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CN-122007421-A - Diamond liquid cooling plate, preparation method thereof and electronic equipment

CN122007421ACN 122007421 ACN122007421 ACN 122007421ACN-122007421-A

Abstract

The application relates to a diamond liquid cooling plate, a preparation method thereof and electronic equipment. The preparation method of the diamond liquid cooling plate comprises the following steps of providing a liquid cooling plate die, wherein the liquid cooling plate die comprises a die main body and a pore canal forming assembly, a hollow cavity is formed in the die main body, the pore canal forming assembly extends out of the die main body and penetrates through the hollow cavity, the hollow cavity is used for forming the liquid cooling plate main body, the pore canal forming assembly is used for isolating a liquid outlet channel on the liquid cooling plate main body, filling diamond particles and a metal matrix material into the hollow cavity for forming treatment, removing the liquid cooling plate die to obtain the liquid cooling plate main body, the liquid cooling plate main body is provided with the liquid outlet channel, and fixedly connecting the liquid cooling plate main body with a liquid cooling plate shell, wherein the liquid cooling plate shell comprises a liquid inlet and a liquid outlet, and the liquid inlet, the liquid outlet and the liquid outlet are communicated. The preparation method can shorten the processing period and reduce the energy consumption, and the prepared diamond liquid cooling plate has good heat dissipation effect.

Inventors

  • SUN QINGZE
  • ZHANG HAIPING
  • HUO YUJIA
  • LI JIONGLI
  • WANG XUDONG

Assignees

  • 北京石墨烯技术研究院有限公司

Dates

Publication Date
20260512
Application Date
20251226

Claims (10)

  1. 1. The preparation method of the diamond liquid cooling plate is characterized by comprising the following steps of: The method comprises the steps that a liquid cooling plate die is provided, the liquid cooling plate die comprises a die main body and a pore canal forming assembly, a hollow cavity is formed in the die main body, the pore canal forming assembly extends out of the die main body and penetrates through the hollow cavity, the hollow cavity is used for forming a liquid cooling plate main body, and the pore canal forming assembly is used for isolating a liquid outlet flow channel on the liquid cooling plate main body; Filling diamond particles and a metal matrix material into the hollow cavity for molding treatment, and removing the liquid cooling plate die to obtain a liquid cooling plate main body, wherein the liquid cooling plate main body is provided with a liquid flow channel; The liquid cooling plate body is fixedly connected with the liquid cooling plate shell, the liquid cooling plate shell comprises a liquid inlet and a liquid outlet, and the liquid inlet, the liquid flow channel and the liquid outlet are communicated.
  2. 2. The method of preparing a diamond liquid-cooled plate according to claim 1, wherein filling diamond particles and a metal matrix material into the hollow cavity for molding comprises one of: (1) Mixing diamond particles and metal matrix particle materials, filling the obtained mixed particles into the hollow cavity, and sintering and forming; (2) Filling diamond particles into the hollow cavity, pressing molten liquid of a metal matrix material into the hollow cavity, and cooling and forming.
  3. 3. The method of preparing a diamond liquid-cooled plate according to claim 1, wherein the method of preparing satisfies at least one of the following characteristics: (1) The material of the die main body comprises at least one of graphite and steel; (2) The material of the pore canal forming component comprises at least one of graphite, soluble ceramic and soluble alloy.
  4. 4. The method for manufacturing a diamond liquid-cooled plate according to any one of claims 1 to 3, wherein the metal base material comprises at least one of aluminum, aluminum alloy, copper, and copper alloy.
  5. 5. The method for manufacturing a diamond liquid-cooled plate according to any one of claims 1 to 3, wherein the material of the liquid-cooled plate housing comprises at least one of aluminum, aluminum alloy, copper alloy and steel.
  6. 6. The method for preparing a diamond liquid cooling plate according to any one of claims 1 to 3, wherein the total volume of diamond particles filled into the hollow cavity is 40% -60% of the total volume of the hollow cavity.
  7. 7. The method for producing a diamond liquid-cooled plate according to any one of claims 1 to 3, wherein the diamond particles have a particle diameter of 10 μm to 100 μm.
  8. 8. The method for preparing a diamond liquid cooling plate according to any one of claims 1 to 3, wherein the diamond particles comprise a diamond body and a metal coating layer arranged on the surface of the diamond body, and the metal coating layer satisfies at least one of the following characteristics: (1) The metal coating layer comprises at least one of titanium, chromium, titanium and vanadium; (2) The mass of the metal coating layer accounts for 0.1% -10% of the total mass of the diamond particles.
  9. 9. The diamond liquid cooling plate is characterized in that the diamond liquid cooling plate is prepared by adopting the preparation method of the diamond liquid cooling plate according to any one of claims 1-8, and comprises a liquid cooling plate main body and a liquid cooling plate shell, wherein the liquid cooling plate main body is of an integrally formed structure.
  10. 10. An electronic device comprising the diamond liquid cooling plate of claim 9.

