CN-122007649-A - Low-thermal stress laser precision cutting process suitable for thin-wall hardware

Abstract

The application relates to the technical field of intelligent welding systems and provides a low thermal stress laser precision cutting process suitable for thin-wall hardware, which comprises the steps of establishing a three-dimensional model of the thin-wall hardware, and extracting a cutting path of each cutting area of the three-dimensional model; the method comprises the steps of evaluating the sensitivity degree of a cutting area to thermal stress, constructing a heat capacity rigidity ratio of the cutting area, evaluating the significance degree of the cutting area affected by the thermal interaction of the cut area, constructing the accumulated heat conduction influence degree of the cutting area, determining the deformation factor of the cutting area, determining the cutting sequence of all the cutting areas of the thin-wall hardware by combining the heat capacity rigidity ratio, and finishing the laser precise cutting of the thin-wall hardware according to the cutting sequence. The application aims to determine the cutting sequence of the thin-wall hardware and avoid plastic deformation of the thin-wall hardware due to the heat accumulation effect in the cutting process.

Inventors

• LI FUZHEN
• CHEN SHIDA

Assignees

• 东莞市豪仁精密五金科技有限公司

Dates

Publication Date

20260512

Application Date

20260130

Claims (10)

1. 1. The low thermal stress laser precision cutting process suitable for the thin-wall hardware is characterized by comprising the following steps of: Establishing a three-dimensional model of the thin-wall hardware, and extracting a cutting path of each cutting area of the three-dimensional model; Analyzing the shape of the cutting area and the length of a cutting path in the cutting area, and constructing a heat capacity rigidity ratio of the cutting area, wherein the heat capacity rigidity ratio is used for representing the sensitivity degree of the cutting area to thermal stress; analyzing the distances of different cutting areas and the lengths of cutting paths in the cutting areas, and constructing the cumulative heat conduction influence degree of the cutting areas, wherein the cumulative heat conduction influence degree is used for representing the remarkable degree of the heat interaction influence of the cut areas on the cut areas; and determining the deformation factor of the cutting area by combining the heat capacity and rigidity ratio and the accumulated heat conduction influence degree, determining the cutting sequence of all the cutting areas of the thin-wall hardware by combining the heat capacity and rigidity ratio, and finishing the laser precise cutting of the thin-wall hardware according to the cutting sequence.
2. 2. The low thermal stress laser precision cutting process for thin-walled hardware according to claim 1 wherein the shape of the cut region is used to determine the area to perimeter ratio of the cut region.
3. 3. The low thermal stress laser precision cutting process for thin-wall hardware according to claim 2, wherein the heat capacity rigidity ratio of the cutting area is in positive correlation with the cross-section narrowness coefficient of the cutting area, and is in negative correlation with the area circumference ratio of the cutting area, and the cross-section narrowness coefficient of the cutting area is used for representing the heat accumulation effect intensity of the cutting area.
4. 4. The low thermal stress laser precision cutting process for thin-walled hardware according to claim 3 wherein the cross-sectional narrowness factor of the cutting zone is inversely related to the area of the cutting zone and positively related to the length of the cutting path in the cutting zone.
5. 5. The low thermal stress laser precision cutting process for thin-walled hardware according to claim 1 wherein the distance between the different cutting regions is the distance between the geometric centers of the different cutting regions.
6. 6. The low thermal stress laser precision cutting process for thin-walled hardware according to claim 1 wherein the cumulative degree of thermal conductivity influence of the cut area is the cumulative sum of the degrees of thermal conductivity influence of the cut area and all other different cut areas.
7. 7. The low thermal stress laser precision cutting process for thin-walled hardware according to claim 6, wherein the method for determining the degree of influence of the thermal conduction between the cutting area and all other cutting areas is as follows: The product of the heat conduction attenuation factors of the cutting area and other different cutting areas and the length of the cutting path in the cutting area is recorded as the heat conduction influence degree of the target cutting area and the comparison cutting area, wherein the heat conduction attenuation factors of the cutting area are used for representing the speed of heat conduction attenuation between the cutting area and other cutting areas.
8. 8. The low thermal stress laser precision cutting process for thin-walled hardware according to claim 7, wherein the thermal conduction attenuation factor of the cutting region and other different cutting regions is a negative correlation processing result of the distance between the cutting region and other different cutting regions.
9. 9. The low thermal stress laser precision cutting process for thin-walled hardware according to claim 1 wherein the deformation factor of the cut region is the product of the thermal stiffness ratio of the cut region and the cumulative degree of thermal conductivity influence.
10. 10. The low thermal stress laser precision cutting process for thin-wall hardware according to claim 1, wherein the specific determining process of the cutting sequence of all the cutting areas of the thin-wall hardware is: selecting a cutting area with the largest heat capacity rigidity ratio as a first cutting area, and finishing cutting; cutting the cutting areas which correspond to the maximum cumulative heat conduction influence degree and are not cut, repeatedly selecting the remaining cutting areas which correspond to the maximum cumulative heat conduction influence degree and are not cut, and cutting until all the cutting areas are cut.

