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CN-122007537-A - BGA pastes dress welding equipment based on machine vision location

CN122007537ACN 122007537 ACN122007537 ACN 122007537ACN-122007537-A

Abstract

The invention relates to the technical field of welding equipment, in particular to BGA (ball grid array) mounting welding equipment based on machine vision positioning, which comprises a mounting bottom plate, a mechanical arm fixedly arranged on the upper surface of the mounting bottom plate, an industrial camera arranged on the mechanical arm and an electric suction nozzle arranged on an end effector of the mechanical arm, wherein the upper surface of the mounting bottom plate is provided with a conveying unit, a clamping self-adaptive mechanism and an adsorption self-adaptive mechanism. According to the invention, through the cooperation of a plurality of components in the clamping self-adaptive mechanism, after the solder balls are attached to the bonding pads, hot air is conveyed into the welding shell through the heating unit, the solder ball welding points are heated to be melted and welded with the PCB (printed circuit board) while the air quantity of the ventilating pipe is adjusted according to the distribution condition of the solder balls and the electromagnetic valve, and the rotating plate is driven to rotate by the blowing force of the hot air so as to be attached to the BGA plate, so that the BGA plate is clamped, and the clamping force of the rotating plate is self-adaptively controlled according to the air quantity.

Inventors

  • DENG KEQIANG
  • Liao Yunxian

Assignees

  • 东莞市鸿楠电子有限公司

Dates

Publication Date
20260512
Application Date
20260408

Claims (10)

  1. 1. The BGA mounting and welding equipment based on machine vision positioning comprises a mounting bottom plate (1), a mechanical arm (2) fixedly arranged on the upper surface of the mounting bottom plate (1), an industrial camera arranged on the mechanical arm (2) and an electric suction nozzle (6) arranged on an end effector of the mechanical arm (2), and is characterized in that a conveying unit (3), a clamping self-adaptive mechanism (4) and an adsorption self-adaptive mechanism (5) are arranged on the upper surface of the mounting bottom plate (1); The self-adaptive clamping mechanism (4) comprises a rotating plate (401) for clamping the BGA plate, a mounting rod (402) for mounting the rotating plate (401), a guide plate (403) and a heating unit (404), wherein the guide plate (403) is arranged in parallel with the rotating plate (401), the rotating plate (401) is symmetrically arranged in the conveying unit (3) in a rotating mode, the mounting rod (402) is inserted in the rotating plate (401) and fixedly connected with the conveying unit (3), and the guide plate (403) is symmetrically arranged in the conveying unit (3) in a fixed mode and is used for guiding heat generated by the heating unit (404).
  2. 2. The BGA mounting and welding apparatus according to claim 1, wherein the heating units (404) are distributed on the ventilation pipe (4041) on the upper surface of the mounting base plate (1) in a rectangular array, electromagnetic valves (4042) are disposed on the surface of the ventilation pipe (4041), two parallel mounting mats (4043) are fixedly connected to the surfaces of the ventilation pipes (4041), and a conveying pipe (4044) communicated with an external heat source is fixedly connected to the surface of the mounting mat (4043) through an external air pump.
  3. 3. The BGA mounting and welding apparatus according to claim 2, wherein the conveying unit (3) includes a welding housing (301) fixedly connected to one side of an upper surface of the mounting base plate (1), the mounting rods (402) are fixedly disposed on two sides of the welding housing (301), the rotating plate (401) is rotatably disposed in the welding housing (301) in a symmetrical manner based on the mounting rods (402), and the guide plate (403) is fixedly connected to an inner wall of the welding housing (301).
  4. 4. A BGA mounting and welding apparatus based on machine vision positioning according to claim 3, wherein the ventilation pipe (4041) is connected to the welding housing (301), the mechanical arm (2) and the industrial camera are corresponding to the position of the welding housing (301), the two sides of the interior of the welding housing (301) are provided with limiting plates (302), the position of the limiting plates (302) corresponds to the position of the electric suction nozzle (6), and a temperature sensor (303) is provided on the surface of one of the limiting plates (302).
  5. 5. A BGA mounting and welding apparatus based on machine vision positioning according to claim 3, wherein the conveying unit (3) further comprises a mounting frame (304) slidably disposed on one side of the welding housing (301), a sucker (305) is fixedly disposed on an upper surface of the mounting frame (304), and two guide plates (306) corresponding to the positions of the ventilation pipes (4041) are fixedly connected to the surface of the mounting frame (304) in a symmetrical manner.
  6. 6. The BGA mounting and welding apparatus according to claim 5, wherein the adsorption adaptive mechanism (5) includes two communicating pipes (501) symmetrically fixed on two sides of the mounting frame (304), one end of each communicating pipe (501) is communicated with a corresponding suction cup (305), the other end is communicated with the outside air, a sealing gasket (502) is slidably provided in the communicating pipe (501), and a micro electric push rod (503) fixedly arranged in the communicating pipe (501) is fixedly connected to one side of the sealing gasket (502).
  7. 7. The BGA mounting and welding apparatus according to claim 6, wherein the adsorption adaptive mechanism (5) further comprises a pushing plate (504) fixedly disposed on one side of the sealing pad (502) and on the same horizontal line with the lower surface of the rotating plate (401), the pushing plate (504) can drive the sealing pad (502) to slide in the communicating pipe (501) by using the rotating force of the rotating plate (401), and the sealing pad (502) seals the communicating pipe (501).
  8. 8. The BGA mounting and welding apparatus according to claim 6, wherein the adsorption adaptive mechanism (5) further comprises an electromagnetic coil (505) fixedly connected to the inside of the communication pipe (501), the electromagnetic coil (505) is attached to a magnet disposed at one end of the micro electric push rod (503), and the micro electric push rod (503) can be adsorbed after the electric connection.
  9. 9. The BGA mounting and welding apparatus according to claim 6, wherein the adsorption adaptive mechanism (5) further comprises an elastic cushion layer (506) fixedly connected to one side of the rotating plate (401), the elastic cushion layer (506) and the PCB board disposed on the suction cup (305) are in the same horizontal line, the elastic cushion layer (506) can rotate along with the rotating plate (401) to limit two sides of the PCB board, and a pressure sensor is disposed on a lower surface of the elastic cushion layer (506).
  10. 10. The BGA mounting and welding device based on machine vision positioning according to claim 5, wherein a connecting plate (7) slidably connected with the mounting base plate (1) is disposed on the lower surface of the mounting frame (304), guide wheels slidably connected with the mounting base plate (1) are disposed on the surface of the connecting plate (7), positioning plates (8) parallel to the mounting frame (304) are slidably disposed on two sides of the upper surface of the mounting base plate (1), and two elastic rods fixedly connected with the mounting base plate (1) are fixedly disposed on one side of the positioning plates (8).

