CN-122007230-A - Automobile chip cooling plate stamping forming device

CN122007230ACN 122007230 ACN122007230 ACN 122007230ACN-122007230-A

Abstract

The invention provides a stamping forming device for a heat dissipation plate of an automobile chip, which belongs to the technical field of heat dissipation plate forming and comprises a lower die, wherein a cavity and a cooling cavity are formed in the lower die, an upper die is matched with the cavity, the cooling cavity is arranged below the cavity, two ends of the lower die are provided with a liquid inlet and a liquid outlet which are communicated with the cooling cavity, a liquid inlet pipe is connected with the liquid inlet, a liquid outlet pipe is connected with the liquid outlet, a wave plate is arranged in the cooling cavity along the connecting line direction between the liquid inlet and the liquid outlet, a spray head is communicated with a vent pipe, and the spray head faces the cavity. According to the invention, the cooling component directly acts on the lower die, and the heat accumulation generated by friction and plastic deformation of materials in the continuous stamping process of the lower die is restrained by the cooling means, so that the thermal deformation of the die is avoided, the dimensional precision of the die cavity in each stamping process is ensured, and the forming precision of the heat dissipation plate is ensured to meet the requirements.

Inventors

LIU ZENGXU
YANG GUOQING
LI GUIQING
WANG TIANQI
QIU FENGYI

Assignees

北京科技大学

Dates

Publication Date: 20260512
Application Date: 20260213

Claims (10)

1. The utility model provides a car chip heating panel stamping forming device which characterized in that includes: The machine frame assembly comprises an upper die and a lower die, a cavity and a cooling cavity are formed in the lower die, the upper die is matched with the cavity, the cooling cavity is arranged below the cavity, and a liquid inlet and a liquid outlet which are communicated with the cooling cavity are formed in two ends of the lower die; The cooling assembly comprises a liquid inlet pipe, a liquid outlet pipe and a wave plate, wherein the liquid inlet pipe is connected with the liquid inlet, the liquid outlet pipe is connected with the liquid outlet, the wave plate is arranged in the cooling cavity along the connecting line direction between the liquid inlet and the liquid outlet, and the liquid inlet pipe is used for providing cooling liquid to the cooling cavity; the cleaning assembly comprises a vent pipe and a spray head, wherein the spray head is communicated with the vent pipe, and the spray head faces the cavity.
2. The device for stamping and forming the heat dissipation plate of the automobile chip according to claim 1, wherein the rack assembly further comprises a rack, guide rails are respectively arranged on the inner walls of two sides of the rack, a connecting piece is connected between the two guide rails in a sliding manner, a driving piece at the top end of the rack is connected with the connecting piece and controls the connecting piece to lift, and the upper die is installed at the bottom end of the connecting piece.
3. The automobile chip heat dissipation plate stamping forming device according to claim 1, wherein the liquid inlet pipe is communicated with the water storage part through the first connecting pipe, the liquid outlet pipe is communicated with the water storage part through the second connecting pipe, the first connecting pipe is provided with a miniature water pump, a plurality of spoilers which are arranged in a staggered manner are fixedly arranged in the water storage part along the length direction of the water storage part to enable water flow to flow in a serpentine manner, and refrigerating components are arranged in the spoilers to cool the cooling liquid.
4. The device for stamping and forming the heat dissipation plate of the automobile chip according to claim 3, wherein the rectifying plate groups are arranged at two ends of the cooling cavity, each rectifying plate group comprises two symmetrically arranged rectifying plates, the axes of the two rectifying plates are intersected, the number of the wavy plates is multiple, and the wavy plates are arranged in parallel.
5. The device for stamping and forming the heat dissipation plate of the automobile chip according to claim 4, wherein the liquid inlet pipe is internally provided with three spiral guide grooves, and the inner circumferences of the liquid inlet pipes of the three spiral guide grooves are uniformly arranged.
6. The device for stamping and forming the heat dissipation plate of the automobile chip according to claim 5, wherein a fixing part is arranged in the first connecting pipe, one end of the first spring is fixedly installed on the fixing part, an installation block is fixedly installed at the other end of the first spring, a movable plate is rotatably installed on the installation block, and the movable plate is slidably connected with the inner wall of the spiral guide groove so that the movable plate supports displacement in the liquid inlet pipe.
7. The device for stamping and forming the heat dissipation plate of the automobile chip according to claim 6, wherein the bottom end of the first connecting pipe is provided with an opening, a mounting groove is formed in the pipe wall of the first connecting pipe, a sealing plate is slidably mounted in the mounting groove, one end of the second spring is fixedly mounted on one end of the sealing plate, the other end of the second spring is fixedly connected with the inner wall of the mounting groove, the other end of the sealing plate is fixedly provided with a supporting rod, the movable plate pushes the sealing plate to move when being abutted against the supporting rod so as to open the opening, the first connecting pipe is communicated with a collecting piece below the opening, and the collecting piece is mounted at the bottom end of the first connecting pipe.
8. The device for stamping and forming the heat dissipation plate of the automobile chip according to claim 6, wherein the inner wall of the cooling cavity is provided with a conical groove, the liquid inlet and the liquid inlet pipe are communicated, a vertical plate is installed in the cooling cavity, a mounting cylinder is installed on the vertical plate and is perpendicular to the vertical plate, a control rod is slidably installed in the mounting cylinder, a memory metal piece is connected between the control rod and the inner wall of the mounting cylinder, and the movable plate supports to extend into the conical groove to be in butt joint with the control rod.
9. The apparatus of claim 1, wherein the vent pipe and the nozzle are mounted on a lower die.
10. The automobile chip heat dissipating plate punch forming apparatus of claim 9, wherein the vent pipe is fixedly provided with a spiral plate.