Description

Diamond liquid cooling plate, preparation method thereof and electronic equipment Technical Field The application relates to the technical field of heat dissipation, in particular to a diamond liquid cooling plate, a preparation method thereof and electronic equipment. Background The liquid cooling plate is widely used in electronic equipment such as computers, servers, power battery packs of new energy automobiles and the like by virtue of the advantages of high heat transfer efficiency and customizable structure. At present, the upper and lower surfaces of the liquid cooling plate are provided with metal layers, the middle layer is provided with a heat transfer medium liquid flow channel, heat generated by electronic equipment is transferred to the metal layers through interface materials, then transferred to the heat transfer medium through the middle layer, and finally brought out of the liquid cooling plate by the heat transfer medium. The liquid channels in the liquid cooling plate are designed variously, and the heat dissipation effect mainly depends on the heat conductivity coefficient of the metal layer and the contact area between the metal layer and the heat transfer medium. The main materials of the traditional liquid cooling plate are mainly aluminum and copper, the density of the aluminum is 2.7g/cm 3, but the heat conductivity coefficient is only 230W/(m.K), the heat dissipation effect is limited, the heat conductivity coefficient of the copper can reach 400W/(m.K), but the density is as high as 8.9g/cm 3, and the application requirements of weight sensitive scenes are difficult to meet. The heat conductivity of diamond is up to 2200W/(m.K), the heat conductivity of the composite material obtained by compounding the diamond and the aluminum alloy can be up to 600W/(m.K), and the density is only about 3g/cm 3. However, diamond has high hardness and chemical inertness, and the composite material formed by the diamond and aluminum alloy has high processing difficulty, and only special processing modes such as green nanometer laser and the like can be adopted. If the composite material is directly prepared into a block blank, the complex procedures such as runner etching, punching and the like are needed to be molded by laser section by section, so that the processing period is longer, the energy consumption is higher, the heat affected zone is easy to generate, the material performance is attenuated, the processing cost is obviously increased, and the practical application and large-scale popularization of the composite material in the field of liquid cooling plates are severely limited. Therefore, there is a need for improvements over the conventional art. Disclosure of Invention Based on the method, the diamond liquid cooling plate which can shorten the processing period and has good heat dissipation performance, the preparation method and the electronic equipment are provided. The technical scheme for solving the technical problems is as follows. The first aspect of the application provides a method for preparing a diamond liquid cooling plate, comprising the following steps: The method comprises the steps that a liquid cooling plate die is provided, the liquid cooling plate die comprises a die main body and a pore canal forming assembly, a hollow cavity is formed in the die main body, the pore canal forming assembly extends out of the die main body and penetrates through the hollow cavity, the hollow cavity is used for forming a liquid cooling plate main body, and the pore canal forming assembly is used for isolating a liquid outlet flow channel on the liquid cooling plate main body; Filling diamond particles and a metal matrix material into the hollow cavity for molding treatment, and removing the liquid cooling plate die to obtain a liquid cooling plate main body, wherein the liquid cooling plate main body is provided with a liquid flow channel; The liquid cooling plate body is fixedly connected with the liquid cooling plate shell, the liquid cooling plate shell comprises a liquid inlet and a liquid outlet, and the liquid inlet, the liquid flow channel and the liquid outlet are communicated. In some embodiments, the method for preparing the diamond liquid cooling plate, filling the diamond particles and the metal matrix material into the hollow cavity for forming treatment comprises one of the following modes: (1) Mixing diamond particles and metal matrix particle materials, filling the obtained mixed particles into the hollow cavity, and sintering and forming; (2) Filling diamond particles into the hollow cavity, pressing molten liquid of a metal matrix material into the hollow cavity, and cooling and forming. In some of these embodiments, the method of making a diamond liquid-cooled plate satisfies at least one of the following characteristics: (1) The material of the die main body comprises at least one of graphite and steel; (2) The material of the pore canal forming component comprise