CN-122007604-A - Alloy frame resistance carrier and laser processing equipment

CN122007604ACN 122007604 ACN122007604 ACN 122007604ACN-122007604-A

Abstract

The application provides an alloy frame resistor carrying platform and laser processing equipment, wherein the alloy frame resistor carrying platform comprises an insulating base module, a supporting adsorption module and a positioning module, wherein the insulating base module comprises a carrying platform base and an insulating substrate, the carrying platform base is configured to provide basic support, the insulating substrate is arranged on the carrying platform base and is configured to insulate a part contacted with an alloy frame resistor to avoid circuit short circuit in the laser processing process, the supporting adsorption module is arranged on the carrying platform base and penetrates through the insulating substrate and is configured to adsorb a frame entity part of the alloy frame resistor, the hollowed-out area of the alloy frame resistor is avoided to avoid adsorption gas leakage, and the positioning module is arranged on the carrying platform base and is configured to push the alloy frame resistor to a positioning reference position.

Inventors

CAI JIALIN
ZHOU FENG
ZHANG ZHENGFU
WANG WEI
ZHANG SHENG
HE LIN
DAI YANHUI
GENG YUCHEN

Assignees

长春光华微电子设备工程中心有限公司

Dates

Publication Date: 20260512
Application Date: 20260414

Claims (10)

1. An alloy frame resistor carrier, comprising: The insulation base module comprises a carrier base and an insulation substrate, wherein the carrier base is configured to provide basic support, the insulation substrate is arranged on the carrier base and is configured to be insulated from a part contacted with the alloy frame resistor so as to avoid circuit short circuit in the laser processing process; The supporting and adsorbing module is arranged on the carrier base and penetrates through the insulating substrate, is configured to adsorb a frame entity part of the alloy frame resistor, and avoids a hollowed-out area of the alloy frame resistor to avoid adsorption air leakage; And the positioning module is arranged on the carrier base and is configured to push the alloy frame resistor to a positioning reference position.
2. The alloy frame resistor carrier of claim 1, wherein the insulating substrate comprises: a support bearing surface configured to bear the alloy frame resistance; and the avoidance part is arranged on the supporting bearing surface and is configured to avoid the hollowed-out area of the alloy frame resistor, so that the insulating substrate only supports the solid part of the frame to realize suspension of the resistor.
3. The alloy frame resistor carrier of claim 2, wherein the insulating substrate further comprises: The limiting part is arranged at the edge of the supporting bearing surface, the upper surface of the limiting part is higher than the plane where the supporting bearing surface is located, and the limiting part is configured to limit the positioning reference position formed by the alloy frame resistor.
4. The alloy frame resistor carrier of claim 2, wherein the support adsorption module comprises: The suction nozzles penetrate through the insulating substrate, the upper ports of the suction nozzles are flush with the top surface of the insulating substrate, and the suction nozzles are configured to be attached to the solid frame parts of the alloy frame resistor to form a sealed negative pressure adsorption space.
5. The alloy frame resistor carrier of claim 4, The suction nozzle and the avoiding part are staggered and are not overlapped, so that the suction nozzle is configured to ensure stable adsorption and avoid adsorption air leakage.
6. The alloy frame resistor carrier of claim 3, wherein the positioning module comprises: And the active positioning module is positioned on one side of the insulating substrate away from the limiting part and is configured to push the alloy frame resistor to move along a first direction so as to be close to the limiting part.
7. The alloy frame resistor carrier of claim 6, wherein the positioning module further comprises: The driven positioning module is a follow-up guide structure of the driving positioning module and is configured to push the alloy frame resistor to move along a second direction so as to be close to the limiting part; the driven positioning module moves towards the second direction in response to the movement of the driving positioning module towards the first direction.
8. The alloy frame resistor carrier of claim 7, The active positioning module and the driven positioning module are provided with an insulating buffer layer on one side facing the alloy frame resistor, and the insulating buffer layer is configured to avoid deformation of the frame resistor and realize insulation protection.
9. The alloy frame resistor carrier of claim 1, further comprising: And the flexible compaction module is arranged on the carrier base, at least partially suspended above the insulating substrate and configured to flexibly compact the alloy frame resistor.
10. A laser processing apparatus, comprising: the alloy frame resistance mount of any one of claims 1-9 configured to carry an alloy frame resistance; And a laser configured to laser process the alloy frame resistance.

