carried out between the strake and the base material blank, wherein the welding process comprises the steps of enabling the welding wire to extend 15-20 mm, enabling the welding current to be 550-750A, enabling the welding voltage to be 35-50V and enabling the welding speed to be 300-500 mm/min.

Description

Preparation method of composite board with excellent interface bonding Technical Field The application relates to the technical field of composite board preparation, in particular to a preparation method of a composite board with excellent interface bonding. Background At present, the composite board prepared by adopting a hot rolling method has excellent shear strength, generally up to 210MPa, and part of the shear strength can even exceed 300MPa. However, for the heat-treated composite board, atoms can continuously diffuse in the high-temperature heat preservation process, so that two key changes are caused, namely, the width of a decarburized layer is increased, the decarburized layer belongs to a weak bonding area, the wider the decarburized layer is, the more easily the composite board is cracked from the decarburized layer, the interface hardness is increased, the hardness of the position is suddenly increased due to the existence of a brittle-hard phase at the bonding interface, and the relative shear strength of the brittle-hard phase is obviously adversely affected. These two variations eventually severely deteriorate the shear strength of the composite panel. Disclosure of Invention The application aims to provide a preparation method of a composite board with excellent interface bonding, which solves the problem that the interface bonding strength under the high temperature condition in the prior art cannot meet the use requirement. In order to achieve one of the above objects, an embodiment of the present application provides a method for preparing a composite board with excellent interfacial bonding, comprising sequentially performing blank surface treatment, assembly sealing plate, welding, vacuumizing, heating, rolling, cooling, heat treatment, and board separation processes, wherein, In the surface treatment step, if the processing and using temperature of the composite board is less than or equal to 200 ℃, polishing one side surface of the base material blank until the roughness Ra is 0.02T+0.05t+0.5CR-5 is less than or equal to 0.02T+0.05t+0.5CR, wherein T is the preset heat treatment temperature, the unit is the temperature, T is the total heat treatment time, the unit is min, CR is the preset total compression ratio, and if a plurality of heat treatments are needed, T takes the highest value of the preset heat treatment temperatures; If the processing and using temperature of the composite board is more than 200 ℃, polishing one side surface of the base material blank into a wave shape, wherein the vertical distance lambda 1 between wave crests and wave troughs is more than or equal to 0.1T-85 and less than or equal to 0.1T-80, the unit is mm, the horizontal distance lambda 2 between wave crests and wave crests is more than or equal to 100-12.5lnT and less than or equal to 2 and less than or equal to 110-12.5lnT, the unit is cm, the vertical direction is the thickness direction of the base material blank, and the horizontal direction is vertical to the vertical direction and is consistent with the extending direction of the wave. In one embodiment of the application, in the surface treatment step, the two sides of the covering material blank are polished until the surface roughness Ra of the blank is less than or equal to 1 mu m, and then the blank is placed in the sequence of base material-covering material-base material, and the composite blank is obtained by combination; In the step of assembling and sealing plates, four edge strips are placed around the blank of the covering material, the material of the edge strips is consistent with that of the base material, the inner sides of the edge strips are tightly attached to the covering material, and vacuum holes are formed in the edge strips; In the welding step, welding is carried out between the strake and the base material blank, wherein the welding process comprises the steps of enabling the welding wire to extend 15-20 mm, enabling the welding current to be 300-750A, enabling the welding voltage to be 20-50V and enabling the welding speed to be 300-500 mm/min. In one embodiment of the application, preheating is carried out at 180-220 ℃ before welding, the temperature between channels is controlled to be 100-180 ℃ during welding, and the welding is naturally cooled to room temperature. In one embodiment of the application, in the vacuumizing step, after welding, vacuumizing is carried out on the cavities between the four side strips and the two base material blanks through the vacuum holes until the pressure is less than or equal to 10 -4 torr, the pressure maintaining time is 2V-4V, the unit is h, the unit is m 3, and the vacuum holes are sealed after the pressure maintaining is finished. In one embodiment of the application, in the heat treatment step, the large composite board obtained after rolling and cooling is subjected to heat treatment by adopting normalizing, normalizing water cooling matching tempering or quenching matchin