Description

Low-thermal stress laser precision cutting process suitable for thin-wall hardware Technical Field The application relates to the technical field of intelligent welding systems, in particular to a low thermal stress laser precision cutting process suitable for thin-wall hardware. Background The thin-wall hardware is a hardware part which is formed by processing metal materials such as steel, aluminum, copper, stainless steel and the like, the wall thickness dimension of the hardware part is far smaller than the length, the width or the diameter of the hardware part, and the hardware part is a lightweight metal member. The low thermal stress laser precision cutting is a high-precision cutting processing technology with low thermal input and low stress by combining a laser beam with high energy density and narrow pulse width with a precision motion control technology aiming at the characteristic that thin-wall hardware is easy to deform. In the process of carrying out low thermal stress laser precision cutting on the thin-wall hardware, the thin-wall hardware is generally cut in sequence by adopting a fixed geometric sequence, the heat accumulation effect is not considered, the heat is easy to be continuously overlapped in a local area, an uneven thermal stress field is formed, and uncontrollable plastic deformation such as bending, warping and the like of the thin-wall hardware is extremely easy to be caused. Disclosure of Invention The application provides a low thermal stress laser precision cutting process suitable for thin-wall hardware, which aims to solve the problem that uncontrollable plastic deformation of the thin-wall hardware is easy to occur because the thermal accumulation effect is not considered in the low thermal stress laser precision cutting process, and the adopted technical scheme is as follows: One embodiment of the application provides a low thermal stress laser precision cutting process suitable for thin-wall hardware, which comprises the following steps: Establishing a three-dimensional model of the thin-wall hardware, and extracting a cutting path of each cutting area of the three-dimensional model; Analyzing the shape of the cutting area and the length of a cutting path in the cutting area, and constructing a heat capacity rigidity ratio of the cutting area, wherein the heat capacity rigidity ratio is used for representing the sensitivity degree of the cutting area to thermal stress; analyzing the distances of different cutting areas and the lengths of cutting paths in the cutting areas, and constructing the cumulative heat conduction influence degree of the cutting areas, wherein the cumulative heat conduction influence degree is used for representing the remarkable degree of the heat interaction influence of the cut areas on the cut areas; and determining the deformation factor of the cutting area by combining the heat capacity and rigidity ratio and the accumulated heat conduction influence degree, determining the cutting sequence of all the cutting areas of the thin-wall hardware by combining the heat capacity and rigidity ratio, and finishing the laser precise cutting of the thin-wall hardware according to the cutting sequence. Further, the shape of the cutting area is used for determining the area perimeter ratio of the cutting area. Further, the heat capacity rigidity ratio of the cutting area is in positive correlation with the cross section narrowness coefficient of the cutting area, and is in negative correlation with the area circumference ratio of the cutting area, and the cross section narrowness coefficient of the cutting area is used for representing the strength of the heat accumulation effect of the cutting area. Further, the cross-section narrowness coefficient of the cutting area is in negative correlation with the area of the cutting area and in positive correlation with the length of the cutting path in the cutting area. Further, the distance of the different cutting areas is the distance between the geometric centers of the different cutting areas. Further, the cumulative heat transfer impact level of the cut area is the cumulative sum of the heat transfer impact levels of the cut area and all other different cut areas. Further, the method for determining the heat conduction influence degree of the cutting area and all other cutting areas comprises the following steps: The product of the thermal conduction attenuation factor of the cutting area and other different cutting areas and the length of the cutting path in the cutting area is recorded as the thermal conduction influence degree of the target cutting area and the comparison cutting area. For characterizing how fast thermal conduction between the cut area and other cut areas decays. Further, the heat conduction attenuation factor of the cutting area and other different cutting areas is the negative correlation processing result of the distance between the cutting area and other different cutting areas. F