Description

Alloy frame resistance carrier and laser processing equipment Technical Field The application relates to the technical field of laser processing equipment, in particular to an alloy frame resistor carrier and laser processing equipment. Background In the technical field of laser processing, an alloy frame resistor is widely applied to the manufacturing field of high-end equipment such as power management, automobile electronics, industrial control and the like as a power type resistor element with low temperature coefficient, high current bearing and excellent heat dissipation performance. However, the structural characteristics of the alloy frame resistor, such as overall conductivity, hollow middle, suspended resistor body and soft and easily-deformed material, cause the technical problems of short circuit, hollow adsorption air leakage, rigid clamping deformation, uneven resistor body warpage and the like in the laser processing clamping process. The existing carrier device cannot meet the technological requirements of full-insulation protection, hollow avoidance support, flexible positioning compression and reliable vacuum adsorption, and severely restricts the laser processing precision and the product yield. Therefore, research and development of a laser processing carrier suitable for full insulation, hollowed-out adaptation, flexible positioning and reliable adsorption of alloy frame resistors becomes a key problem to be solved in the field of current laser processing equipment. Disclosure of Invention The application aims to provide an alloy frame resistor carrier and laser processing equipment aiming at the technical problems in the related art. The specific scheme is as follows: The embodiment of the application provides an alloy frame resistor carrier which comprises an insulating base module, a supporting adsorption module and a positioning module, wherein the insulating base module comprises a carrier base and an insulating substrate, the carrier base is configured to provide basic support, the insulating substrate is arranged on the carrier base and is configured to be insulated with a part contacted with an alloy frame resistor so as to avoid circuit short circuit in the laser processing process, the supporting adsorption module is arranged on the carrier base and penetrates through the insulating substrate and is configured to adsorb a frame entity part of the alloy frame resistor and avoid a hollowed-out area of the alloy frame resistor so as to avoid adsorption gas leakage, and the positioning module is arranged on the carrier base and is configured to push the alloy frame resistor to a positioning reference position. In some embodiments, the insulating substrate includes a support bearing surface configured to bear the alloy frame resistance; and the avoidance part is arranged on the supporting bearing surface and is configured to avoid the hollowed-out area of the alloy frame resistor, so that the insulating substrate only supports the solid part of the frame to realize suspension of the resistor. In some embodiments, the insulation substrate further comprises a limiting part, wherein the limiting part is arranged at the edge of the supporting bearing surface, the upper surface of the limiting part is higher than the plane where the supporting bearing surface is located, and the limiting part is configured to limit the positioning reference position of the alloy frame resistor. In some embodiments, the support adsorption module comprises a plurality of suction nozzles penetrating through the insulating substrate, wherein the upper ports of the suction nozzles are flush with the top surface of the insulating substrate and are configured to be attached to the frame solid part of the alloy frame resistor to form a sealed negative pressure adsorption space. In some embodiments, the suction nozzle and the avoiding portion are staggered and do not overlap each other, and are configured to ensure stable adsorption and avoid adsorption air leakage. In some embodiments, the positioning module includes an active positioning module located on a side of the insulating substrate away from the limit portion and configured to push the alloy frame resistor to move along a first direction to approach the limit portion. In some embodiments, the positioning module further comprises a driven positioning module, which is a follow-up guiding structure of the driving positioning module, configured to push the alloy frame resistor to move along a second direction to approach the limiting portion, wherein the first direction is perpendicular to the second direction, and the driven positioning module moves towards the second direction in response to the driving positioning module moving towards the first direction. In some embodiments, the side of the driving positioning module and the driven positioning module facing the alloy frame resistor is provided with an insulating buffer layer, which is configured to av