Description

Automobile chip cooling plate stamping forming device Technical Field The invention relates to the field of cooling plate forming, in particular to a stamping forming device for a cooling plate of an automobile chip. Background The automobile chip is used as the brain of the core components such as a three-electric system, an automatic driving and a controller of a new energy automobile, the operation stability and the service life of an automobile electronic system are directly determined by the heat dissipation efficiency during the working, the heat dissipation plate is used as a key heat dissipation carrier of the automobile chip, the heat dissipation plate has high flatness, high heat conduction efficiency and the precision suitability with a chip packaging structure, the heat generated during the working of the chip is conducted rapidly, the problems of performance attenuation, failure, even burning and the like of the chip due to high temperature are avoided, and the heat dissipation plate is one of core structural members for guaranteeing the long-term reliable operation of automobile electronic equipment. With the development of new energy automobiles to high power and high integration, the power density of automobile chips is continuously improved, the heat generated in unit time is obviously increased, and more stringent requirements are put forward on the heat dissipation performance and the molding accuracy of the heat dissipation plate. At present, in the current heating panel shaping technique, the mould is as stamping forming's core part, easily produces the heat altered shape because of material plastic deformation friction, heat accumulation in continuous stamping process, and then causes heating panel shaping size deviation, poor scheduling problem of roughness, influence the laminating degree and the heat dissipation conduction efficiency of heating panel and chip, in addition, impurity such as metal chip, dust that produce in the stamping process easily remain on the mould surface, if not in time clear up, can lead to follow-up fashioned heating panel surface to appear defects such as mar, crush injury, reduction product percent of pass. Disclosure of Invention The invention provides a stamping forming device for a radiating plate of an automobile chip, which aims to solve the technical problems that in the existing radiating plate forming technology, a die is used as a core component of stamping forming, and thermal deformation is easily generated due to plastic deformation friction and heat accumulation of materials in the continuous stamping process, so that the forming size deviation and the flatness of the radiating plate are poor, and the laminating degree of the radiating plate and the chip and the radiating conduction efficiency are affected. In order to solve the technical problems, the invention provides the following technical scheme: an automobile chip heat dissipation plate punch forming device, comprising: The machine frame assembly comprises an upper die and a lower die, a cavity and a cooling cavity are formed in the lower die, the upper die is matched with the cavity, the cooling cavity is arranged below the cavity, and a liquid inlet and a liquid outlet which are communicated with the cooling cavity are formed in two ends of the lower die; The cooling assembly comprises a liquid inlet pipe, a liquid outlet pipe and a wave plate, wherein the liquid inlet pipe is connected with the liquid inlet, the liquid outlet pipe is connected with the liquid outlet, the wave plate is arranged in the cooling cavity along the connecting line direction between the liquid inlet and the liquid outlet, and the liquid inlet pipe is used for providing cooling liquid to the cooling cavity; the cleaning assembly comprises a vent pipe and a spray head, wherein the spray head is communicated with the vent pipe, and the spray head faces the cavity. Optionally, the frame subassembly still includes the frame, be equipped with the guide rail on the both sides inner wall of frame respectively, sliding connection has the connecting piece between two guide rails, the driving piece on frame top with the connecting piece links to each other and controls the connecting piece and goes up and down, install the connecting piece bottom go up the mould. Optionally, the feed liquor pipe has the water storage spare through first connecting pipe intercommunication, the drain pipe passes through second connecting pipe intercommunication water storage spare, be equipped with miniature water pump on the first connecting pipe, along in the water storage spare length direction fixed mounting has the spoiler that a plurality of crisscross settings to make rivers snakelike flow, be provided with the refrigeration components and parts in the spoiler and cool down the coolant liquid. Optionally, the both ends of cooling chamber all are equipped with the rectification board group, and the rectification board group include