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CN-122007231-A - Intelligent cooling control method and system for metal stamping die based on temperature monitoring

CN122007231ACN 122007231 ACN122007231 ACN 122007231ACN-122007231-A

Abstract

The invention provides an intelligent cooling control method and system for a metal stamping die based on temperature monitoring, and relates to the field of temperature control, wherein the intelligent cooling control method comprises the steps of collecting the temperature of multiple measuring points of the die, reconstructing an internal temperature field and identifying an abnormal region; the heat accumulation intensity of the next cycle is predicted, the cooling influence coefficient of each cooling channel on the abnormal area is calculated, the flow distribution value of each channel is solved based on the construction optimization target, and the flow of the cooling medium is adjusted accordingly. The invention realizes the accurate and self-adaptive cooling of the abnormal temperature region of the die, improves the cooling efficiency and the uniformity of the die temperature, and prolongs the service life of the die.

Inventors

  • TIAN QIAOQIAO

Assignees

  • 昆山浪田模具有限公司

Dates

Publication Date
20260512
Application Date
20260327

Claims (10)

  1. 1. The intelligent cooling control method for the metal stamping die based on temperature monitoring is characterized by comprising the following steps of: collecting temperature values of a plurality of measuring points of a metal stamping die in a stamping cycle to form a temperature data sequence; calculating a temperature gradient vector between the measuring points based on the temperature value and the measuring point position of each measuring point in the temperature data sequence, carrying out space integration on the temperature gradient vector along the inside of the die, reconstructing a temperature distribution field of the position of the non-arranged measuring point in the inside of the die, and identifying the space position and the heat accumulation intensity of a temperature abnormal region; extracting a temperature evolution track of each measuring point in a temperature data sequence in a continuous stamping cycle, calculating the change rate of the temperature evolution track, and predicting a heat accumulation intensity predicted value of a temperature abnormal region at the end time of the next stamping cycle; According to the space position of the temperature abnormal region and the space layout of each cooling channel, calculating the cooling influence coefficient of each cooling channel on the temperature abnormal region; Constructing a flow distribution optimization target according to the cooling influence coefficient, the heat accumulation intensity predicted value and the overall temperature uniformity constraint of the die, and solving to obtain flow distribution values of all cooling channels; and regulating the flow of the cooling medium of each cooling channel according to the flow distribution value, and cooling the metal stamping die in the stamping circulation gap.
  2. 2. The method of claim 1, wherein calculating a temperature gradient vector between stations based on the temperature value and the station position of each station in the temperature data sequence, spatially integrating the temperature gradient vector along the interior of the mold, reconstructing a temperature distribution field of the station position not arranged in the interior of the mold, and identifying the spatial position and the heat accumulation intensity of the temperature anomaly region comprises: constructing a mold space grid unit based on the temperature value and the measuring point position of each measuring point in the temperature data sequence, calculating the center coordinate and the boundary coordinate of each grid unit, and determining the boundary measuring point set of each grid unit according to the distance relation between the boundary coordinate and the measuring point position; extracting the temperature value of each measuring point in the boundary measuring point set, calculating the temperature gradient vector between the measuring points in the boundary measuring point set, and carrying out vector extension on the temperature gradient vector from the boundary coordinates to the center coordinates to obtain the internal temperature gradient field of each grid unit; Carrying out space integration on the internal temperature gradient field along a path from the boundary coordinates to the center coordinates in the die, calculating the temperature value at the center coordinates of each grid unit, and reconstructing the temperature distribution field of the position where the measuring point is not arranged in the die by combining the temperature value and the center coordinates; And extracting grid cells with temperature values exceeding a preset temperature reference threshold value in the temperature distribution field, marking the central coordinates of the grid cells as the space positions of the temperature abnormal areas, and calculating the difference value between the temperature values and the preset temperature reference threshold value as heat accumulation intensity.