Description

BGA pastes dress welding equipment based on machine vision location Technical Field The invention relates to the technical field of welding equipment, in particular to BGA (ball grid array) mounting welding equipment based on machine vision positioning. Background The BGA bonding technology is a technology commonly used for electronic components and devices, which is widely used in the manufacturing process of electronic devices, and is a technology for connecting a chip and a Printed Circuit Board (PCB) using minute solder balls, which has high density, high reliability and good conductive properties, and the BGA bonding is completed by bonding solder balls on pads of the chip, then inversely placing the chip on the PCB, and melting the solder balls and connecting the solder balls with the pads on the PCB using heat and pressure. Through searching, the invention patent discloses high-lead BGA welding equipment (publication number: CN 119188009B) of integrated circuit package, which comprises a composite mechanism. This integrated circuit package's high plumbous BGA welding equipment, through the compound mechanism design, place the material on placing the platform, then carry out the centre gripping to the material through fixture, thereby reach the effect of fixed material, prevent to take place the skew in the welding material, influence welding efficiency and welding quality, the bogie can rotate at the welding frame top, increase the flexibility ratio of part, the welding machine carries out sliding connection through with sliding group, thereby reach the effect of adjusting welding height, enlarge application scope, weld the material through the welded connection, make positioning mechanism aim at the material welding point in the welding, thereby reach the effect of prepositioning, the accuracy of welding is improved, prevent to take place the skew, improve welding efficiency. However, the following problems still remain in the prior art described above: Although through compound mechanism design, place the material and place the bench, then carry out the centre gripping through fixture to the material to this effect that reaches fixed material prevents to take place the skew when welding the material, influences welding efficiency and welding quality, but BGA welding process, because the tin ball that distributes on the BGA is when the heating melts, tin ball and bonding pad closely laminate, consequently in the fusion welding process, the tension that the tin ball liquefaction produced probably drives the BGA board and takes place the skew for the BGA solder ball deviates from the bonding pad, forms bridging or off normal, thereby leads to unable accurate welding of BGA board and PCB board. Therefore, the invention provides a BGA mounting and welding device based on machine vision positioning, which is used for solving the problems. Disclosure of Invention The invention aims to solve the defects in the prior art, and provides BGA mounting and welding equipment based on machine vision positioning. In order to achieve the above purpose, the present invention adopts the following technical scheme: The BGA mounting and welding equipment based on machine vision positioning comprises a mounting bottom plate, a mechanical arm fixedly arranged on the upper surface of the mounting bottom plate, an industrial camera arranged on the mechanical arm and an electric suction nozzle arranged on an end effector of the mechanical arm, wherein the upper surface of the mounting bottom plate is provided with a conveying unit, a clamping self-adaptive mechanism and an adsorption self-adaptive mechanism; The self-adaptive clamping mechanism comprises a rotating plate used for clamping the BGA plate, a mounting rod used for mounting the rotating plate, a guide plate arranged in parallel with the rotating plate and a heating unit, wherein the rotating plate is symmetrically arranged inside the conveying unit in a rotating mode, the mounting rod is inserted into the rotating plate and fixedly connected with the conveying unit, and the guide plate is symmetrically fixedly arranged in the conveying unit and used for guiding heat generated by the heating unit. Preferably, the heating units are distributed on the ventilating pipes on the upper surface of the mounting base plate in a rectangular array, electromagnetic valves are arranged on the surfaces of the ventilating pipes, two parallel mounting mats are fixedly connected to the surfaces of the ventilating pipes respectively, and conveying pipes communicated with an external heat source are fixedly connected to the surfaces of the mounting mats through external air pumps. Preferably, the conveying unit comprises a welding shell fixedly connected to one side of the upper surface of the mounting bottom plate, the mounting rods are fixedly arranged on two sides of the welding shell, the rotating plates are symmetrically arranged inside the welding shell in a rotating mode base