CN-122007599-A - Laser output estimation method and laser processing system

Abstract

The invention provides a laser output estimation method and a laser processing system. A laser output estimation method in a laser processing system is provided with a step of irradiating a 1 st laser beam onto a workpiece, a step of acquiring an output signal of a2 nd photodetector based on reflected return light from the workpiece, a step of acquiring an output signal of a 3 rd photodetector arranged on an optical path of the 1 st laser beam, a step of estimating a component of the reflected return light from the workpiece based on the output signal of the 2 nd photodetector, and a step of estimating an output of the 1 st laser beam irradiated onto the workpiece by correcting the estimated component of the reflected return light based on the output signal of the 3 rd photodetector.

Inventors

• OGUCHI TSUNEYUKI
• Nishio Jungmin

Assignees

• 松下知识产权经营株式会社

Dates

Publication Date

20260512

Application Date

20220402

Priority Date

20210402

Claims (5)

1. 1. A laser output estimation method in a laser processing system includes: A step of irradiating a1 st laser beam to a workpiece; a step of acquiring an output signal of the 2 nd photodetector based on the reflected return light from the workpiece; a step of acquiring an output signal of a3 rd photodetector arranged on an optical path of the 1 st laser beam; a step of estimating a component of reflected return light from the workpiece based on the output signal of the 2 nd photodetector, and And estimating an output of the 1 st laser beam irradiated to the workpiece by correcting the estimated component of the reflected return light based on the output signal of the 3 rd photodetector.
2. 2. The laser output inference method as claimed in claim 1, wherein, A component of the reflected return light is inferred based on a ratio of the output signal of the 2 nd photodetector to the output signal of the 3 rd photodetector.
3. 3. The laser output inference method according to claim 1 or 2, wherein, The output signal of the 3 rd photodetector is a signal containing a reflected return light component from the workpiece and a scattered light component from an optical component.
4. 4. The laser output inference method according to claim 1 or 2, wherein, The laser processing system can irradiate the 1 st laser and the 2 nd laser with different wavelengths to the workpiece.
5. 5. A laser processing system is provided with: A laser oscillator for irradiating a workpiece with laser light; A2 nd photodetector that detects reflected return light from the workpiece; A3 rd photodetector arranged on the optical path of the 1 st laser beam, and And a control device which estimates laser output to be irradiated to the workpiece based on the output signals of the 2 nd photodetector and the 3 rd photodetector.

Description

Laser output estimation method and laser processing system The present application is a divisional application of an application patent application with a filing date of 2022, 04 month 02, a filing number of 202210456142.3, and a title of "laser processing head, laser processing system and abnormality determination method". Technical Field The present disclosure relates to a laser processing head, and more particularly, to a laser processing head that emits two laser beams having different wavelengths, a laser processing system including the same, and an abnormality determination method for the laser processing system. Background The laser processing system performs laser processing such as cutting, welding, and drilling of a workpiece. In a laser processing system, a laser processing head irradiates a workpiece with laser light emitted from a laser oscillator and guided through an optical fiber. The laser processing head is provided with a condensing optical system for condensing laser light and irradiating the workpiece with the condensed laser light. In the laser processing, there is a possibility that a sputtered material or the like, which is melted and scattered from a workpiece, adheres to an optical member provided in a laser processing head. If such adhesion of the sputtered material occurs, laser light is scattered inside the laser processing head, and the laser light cannot be irradiated to the workpiece at a desired power, which may result in processing failure and degradation of processing quality. In order to cope with such a problem, for example, patent document 1 discloses a laser processing system in which a laser oscillator generates inspection laser light having a lower output than processing laser light, and the inspection laser light is irradiated to a workpiece through a laser processing head. A light receiving section for receiving return light reflected by a workpiece is provided inside the laser processing head. The contamination of the cover glass covering the light emission port of the laser processing head is determined based on the intensity of the return light detected by the light receiving unit, and the degree of power reduction of the processing laser beam emitted to the workpiece is determined. If the power is reduced to a small extent, the output of the processing laser is corrected and laser processing is performed, and if the power is reduced to a large extent, the laser processing is interrupted. Prior art literature Patent literature Patent document 1 Japanese patent laid-open publication 2016-097412 However, in recent years, for example, a hybrid laser processing system using two types of lasers having wavelengths different from each other, such as near infrared and blue, is known. The hybrid laser processing system combines two kinds of laser beams having different wavelengths on the same optical axis by a laser processing head, and irradiates a workpiece with the combined two kinds of laser beams. The hybrid laser processing system can use the advantages of each laser and make up for the shortages, and therefore has many advantages over the existing laser processing systems using only one laser. In such a hybrid laser processing system, as in patent document 1, it is necessary to determine the state of the inside of the laser processing head. In addition, it is also necessary to detect reflected return light from the workpiece and determine the processing state of the workpiece based on the result. However, in the conventional structure disclosed in patent document 1, it is difficult to determine the processing state of the workpiece and the state of the inside of the laser processing head by splitting the reflected return light from the workpiece and the vignetting light at the optical member of the inside of the laser processing head. In particular, in a hybrid laser processing system, a plurality of optical members are arranged in the optical paths of the respective lasers, and these state determinations become further difficult. Disclosure of Invention The present disclosure has been made in view of the above circumstances, and an object thereof is to provide a laser processing head capable of determining a processing state of a workpiece based on reflected return light in a laser processing head that irradiates laser beams having mutually different wavelengths to the workpiece, and a laser processing system including the same. A laser processing head according to the present disclosure is a laser processing head having a housing and a plurality of optical members disposed in the housing, wherein the laser processing head is provided with a1 st light entrance port into which a1 st laser beam is incident, a 2nd light entrance port into which a 2nd laser beam is incident, an irradiation port through which the 1 st laser beam and the 2nd laser beam are emitted to the outside, and a partition wall separating an optical path of the 1 st laser beam incident from the 1