  3. 3. The method of claim 1, wherein extracting a temperature evolution trace of each measuring point in the temperature data sequence in a continuous punching cycle, calculating a change rate of the temperature evolution trace, and predicting a heat accumulation intensity predicted value of a temperature anomaly region at an end of a next punching cycle comprises: Acquiring temperature values of all measuring points in a temperature data sequence at the end time of each stamping cycle in a continuous stamping cycle, and constructing temperature evolution tracks of all the measuring points according to time sequence; calculating a cross-correlation function among temperature evolution tracks of all measuring points in a temperature anomaly area, extracting a time offset corresponding to a peak value of the cross-correlation function, identifying a heat source measuring point and a conduction measuring point based on the time offset, and recording heat conduction delay time between the heat source measuring point and the conduction measuring point; Calculating the change rate of the temperature evolution track of the heat source measuring point, and deducing the temperature predicted value of the conduction measuring point at the end time of the next punching cycle based on the change rate and the heat conduction delay time; And identifying the positions of the conduction measuring points of which the temperature predicted values exceed a preset temperature reference threshold value, counting the spatial distribution density of the conduction measuring points exceeding the threshold value in the temperature abnormal region, and evaluating the heat accumulation state of the temperature abnormal region based on the spatial distribution density and the deviation degree of the temperature predicted values to obtain the heat accumulation intensity predicted value of the temperature abnormal region at the end time of the next punching cycle.
  4. 4. The method of claim 1, wherein calculating a rate of change of the heat source station temperature evolution trace, and deriving a predicted value of the temperature of the conduction station at an end of a next press cycle based on the rate of change and the heat conduction delay time comprises: extracting a temperature value at the end time of a continuous stamping cycle in a heat source measuring point temperature evolution track, and calculating a temperature difference value at the end time of an adjacent stamping cycle; carrying out secondary difference on the continuous temperature difference values to obtain the variation of the temperature difference values, judging that the heat source measuring point is in an accelerated heating state when the variation of the temperature difference values is positive, and judging that the heat source measuring point is in a decelerated heating state when the variation of the temperature difference values is negative; Extracting temperature values of a plurality of stamping cycles in a temperature evolution track to calculate change rates for heat source measuring points in an accelerated heating state, and extracting temperature values of a small number of stamping cycles in the temperature evolution track to calculate change rates for heat source measuring points in a decelerated heating state; And (3) acting the change rate of the heat source measuring point on the time period corresponding to the heat conduction delay time, deducing the temperature state of the heat source measuring point after the heat conduction delay time, and assigning the deduced temperature state to the conduction measuring point as a temperature predicted value of the conduction measuring point at the end time of the next punching cycle.
  5. 5. The method of claim 1, wherein calculating a cooling influence coefficient of each cooling channel for the temperature anomaly region based on the spatial location of the temperature anomaly region and the spatial layout of each cooling channel comprises: acquiring the space position of each cooling channel and the flowing direction of a cooling medium, extracting a temperature gradient field of a temperature abnormal region, and identifying the direction with the maximum gradient value in the temperature gradient field as the dominant diffusion direction of heat; calculating the space distance between each cooling channel and the temperature anomaly region according to the space position of each cooling channel and the space position of the temperature anomaly region; Calculating a space included angle between the cooling medium flowing direction and the heat dominant diffusion direction according to the cooling medium flowing direction and the heat dominant diffusion direction of each cooling channel; Dividing the cooling channels into opposite cooling channels, lateral cooling channels and forward cooling channels according to the space included angle range, and removing the forward cooling channels to obtain effective cooling channels; respectively calculating opposite cooling intensity and lateral cooling intensity according to the space distance and the space included angle of the effective cooling channels, and determining the coverage range of each effective cooling channel on the temperature abnormal region; When the coverage areas of the plurality of effective cooling channels overlap, the opposite cooling intensity and the lateral cooling intensity of each effective cooling channel in the overlapping area are overlapped, and the cooling influence coefficient of each effective cooling channel on the temperature abnormal area is obtained.
