CN-122007646-A - Glass substrate TGV blind groove processing method and glass substrate

CN122007646ACN 122007646 ACN122007646 ACN 122007646ACN-122007646-A

Abstract

The invention provides a glass substrate TGV blind groove processing method and a glass substrate, wherein the method comprises the steps of providing a laser processing device, integrating a vibrating mirror scanning light path and a Bessel beam shaping light path, focusing laser focuses of the two light paths near the lower surface of the glass substrate to be processed, scanning an internal structure area forming a blind groove according to a preset filling path by using the vibrating mirror scanning light path, forming a first modified area in the glass substrate, scanning an edge contour area forming the blind groove according to a preset closed contour path by using the Bessel beam shaping light path, forming a second modified area in the glass substrate, and performing wet etching on the glass substrate in etching liquid to remove materials of the first modified area and the second modified area and form the blind groove. The glass substrate TGV blind groove processing method effectively solves the problem that the blind groove processing efficiency and precision of the glass substrate in the prior art are difficult to take the shape of the bottom of the blind groove into consideration.

Inventors

LU QINGTIAN
LI WENLEI
WU YANYAN
LI SHAN
Li Zhinie
WANG DONGBIN

Assignees

三叠纪(广东)科技有限公司
成都迈科科技有限公司

Dates

Publication Date: 20260512
Application Date: 20260211

Claims (9)

1. The glass substrate TGV blind groove processing method is characterized by comprising the following steps of: Providing a laser processing device, wherein the laser processing device is integrated with a galvanometer scanning light path and a Bessel beam shaping light path; Focusing laser focuses of the galvanometer scanning light path and the Bessel beam shaping light path near the lower surface of the glass substrate to be processed; Scanning an internal structure area forming a blind groove according to a preset filling path by using the galvanometer scanning light path, and forming a first modified area in the glass substrate; Scanning an edge contour area forming a blind groove according to a preset closed contour path by utilizing the Bessel beam shaping optical path, and forming a second modified area in the glass substrate; And placing the glass substrate processed by the galvanometer scanning light path and the Bessel beam shaping light path into etching liquid for wet etching to remove the materials of the first modified region and the second modified region, so as to form the blind groove.
2. The method for processing the TGV blind groove of the glass substrate according to claim 1, wherein the scanning speed of the galvanometer scanning optical path is 1000-1500mm/s, and the scanning speed of the Bessel beam shaping optical path is 150-250mm/s.
3. The method of claim 1, wherein the laser focus is focused in a range of 0.05 mm to 0.1 mm above the lower surface of the glass substrate.
4. The method for processing the TGV blind-groove of the glass substrate according to claim 1, wherein the preset filling path is an equidistant line scanning path, the light emergent interval of line scanning is 1-3 μm, and the interval between the edge contour area and the inner structure area is 2-4 μm.
5. The method for processing the TGV blind groove of the glass substrate according to claim 1, wherein the galvanometer scanning light path and the Bessel beam shaping light path are connected with the same laser source through an electric spectroscope switching mechanism.
6. The method of claim 1, further comprising identifying mark points on the surface of the glass substrate and establishing a global coordinate system to map a predetermined fill path and a closed profile path to a target processing location of the glass substrate by a visual alignment system prior to processing with the laser processing apparatus.
7. The method of claim 1, further comprising checking the relative distance of the laser focus from the lower surface of the glass substrate by a vision system before or during processing with the laser processing apparatus, and making the deviation of the relative distance of the laser focus from the lower surface of the glass substrate less than or equal to a preset threshold.
8. The method for processing the TGV blind-groove of the glass substrate according to claim 1, wherein magnetic stirring is adopted in the etching process.
9. A glass substrate characterized by comprising a substrate body provided with a TGV blind groove formed based on the glass substrate TGV blind groove processing method of any one of claims 1 to 8.

Description

Glass substrate TGV blind groove processing method and glass substrate Technical Field The invention relates to the technical field of TGV hole processing and manufacturing, in particular to a glass substrate TGV blind groove processing method and a glass substrate. Background Through Glass Via (TGV, glass through hole) technology is used as an advanced three-dimensional interconnection technology, and has wide application prospect in the fields of high-density microelectronic packaging, MEMS devices, radio frequency components and the like due to the fact that glass materials have excellent high-frequency electrical characteristics, adjustable thermal expansion coefficients and low cost advantages. In the TGV process flow, the processing quality of the blind trench directly determines the effect of subsequent metallization filling and the reliability of the package assembly. Currently, the processing method of TGV blind grooves mainly comprises a sand blasting method, a plasma etching method, a photosensitive glass method and a femtosecond laser processing method. The sand blasting method is low in cost, but poor in processing precision and serious in edge breakage, is only suitable for large-size blind grooves, is extremely low in etching rate, can only prepare blind grooves with specific conical structures, is difficult to meet the requirement of mass production, and is limited by expensive material cost and deformation problems caused by high-temperature treatment, so that the photosensitive glass method is limited in application scene. With the application of the characteristic of femtosecond laser 'cold working', a technical route based on combination of femtosecond laser induction and wet etching has become a currently mainstream high-precision TGV blind groove processing scheme. However, the existing femto second laser TGV blind groove processing technology generally adopts the equipment architecture of a single light emitting system, and has the obvious technical bottlenecks that firstly, the existing single light emitting system is mainly divided into two types, namely a single Bessel cutting head system, the existing single light emitting system is high in processing precision and edge regularity, the scanning speed is extremely low, the efficiency is low when processing the internal structure of a large-area blind groove, the large-scale mass production of a plate level or a wafer level is difficult to adapt, and the other type is a single focusing lens system, and the existing single light emitting system is provided with a certain continuous scanning capability, but lacks the shaping characteristic of the Bessel beam, so that the edge regularity is poor, the groove wall is rough, and the requirement of high-density packaging on a fine contour cannot be met. Secondly, the traditional processing technology generally focuses the laser focus on the upper surface or the middle area of the glass substrate, and the focus setting mode is easy to cause saw-tooth-shaped rugged and excessively etched through grooves or microcracks at the bottom of the blind groove in the subsequent wet etching process, so that a high-quality 'flat bottom' blind groove structure is difficult to obtain, and the subsequent metallization interconnection reliability is seriously affected. Thirdly, the suitability of the special-shaped structure is poor and the process consistency is insufficient. In addition, due to lack of uniform reference control, the processing parameters of different areas (such as an internal filling area and an edge contour area) often have differences, so that the uniformity of the etched morphology is poor, and accumulated errors are easy to generate in multi-equipment step processing. In summary, how to break through the limitation of a single optical path system and improve the processing efficiency and quality of the TGV blind grooves becomes the industry requirement. Disclosure of Invention The invention aims to provide a glass substrate TGV blind groove processing method and a glass substrate, wherein the processing efficiency and the processing precision can be considered, and the flatness of the bottom of the blind groove can be solved. In order to achieve the above object, the present invention provides a glass substrate TGV blind groove processing method, which includes: Providing a laser processing device, wherein the laser processing device is integrated with a galvanometer scanning light path and a Bessel beam shaping light path; Focusing laser focuses of the galvanometer scanning light path and the Bessel beam shaping light path near the lower surface of the glass substrate to be processed; Scanning an internal structure area forming a blind groove according to a preset filling path by using the galvanometer scanning light path, and forming a first modified area in the glass substrate; Scanning an edge contour area forming a blind groove according to a preset closed contour path by utili