  6. 6. The method of claim 1, wherein constructing a flow distribution optimization objective and solving for flow distribution values for each cooling channel based on cooling impact coefficients, heat build-up strength predictions, and mold bulk temperature uniformity constraints comprises: extracting cooling influence coefficients of all cooling channels and heat accumulation intensity predicted values of temperature abnormal areas, calculating target cooling quantity of all cooling channels and converting the target cooling quantity into flow demand values; extracting the temperature fluctuation range and the temperature gradient distribution of a non-abnormal region in a temperature distribution field, and determining the overall temperature uniformity constraint of the die; Extracting heat conduction delay time of a heat source measuring point and a conduction measuring point in a temperature abnormal region, identifying a main cooling channel corresponding to the heat source measuring point and a cooperative cooling channel corresponding to the conduction measuring point, and calculating flow distribution time sequence offset between the main cooling channel and the cooperative cooling channel; Calculating the temperature disturbance range of each cooling channel to the non-abnormal region of the die according to the flow demand value, and calculating a constraint correction coefficient when the temperature disturbance range violates the constraint of the overall temperature uniformity of the die; taking the flow demand value as an optimization variable, taking a constraint correction coefficient as a constraint condition, taking a flow distribution time sequence offset as a time sequence distribution rule, constructing a flow distribution optimization target which minimizes a temperature disturbance range and simultaneously meets a target cooling capacity, and carrying out iterative solution; Stopping iteration when the temperature disturbance range meets the constraint of the overall temperature uniformity of the die, obtaining the flow distribution value of the dominant cooling channel in the current stamping cycle gap and the flow distribution value of the cooperative cooling channel in the delayed stamping cycle gap, and summarizing to obtain the flow distribution value of each cooling channel.
  7. 7. The method according to claim 1, wherein adjusting the flow rate of the cooling medium for each cooling passage according to the flow rate distribution value and cooling the metal stamping die at the stamping cycle gap comprises: Monitoring the stamping cycle state, and marking the stamping cycle gap starting time when the current stamping cycle is detected to be ended; At the beginning time of the stamping cycle gap, adjusting the opening of a flow control valve of the main cooling channel according to the flow distribution value of the main cooling channel in the current stamping cycle gap, and starting the main cooling channel to convey cooling medium to the metal stamping die; Calculating the starting time of the cooperative cooling channel according to the flow distribution time sequence offset and the stamping cycle gap starting time between the main cooling channel and the cooperative cooling channel; When the starting time of the cooperative cooling channel arrives, adjusting the opening of a flow control valve of the cooperative cooling channel according to the flow distribution value of the cooperative cooling channel in a delayed stamping cycle gap, and starting the cooperative cooling channel to convey cooling medium to the metal stamping die; and monitoring the stamping cycle state, and closing the flow control valve of each cooling channel when the next stamping cycle is detected to start, so as to stop cooling the metal stamping die.
  8. 8. A metal stamping die intelligent cooling control system based on temperature monitoring for implementing the method of any one of the preceding claims 1-7, comprising: the temperature acquisition unit is used for acquiring temperature values of a plurality of measuring points of the metal stamping die in a stamping cycle to form a temperature data sequence; The temperature field weight unit is used for calculating a temperature gradient vector between the measuring points based on the temperature value and the measuring point position of each measuring point in the temperature data sequence, carrying out space integration on the temperature gradient vector along the inside of the die, reconstructing a temperature distribution field of the position of the non-arranged measuring point in the inside of the die, and identifying the space position and the heat accumulation intensity of a temperature abnormal region; The temperature prediction unit is used for extracting temperature evolution tracks of all measuring points in the temperature data sequence in continuous stamping cycles, calculating the change rate of the temperature evolution tracks and predicting a heat accumulation intensity predicted value of a temperature abnormal region at the end time of the next stamping cycle; A cooling influence unit for calculating a cooling influence coefficient of each cooling channel on the temperature anomaly region according to the spatial position of the temperature anomaly region and the spatial layout of each cooling channel; The flow optimizing unit is used for constructing a flow distribution optimizing target according to the cooling influence coefficient, the heat accumulation intensity predicted value and the overall temperature uniformity constraint of the die, and solving to obtain flow distribution values of all cooling channels; and the cooling control unit is used for adjusting the flow of the cooling medium of each cooling channel according to the flow distribution value and cooling the metal stamping die in the stamping circulation gap.
  9. 9. An electronic device, comprising: A processor; A memory for storing processor-executable instructions; Wherein the processor is configured to invoke the instructions stored in the memory to perform the method of any of claims 1 to 7.
  10. 10. A computer readable storage medium having stored thereon computer program instructions, which when executed by a processor, implement the method of any of claims 1 to 7.

Description

Intelligent cooling control method and system for metal stamping die based on temperature monitoring Technical Field The invention relates to a temperature control technology, in particular to an intelligent cooling control method and system for a metal stamping die based on temperature monitoring. Background In the metal stamping production process, the temperature of the die is continuously increased due to continuous contact with the high-temperature blank and plastic deformation heat generation. Excessive mold temperature not only reduces product dimensional accuracy and surface quality, but also can cause thermal fatigue, wear aggravation and even early failure of the mold, and seriously affects production efficiency and mold life. Therefore, effective cooling control of the die is a key link for ensuring the stability of the stamping process and the quality of the product. It is common practice to preset several cooling channels inside the mold and to introduce a constant cooling medium (such as water or oil) for the overall cooling. Part of the improvement scheme is to arrange a small number of temperature sensors on the surface or at key positions inside the die, and by monitoring the temperature of a single point or a few points, when the temperature exceeds a preset threshold value, the flow of the whole cooling system is simply increased or the temperature of a cooling medium is reduced, so as to attempt global cooling treatment on the die. However, the conventional cooling control method described above has significant drawbacks. Because the heat generated in the metal stamping process has locality and instantaneity, the temperature distribution of each area of the die is extremely uneven, and the heat is easy to accumulate in specific areas (such as complex structures of fillets, bosses and the like) to form a local high-temperature area. The prior method relies on limited measuring points, which are difficult to comprehensively and accurately reflect the complex three-dimensional temperature field distribution in the die, and can not accurately identify the specific spatial position and strength of the local heat accumulation area. Extensive cooling adjustment based on integral or minority point temperature often leads to unreasonable cooling resource distribution, namely excessive cooling of non-critical areas possibly causes local supercooling of a die and thermal stress generation, and insufficient cooling of high Wen Jiju areas really needing intensified cooling, and cannot realize accurate and efficient targeted cooling. This "one-shot" cooling mode has difficulty controlling the local high temperatures while ensuring overall temperature uniformity of the mold, is inefficient in cooling, and may compromise the structural integrity of the mold due to uneven thermal stress distribution. Disclosure of Invention The embodiment of the invention provides an intelligent cooling control method and system for a metal stamping die based on temperature monitoring, which can solve the problems in the prior art. According to a first aspect of the embodiment of the invention, an intelligent cooling control method for a metal stamping die based on temperature monitoring is provided, comprising the following steps: collecting temperature values of a plurality of measuring points of a metal stamping die in a stamping cycle to form a temperature data sequence; calculating a temperature gradient vector between the measuring points based on the temperature value and the measuring point position of each measuring point in the temperature data sequence, carrying out space integration on the temperature gradient vector along the inside of the die, reconstructing a temperature distribution field of the position of the non-arranged measuring point in the inside of the die, and identifying the space position and the heat accumulation intensity of a temperature abnormal region; extracting a temperature evolution track of each measuring point in a temperature data sequence in a continuous stamping cycle, calculating the change rate of the temperature evolution track, and predicting a heat accumulation intensity predicted value of a temperature abnormal region at the end time of the next stamping cycle; According to the space position of the temperature abnormal region and the space layout of each cooling channel, calculating the cooling influence coefficient of each cooling channel on the temperature abnormal region; Constructing a flow distribution optimization target according to the cooling influence coefficient, the heat accumulation intensity predicted value and the overall temperature uniformity constraint of the die, and solving to obtain flow distribution values of all cooling channels; and regulating the flow of the cooling medium of each cooling channel according to the flow distribution value, and cooling the metal stamping die in the stamping circulation gap. Based on the temperature value and the measur